Abstract: A packaging structure for thin die is provided. The packaging structure has a substrate, a thin die, a strengthening layer and an encapsulation body. The thin die is disposed on and electrically connected with the substrate; the strengthening layer is disposed on the thin die; and the encapsulation body is formed on the substrate and covers both the thin die and the strengthening layer. The strengthening layer can bear pressure or stress during the formation of the encapsulation body to protect the thin die. A method for manufacturing the packaging structure for the thin die is further provided to manufacture the above packaging structure for the thin die.

Abstract: A method and system for transferring real-time audio/video stream (AVS) is provided. The method for transferring real-time AVS includes the following steps of: first, receiving a real-time AVS by a server; transforming the real-time AVS into a fragmented media data (FMD) and storing the FMD in a storage module of the server, wherein the FMD comprises a starting-point, an overall fragment information and at least one media fragment (MF); next, generating a segmented media data (SMD) by encapsulating the FMD when the server receives a playback command. The step of generating the SMD comprises encapsulating the starting-point and the overall fragment information into an initial segment information of the SMD. Each playable segment of the SMD has multiple MFs and a segment index recording segment order to indicate each MF. The final step is to transfer the SMD to browser software for playback.

Abstract: In an embodiment, a III-V nitride semiconductor device comprises an AlGaN epitaxial layer and a metal electrode. The AlGaN epitaxial layer is a C-plane n-type or undoped layer, and the AlGaN epitaxial layer has an epitaxial surface consisting of one or more semi-polar planes. The metal electrode is directly formed on the one or more semi-polar planes.

Abstract: A lead frame structure for quad flat no-lead (QFN) package includes a main base, a plurality of terminals and a first metal layer. The main base has a center area for carrying a semiconductor die, and a periphery area surrounding the center area. The plurality of terminals are arranged around the main base. The first metal layer has a first part formed on the periphery area of the main base, and a second part formed on the plurality of terminals. Wherein the main base and the plurality of terminals are formed by a stamping process, and the first metal layer is formed by a plating process before the stamping process.

Abstract: A clamper includes a base, a movable element, a sliding element, a connecting bar, a clamping element and a first elastic element. The movable element is movable in a first direction relative to the base. The sliding element is movable in a second direction relative to the base. The connecting bar connects the movable element and the sliding element. The clamping element sets on the sliding element. The first elastic element includes a terminal setting on the sliding element.

Abstract: An electronic device includes an antenna, a wireless transmitter, a proximity sensor and a controller. The antenna includes a first radiating element and a second radiating element which has a different length than the first radiating element. The wireless transmitter is to send a radio signal to the antenna and the controller is to disable the first radiating element in response to the proximity sensor detecting a body part.

Abstract: A touch projection system includes a light source device, a micromirror device, and an image-capturing device. The micromirror device can provide three reflection directions. The micromirror device can selectively reflect projection light emitted by the light source device in one of the reflection directions to project the reflected projection light onto a screen to form an image. The micromirror device also can reflect image light from the screen in another one of the reflection directions. Further, the micromirror device can reflect the image light from the screen in the other one of the reflection directions, which has a larger deflection angle, to be received by the image-capturing device, for example for determining a touch operation performed on the screen. Thereby, the limitation of structural interference by other components to the image-capturing device is reduced, so that the touch projection system can be assembled in a compact configuration.

Abstract: A container for receiving two materials includes a main body, a controlling member, and a bottle cap. The main body has a head segment, a body segment connected to the head segment and a neck segment formed therebetween. The controlling member has a sealing portion to mate with the neck segment to divide the space within the main body into an upper cavity and a lower cavity. The bottle cap is configured to the head segment. An engaging portion is configured on the inner wall of the bottle cap. A connecting portion is standing on the sealing portion, and an engaging groove is defined on the connecting portion to be engaged with the engaging portion. Accordingly, when the bottle cap is rotated, the controlling member is driven to allow the sealing portion detaching from the neck portion, such that the upper cavity communicates with the lower cavity.

Abstract: An elastomeric sanding block conformable to curved or flat surfaces includes a Shore A hardness ranging from about 30 to about 90, and is made from ethylene-vinyl acetate copolymer, low-density polyethylene or an admixture thereof. The polymer or admixture ranges from about 35 to about 70 percent of the sanding block composition by weight. A blowing agent is present in an amount that ranges from about 1.5 to about 4.5 percent of the composition by weight. The elastomeric sanding block may be formed by combining the polymer or admixture and other components under heat to yield a feedstock, thermoforming the feedstock in a mold to yield a foamed material sheet, and cutting the foamed material sheet.

Abstract: Example implementations relate to enabling a radiating element based on an orientation signal. For example, a method may include receiving at a controller of a computing device an orientation signal from an orientation sensor. The orientation signal corresponds to a first orientation of an antenna element of the computing device. The method may also include enabling via the controller a first radiating element of the antenna element based on the orientation signal. The method may further include disabling via the controller a second radiating element of the antenna element based on the orientation signal.

Abstract: A container for receiving two materials includes a main body, a controlling member, and a bottle cap. The main body has a head segment, a body segment connected to the head segment and a neck segment formed therebetween. The controlling member has a sealing portion to mate with the neck segment to divide the space within the main body into an upper cavity and a lower cavity. The bottle cap is configured to the head segment. An engaging portion is configured on the inner wall of the bottle cap. A connecting portion is standing on the sealing portion, and an engaging groove is defined on the connecting portion to be engaged with the engaging portion. Accordingly, when the bottle cap is rotated, the controlling member is driven to allow the sealing portion detaching from the neck portion, such that the upper cavity communicates with the lower cavity.

Abstract: The present invention relates to a meal top stacking package structure and a method for manufacturing the same, wherein the metal top stacking package structure comprises a metal base including an upper surface and a lower surface, and a die receiver cavity formed in the upper surface; a first chip fixed on the die receiver cavity by a first adhesion layer; a substrate with an upper surface; a second chip fixed on the upper surface of the substrate by a second adhesion layer; and a plurality of connecting components formed on the upper surface of the substrate; wherein the upper surface of the metal base is connected with the substrate by the connecting components. Thereby, the structure and method can enhance heat dissipation and electromagnetic shield of the stacking package structure.

Abstract: A power board and ballast module includes a housing, a power board, a ballast and an electrical connector. The power board is disposed in the housing. The ballast is disposed in the housing and electrically connected to the power board. The electrical connector is disposed in the housing and exposed out of the housing, wherein the power board and the ballast are electrically connected to the electrical connector respectively. Projectors using the power board and ballast module are also provided.

Abstract: An elastomeric sanding block conformable to curved or flat surfaces includes a Shore A hardness ranging from about 30 to about 90, and is made from ethylene-vinyl acetate copolymer, low-density polyethylene or an admixture thereof. The polymer or admixture ranges from about 35 to about 70 percent of the sanding block composition by weight. A blowing agent is present in an amount that ranges from about 1.5 to about 4.5 percent of the composition by weight. The elastomeric sanding block may be formed by combining the polymer or admixture and other components under heat to yield a feedstock, thermoforming the feedstock in a mold to yield a foamed material sheet, and cutting the foamed material sheet.

Abstract: The present invention relates to a multichip stacking package structure and a method for manufacturing the same, wherein the multichip stacking package structure comprises a substrate including a plurality of electrical connecting pad; a first chip with a lower surface stacked on the substrate; a second chip stacked on an upper surface of the first chip by a interlaced reciprocation stacking way; a spacer stacked on an upper surface of the second chip by the interlaced reciprocation stacking way; and third chip stacked on the an upper surface of the spacer by the interlaced reciprocation stacking way, so that a first spacing is formed between an end of the third and an end of the spacer. Thereby, a position of a stress point is changed to reduce a risk of the chip crack during wire bonding.

Abstract: The present invention relates to a multichip stacking package structure and a method for manufacturing the same, wherein the multichip stacking package structure comprises a substrate including a plurality of electrical connecting pad; a first chip with a lower surface stacked on the substrate; a second chip stacked on an upper surface of the first chip by a interlaced reciprocation stacking way; a spacer stacked on an upper surface of the second chip by the interlaced reciprocation stacking way; and third chip stacked on the an upper surface of the spacer by the interlaced reciprocation stacking way, so that a first spacing is formed between an end of the third and an end of the spacer. Thereby, a position of a stress point is changed to reduce a risk of the chip crack during wire bonding.

Abstract: A CMOS analog and audio front-end circuit includes an enhanced analog-to-digital converter (ADC) that achieves a desired signal-to-noise-and-distortion (SNDR) and an analog-front-end transmit (TX) digital-to-analog converter (DAC). The enhanced ADC includes an improved single Op-Amp resonator coupled to a feed-forward loop and can substantially reduce signal transfer function (STF) peaking of the enhanced ADC. The CMOS analog and audio front-end circuit is integrated with a baseband processor.

Abstract: A wire treatment pliers set includes a first clamp body and a second clamp body. The first clamp body includes a first main body, a first winding part and at least one first stripping notch. The at least one first stripping notch is located on the first main body. The second clamp body is pivotally connected to the first clamp body. The second clamp body includes a second main body, a second winding part, and at least one second stripping notch. A position of the second winding part corresponds to the first winding part. The at least one second stripping notch is located on the second main body, and a position of the at least one second stripping notch corresponds to the at least one first stripping notch.

Abstract: The present disclosure provides a system including one or more sensors, a mounting system configured to removeably mount a computing device such that a camera of the computing device is positioned facing an eye of a subject, and a control system. The control system is configured to (a) receive sensor data from the one or more sensors, (b) determine whether the sensor data is indicative of balance instability of the subject, (c) track a position of the eye of the subject to assess vestibular dysfunction, (d) determine whether the camera data is indicative of vestibular dysfunction of the subject, and (e) in response to (i) the sensor data being indicative of balance instability of the subject and/or (ii) the camera data being indicative of vestibular dysfunction of the subject, display an indication of symptoms that are characteristic of a traumatic brain injury or concussion.

Abstract: A touch projection system includes a screen, an image-capturing device, a micromirror device, and a TIR prism disposed in front of the micromirror device. The TIR prism includes an optical path compensation structure or a hollowed channel, so that an image light from the screen, traveling through the TIR prism to be reflected by the micromirror device, can travel through the optical path compensation structure or the hollowed channel to avoid a probable optical path difference on the image light due to traveling through the TIR prism. Thereby, the invention can solve that a distortion may be induced in a touch image formed by the image-capturing device receiving the image light reflected by the micromirror device.