Patents by Inventor Fang Lin

Fang Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9857670
    Abstract: A power board and ballast module includes a housing, a power board, a ballast and an electrical connector. The power board is disposed in the housing. The ballast is disposed in the housing and electrically connected to the power board. The electrical connector is disposed in the housing and exposed out of the housing, wherein the power board and the ballast are electrically connected to the electrical connector respectively. Projectors using the power board and ballast module are also provided.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: January 2, 2018
    Assignees: Qisda Optronics (Suzhou) Co., Ltd., Qisda Corporation
    Inventors: Hsien-Tsung Chiu, Fang-Chieh Lu, Ying-Fang Lin
  • Publication number: 20170368669
    Abstract: An elastomeric sanding block conformable to curved or flat surfaces includes a Shore A hardness ranging fro m about 30 to about 90, and is made from ethylene-vinyl acetate copolymer, low-density polyethylene or an admixture thereof. The polymer or admixture ranges from about 35 to about 70 percent of the sanding block composition by weight. A blowing agent is present in an amount that ranges from about 1.5 to about 4.5 percent of the composition by weight. The elastomeric sanding block may be formed by combining the polymer or admixture and other components under heat to yield a feedstock, thermoforming the feedstock in a mold to yield a foamed material sheet, and cutting the foamed material sheet.
    Type: Application
    Filed: August 15, 2017
    Publication date: December 28, 2017
    Inventor: Bang Fang Lin
  • Patent number: 9847302
    Abstract: Hydroxyl moieties are formed on a surface over a semiconductor substrate. The surfaces are silylized to replace the hydroxyl groups with silyl ether groups, the silyl ether groups being of the form: —OSiR1R2R3, where R1, R2, and R3 are each hydrocarbyl groups comprising at least one carbon atom. Silylation protects the wafers from forming defects through hydrolysis while the wafers are being transported or stored under ambient conditions.
    Type: Grant
    Filed: August 23, 2013
    Date of Patent: December 19, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsiao-Chen Wu, Fang Lin
  • Publication number: 20170354202
    Abstract: A vamp with loop protection eyelets and a manufacture method thereof are disclosed. The vamp comprises a vamp body including a middle part having a notch which functions as a shoe tongue part. The vamp body is one-piece knitted fabric or a sheet-splice-vamp. Strings are projectively fixed on the upper surface of the vamp body. Threads embroider and fix the strings on the vamp body along a path of the length direction of the strings. The strings not only form a pattern on the vamp body but also leave loops on the shoe tongue part. Loops protrude inwards from both side edges of the shoe tongue part. The vamp has ventilation and has good supportability and straightness, is not only esthetic but also can protect feet. Protection eyelets are connected very firmly and do not come off easily. The pattern with a stereoscopic visual effect is formed on the vamp.
    Type: Application
    Filed: October 19, 2016
    Publication date: December 14, 2017
    Inventors: Qinglai CAI, Weixiong SHI, Le CHEN, Yizhen CAI, Fang LIN
  • Publication number: 20170325547
    Abstract: An embroidered vamp process includes the following steps: (1) designing a vamp manufacture drawing by a computer; (2) according to the design drawing of step (1), cutting different pieces of cloth into base fabric of the vamp and a splice component of the vamp respectively by a laser; (3) typesetting the splice component cut in step (2) on the base fabric, then embroidering the splice component on the base fabric according to an embroidery thread pattern of the drawing by an embroidery machine; (4) cutting out the redundant base fabric of the vamp along the edge the splice component by, once again, the laser, forming the vamp of the finished product shoe model. An embroidered vamp comprises a vamp body, said vamp body comprising the base fabric and the splice component, said splice component being embroidered on the surface of base fabric by embroidery thread.
    Type: Application
    Filed: October 19, 2016
    Publication date: November 16, 2017
    Inventors: Qinglai CAI, Weixiong SHI, Le CHEN, Yizhen CAI, Fang LIN
  • Publication number: 20170321842
    Abstract: A mounting bracket having a base plate with a first set of apertures and a second set of apertures formed therein. A mounting plate couplable with one of the first set of apertures and the second set of apertures formed in the base plate. A bracket housing couplable with the base plate and having an inner surface and an outer surface. A retainer assembly coupled with the base plate and adjacent to and abuttingly engaged with the bracket housing.
    Type: Application
    Filed: May 4, 2016
    Publication date: November 9, 2017
    Inventors: Joseph J. Daniels, Edward Oblen, Man Phan, Fang Lin
  • Patent number: 9771015
    Abstract: A ratchet buckle, which is configured to connect a first strap and a second strap, includes a controlling device, an operating device connected to the first strap, a reel passing through the controlling device and the operating device along an axial line, the second strap wound around the reel, at least one ratchet set mounted on the reel, the reel being not rotated relative to the ratchet set, and a pawl device. When the user wants to unwind the second strap from the reel, the user moves and rotates the controlling device smoothly with only one hand thereof; therefore, it's very convenient for the user to operate. The special structure making the ratchet set unidirectionally rotatable, and it doesn't need any further structure, so that it is lighter and has lower cost.
    Type: Grant
    Filed: August 19, 2014
    Date of Patent: September 26, 2017
    Inventor: Fang-Lin Yang
  • Publication number: 20170271251
    Abstract: A semiconductor substrate is disclosed. The semiconductor substrate includes a substrate body having at least an opening formed on a surface thereof, wherein the surface of the substrate body and a wall of the opening are made of an insulating material; and a circuit layer formed on the surface of the substrate body, wherein the circuit layer covers an end of the opening and is electrically insulated from the opening. The opening facilitates to increase the thickness of the insulating structure between the circuit layer and the substrate body of a silicon material to prevent signal degradation when high frequency signals are applied to the circuit layer.
    Type: Application
    Filed: June 2, 2017
    Publication date: September 21, 2017
    Inventors: Bo-Shiang Fang, Ho-Chuan Lin, Chia-Chu Lai, Min-Han Chuang, Li-Fang Lin
  • Patent number: 9732175
    Abstract: Method for preparing a ceramic-polymer nanocomposite is provided. The method includes providing a polymer comprising radicals on a surface thereof; contacting the polymer with a functionalizing agent to form a functionalized polymer; and either (i) grafting a cross-linking agent onto the functionalized polymer to form a graft copolymer, and attaching ceramic nanostructures to the graft copolymer to form a ceramic-polymer nanocomposite, or (ii) grafting a cross-linking agent onto ceramic nanostructures to form modified ceramic nanostructures, and attaching the modified ceramic nanostructures to the functionalized polymer to form a ceramic-polymer nanocomposite. A ceramic-polymer nanocomposite and use of the ceramic-polymer nanocomposite are also provided.
    Type: Grant
    Filed: May 7, 2014
    Date of Patent: August 15, 2017
    Assignee: Nanyang Technological University
    Inventors: Meng-Fang Lin, Pooi See Lee
  • Patent number: 9731403
    Abstract: An elastomeric sanding block conformable to curved or flat surfaces includes a Shore A hardness ranging from about 30 to about 90, and is made from ethylene-vinyl acetate copolymer, low-density polyethylene or an admixture thereof. The polymer or admixture ranges from about 35 to about 70 percent of the sanding block composition by weight. A blowing agent is present in an amount that ranges from about 1.5 to about 4.5 percent of the composition by weight. The elastomeric sanding block may be formed by combining the polymer or admixture and other components under heat to yield a feedstock, thermoforming the feedstock in a mold to yield a foamed material sheet, and cutting the foamed material sheet.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: August 15, 2017
    Assignee: Trade Associates, Inc.
    Inventor: Bang Fang Lin
  • Patent number: 9732194
    Abstract: Methods for forming a graft copolymer of a poly(vinylidene fluoride)-based polymer and at least one type of electrically conductive polymer, wherein the electrically conductive polymer is grafted on the poly(vinylidene fluoride)-based polymer are provided. The methods comprise a) irradiating a poly(vinylidene fluoride)-based polymer with a stream of electrically charged particles; b) forming a solution comprising the irradiated poly(vinylidene fluoride)-based polymer, an electrically conductive monomer and an acid in a suitable solvent; and c) adding an oxidant to the solution to form the graft copolymer. Graft copolymers of a poly(vinylidene fluoride)-based polymer and at least one type of electrically conductive polymer, wherein the electrically conductive polymer is grafted on the poly(vinylidene fluoride)-based polymer, nanocomposite materials comprising the graft copolymer, and multilayer capacitors comprising the nanocomposite material are also provided.
    Type: Grant
    Filed: December 7, 2012
    Date of Patent: August 15, 2017
    Assignee: Nanyang Technological University
    Inventors: Pooi See Lee, Vijay Kumar, Meng-Fang Lin
  • Publication number: 20170194191
    Abstract: An interconnect layout structure having air gaps includes a plurality of air gaps extended along a direction, and at least a first interconnect unit disposed in between the air gaps. The first interconnect unit includes a first conductive line, a first landing mark situated on the first conductive line and a first via structure situated on the first landing mark. The first via structure penetrates the first landing mark and is electrically connected to the first conductive line. And the first landing mark physically separates the air gaps arranged in a straight line.
    Type: Application
    Filed: January 27, 2016
    Publication date: July 6, 2017
    Inventors: Tong-Yu Chen, Chia-Fang Lin
  • Publication number: 20170189496
    Abstract: A method for the treatment and/or the prevention of a disease or a symptom related to dysfunction of regulatory T cell immunomodulation includes administering to a subject in need thereof compositions that regulate regulatory T cell immunomodulatory function, in which the compositions may be prepared by contacting starting materials with phosphorylation pathway-related factors, the agonists or the antagonists thereof. The phosphorylation pathway-related factors are selected from: proto-oncogene protein PIM1 and the coding sequence thereof. The regulation is achieved by regulating the activity of regulators of regulatory T cells selected from the group: FOXP3, IL-2, GITR, CTLA4, and a combination thereof.
    Type: Application
    Filed: March 9, 2017
    Publication date: July 6, 2017
    Applicant: Institut Pasteur of Shanghai, Chinese Academy of Sciences
    Inventors: Bin Li, Zhiyuan Li, Fang Lin, Zhimei Gao, Zuojia Chen, Andy Tsun, Kongchen Li
  • Patent number: 9698090
    Abstract: A semiconductor substrate is disclosed. The semiconductor substrate includes a substrate body having at least an opening formed on a surface thereof, wherein the surface of the substrate body and a wall of the opening are made of an insulating material; and a circuit layer formed on the surface of the substrate body, wherein the circuit layer covers an end of the opening and is electrically insulated from the opening. The opening facilitates to increase the thickness of the insulating structure between the circuit layer and the substrate body of a silicon material to prevent signal degradation when high frequency signals are applied to the circuit layer.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: July 4, 2017
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Bo-Shiang Fang, Ho-Chuan Lin, Chia-Chu Lai, Min-Han Chuang, Li-Fang Lin
  • Publication number: 20170186508
    Abstract: The present invention provides a method for manufacturing a graphene composite film including preparing a zeolite suspension and a graphene oxide suspension containing graphene oxide, reducing the graphene oxide suspension until the graphene oxide is partially reduced to form partially-reduced graphene oxide, followed by adding the zeolite suspension and a surfactant into the partially-reduced graphene oxide suspension to form a composite solution, further reducing the composite solution until the partially-reduced graphene oxide is completely reduced to form graphene, and forming the composite solution into the graphene composite film on a substrate via plasma-enhanced atomizing deposition.
    Type: Application
    Filed: December 29, 2015
    Publication date: June 29, 2017
    Inventor: Chiung-Fang LIN
  • Patent number: 9664991
    Abstract: A projector includes a projector body having a light-permissive aperture, a plurality of lens modules, a lens disassembly sensing module, a light-emitting module and a control module. The lens modules are individually provided for an assembly to the light-permissive aperture. The lens disassembly sensing module is disposed in the projector body and corresponding to the light-permissive aperture. The light-emitting module is disposed in the projector body and configured to emit lights toward the light-permissive aperture. The control module is signally connected to the lens disassembly sensing module and the light-emitting module. The control module is configured to sense, through the lens disassembly sensing module, whether any one of lens modules is being disassembled from the light-permissive aperture and modulate a lighting intensity of the light-emitting module when a lens module being disassembled from the light-permissive aperture is sensed.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: May 30, 2017
    Assignee: Qisda Corporation
    Inventors: Wei-Chun Chang, Ying-Fang Lin
  • Patent number: 9646937
    Abstract: A packaging structure for thin die is provided. The packaging structure has a substrate, a thin die, a strengthening layer and an encapsulation body. The thin die is disposed on and electrically connected with the substrate; the strengthening layer is disposed on the thin die; and the encapsulation body is formed on the substrate and covers both the thin die and the strengthening layer. The strengthening layer can bear pressure or stress during the formation of the encapsulation body to protect the thin die. A method for manufacturing the packaging structure for the thin die is further provided to manufacture the above packaging structure for the thin die.
    Type: Grant
    Filed: August 12, 2014
    Date of Patent: May 9, 2017
    Assignee: Dawning Leading Technology Inc.
    Inventor: Diann-Fang Lin
  • Patent number: 9641908
    Abstract: A method and system for transferring real-time audio/video stream (AVS) is provided. The method for transferring real-time AVS includes the following steps of: first, receiving a real-time AVS by a server; transforming the real-time AVS into a fragmented media data (FMD) and storing the FMD in a storage module of the server, wherein the FMD comprises a starting-point, an overall fragment information and at least one media fragment (MF); next, generating a segmented media data (SMD) by encapsulating the FMD when the server receives a playback command. The step of generating the SMD comprises encapsulating the starting-point and the overall fragment information into an initial segment information of the SMD. Each playable segment of the SMD has multiple MFs and a segment index recording segment order to indicate each MF. The final step is to transfer the SMD to browser software for playback.
    Type: Grant
    Filed: September 13, 2014
    Date of Patent: May 2, 2017
    Assignee: YUAN ZE UNIVERSITY
    Inventors: Chi-Fang Lin, Hao-Ting Wei, Yang-Cheng Chang
  • Publication number: 20170104074
    Abstract: In an embodiment, a III-V nitride semiconductor device comprises an AlGaN epitaxial layer and a metal electrode. The AlGaN epitaxial layer is a C-plane n-type or undoped layer, and the AlGaN epitaxial layer has an epitaxial surface consisting of one or more semi-polar planes. The metal electrode is directly formed on the one or more semi-polar planes.
    Type: Application
    Filed: November 25, 2015
    Publication date: April 13, 2017
    Inventors: Wei-Hung Kuo, Suh-Fang Lin, Kun-Fong Lin, Chia-Lung Tsai
  • Patent number: 9607933
    Abstract: A lead frame structure for quad flat no-lead (QFN) package includes a main base, a plurality of terminals and a first metal layer. The main base has a center area for carrying a semiconductor die, and a periphery area surrounding the center area. The plurality of terminals are arranged around the main base. The first metal layer has a first part formed on the periphery area of the main base, and a second part formed on the plurality of terminals. Wherein the main base and the plurality of terminals are formed by a stamping process, and the first metal layer is formed by a plating process before the stamping process.
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: March 28, 2017
    Assignee: DAWNING LEADING TECHNOLOGY INC.
    Inventor: Diann Fang Lin