Abstract: A vamp with loop protection eyelets and a manufacture method thereof are disclosed. The vamp comprises a vamp body including a middle part having a notch which functions as a shoe tongue part. The vamp body is one-piece knitted fabric or a sheet-splice-vamp. Strings are projectively fixed on the upper surface of the vamp body. Threads embroider and fix the strings on the vamp body along a path of the length direction of the strings. The strings not only form a pattern on the vamp body but also leave loops on the shoe tongue part. Loops protrude inwards from both side edges of the shoe tongue part. The vamp has ventilation and has good supportability and straightness, is not only esthetic but also can protect feet. Protection eyelets are connected very firmly and do not come off easily. The pattern with a stereoscopic visual effect is formed on the vamp.

Abstract: An embroidered vamp process includes the following steps: (1) designing a vamp manufacture drawing by a computer; (2) according to the design drawing of step (1), cutting different pieces of cloth into base fabric of the vamp and a splice component of the vamp respectively by a laser; (3) typesetting the splice component cut in step (2) on the base fabric, then embroidering the splice component on the base fabric according to an embroidery thread pattern of the drawing by an embroidery machine; (4) cutting out the redundant base fabric of the vamp along the edge the splice component by, once again, the laser, forming the vamp of the finished product shoe model. An embroidered vamp comprises a vamp body, said vamp body comprising the base fabric and the splice component, said splice component being embroidered on the surface of base fabric by embroidery thread.

Abstract: An interconnect layout structure, having a plurality of air gaps, includes a substrate having an insulating material disposed thereon and a conductive line disposed in the insulating material and extending along a first direction. The air gaps are formed in the insulating material and are arranged end-to-end along the first direction and immediately adjacent to a same side of the conductive line. A patterned hard mask is disposed on the conductive line and has a sidewall extending along a second direction that is perpendicular to the first direction and passing between the adjacent air gaps from the top view. A via structure is formed on the conductive line and is electrically connected to the conductive line.

Abstract: An electronic device casing can be used in a projector and includes a first casing member and a second casing member. The first casing member includes a first side wall. The first casing member and the second casing member are engaged with each other to form an internal accommodating space. The second casing member includes a second side wall. The first side wall and the second side wall are oppositely disposed to form a narrow passage therebetween. The internal accommodating space is connected to an external space of the electronic device casing through the narrow passage. The narrow passage has a non-straight traveling path. Furthermore, the electronic device can includes an air flow bypass passage near the narrow passage.

Abstract: Aspects generate recommendations in response to messaging content, wherein processors are configured to identify keywords within text content extracted from a received message that are assigned to a topic leaf node within an event taxonomy and a root event node from which the topic leaf node depends; identify a plurality of recommendation items that each match a type of event of the root event node and are linked to the topic node of the identified keyword; determine, for each of the recommendation items, a sender sentiment value as a function of a preference of the sender, and a recipient sentiment value as a function of a preference of the recipient; and present to the sender and the recipient as an event recommendation a subset of the recommendation items that each satisfy a sentiment threshold for the sender sentiment value and the recipient sentiment value.

Abstract: A projector includes a holding casing having a hole structure, a projection lens movably disposed through the hole structure, a containing casing detachably fixed to the holding casing for forming a containing space, an image projection module disposed in the containing space, and a flexible washer. A first engaging structure is formed on an external surface of the projection lens. The flexible washer jackets the projection lens and has first and second ring structures and a connection ring structure formed therebetween. The first engaging structure is engaged with the second engaging structure of the first ring structure for positioning the first ring structure on the projection lens. The second ring structure is clamped between the holding casing and the containing casing for sealing the containing space cooperatively with the connection ring structure and the first ring structure when the containing casing is fixed to the holding casing.

Abstract: A fabrication method of a layer structure for mounting a semiconductor device is provided, which includes the steps of: providing a base material, wherein the base material has a conductive layer having a first surface having a plurality of first conductive elements and an opposite second surface having a plurality of second conductive elements, and a first encapsulant formed on the first surface of the conductive layer for encapsulating the first conductive elements; partially removing the conductive layer to form a circuit layer that electrically connects the first conductive elements and the second conductive elements; and forming a second encapsulant on a bottom surface of the first encapsulant for encapsulating the circuit layer and the second conductive elements, thus reducing the fabrication difficulty and increasing the product yield.

Abstract: An electronic package is provided, which includes: a substrate; an electronic component and a shielding member disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic component and the shielding member; and a metal layer formed on the encapsulant and electrically connected to the shielding member. A portion of a surface of the shielding member is exposed from a side surface of the encapsulant and in contact with the metal layer. As such, the width of the shielding member can be reduced so as to reduce the amount of solder paste used for bonding the shielding member to the substrate, thereby overcoming the conventional drawback of poor solder distribution. The present disclosure further provides a method for fabricating the electronic package.

Abstract: A non-toxic water soluble photosensitive resin composition able to function as a solder mask coating comprises a polymer containing oxazolinyl, a photosensitive monomer, and a photo-initiator. These elements are all water soluble or water dispersible. The polymer containing oxazolinyl and the photosensitive monomer have a plurality of carbon-carbon double bonds. The polymer containing oxazolinyl and the photosensitive monomer are polymerized to form a dense cross-linking network structure when the water soluble photosensitive resin composition is exposed to ultraviolet radiation. A film using the water soluble photosensitive resin composition is also provided.

Abstract: A system includes a cooling device, a memory, and a processor. The cooling device is configured to detect a temperature of a wafer and to provide air to the wafer. The memory is configured to store computer program codes. The processor is configured to execute the computer program codes in the memory to: determine whether the temperature of the wafer meet a predetermined requirement; adjust the temperature of the wafer on condition that the temperature does not meet the predetermined requirement; and control the cooling device to detect the temperature of the wafer again, in order to verify whether an adjusted temperature of the wafer meet predetermined requirement.

Abstract: An elastomeric sanding block conformable to curved or flat surfaces includes a Shore A hardness ranging from about 30 to about 90, and is made from ethylene-vinyl acetate copolymer, low-density polyethylene or an admixture thereof. The polymer or admixture ranges from about 35 to about 70 percent of the sanding block composition by weight. A blowing agent is present in an amount that ranges from about 1.5 to about 4.5 percent of the composition by weight. The elastomeric sanding block may be formed by combining the polymer or admixture and other components under heat to yield a feedstock, thermoforming the feedstock in a mold to yield a foamed material sheet, and cutting the foamed material sheet.

Abstract: A fabrication method of a layer structure for mounting a semiconductor device is provided, which includes the steps of: providing a base material, wherein the base material has a conductive layer having a first surface having a plurality of first conductive elements and an opposite second surface having a plurality of second conductive elements, and a first encapsulant formed on the first surface of the conductive layer for encapsulating the first conductive elements; partially removing the conductive layer to form a circuit layer that electrically connects the first conductive elements and the second conductive elements; and forming a second encapsulant on a bottom surface of the first encapsulant for encapsulating the circuit layer and the second conductive elements, thus reducing the fabrication difficulty and increasing the product yield.

Abstract: An elastomeric sanding block conformable to curved or flat surfaces includes a Shore A hardness ranging from about 30 to about 90, and is made from ethylene-vinyl acetate copolymer, low-density polyethylene or an admixture thereof. The polymer or admixture ranges from about 35 to about 70 percent of the sanding block composition by weight. A blowing agent is present in an amount that ranges from about 1.5 to about 4.5 percent of the composition by weight. The elastomeric sanding block may be formed by combining the polymer or admixture and other components under heat to yield a feedstock, thermoforming the feedstock in a mold to yield a foamed material sheet, and cutting the foamed material sheet.

Abstract: A three-dimensional contour scanning device including an image sensing element, a light source and a single polarity element is provided. The light source is used for emitting a projection light to a to-be-scanned object through a projection optical path. The projection light reflected from the to-be-scanned object becomes an imaging light further reflected to the image sensing element through an image-formed optical path. The single polarity element is disposed on the projection optical path and the image-formed optical path.

Abstract: A semiconductor packaging structure and a manufacturing method for the same are disclosed. The semiconductor packaging structure includes a chip, a dielectric layer and a plurality of redistribution circuit layers. The chip has a plurality of connection pads. The dielectric layer is disposed on the chip and defined with a plurality of containers therein. The connection pads are exposed from the containers, respectively. The redistribution circuit layers are disposed within the containers and electrically connected with the connection pads, respectively. Via these arrangements, the bonding surfaces between the redistribution circuit layers and the dielectric layer can be increased.

Abstract: A meal top stacking package structure and a method for manufacturing the same are provided, wherein the metal top stacking package structure includes a metal base including an upper surface and a lower surface, and a die receiver cavity formed in the upper surface; a first chip fixed on the die receiver cavity by a first adhesion layer; a substrate with an upper surface; a second chip fixed on the upper surface of the substrate by a second adhesion layer; and a plurality of connecting components formed on the upper surface of the substrate; wherein the upper surface of the metal base is connected with the substrate by the connecting components. Thereby, the structure and method can enhance heat dissipation and electromagnetic shield of the stacking package structure.

Abstract: Disclosed is a system for transferring real-time audio/video stream. The system comprises a mobile device, a server and a client terminal. The mobile device comprises a recording module, a fragmented media data (FMD) codec, a segmented media data (SMD) codec and a wireless communication module. The recording module records an event on the scene and generates a real-time video stream. The FMD codec encodes the real-time video stream into fragmented media data comprising a start fragment information, at least one media fragment and a media fragment (MF) random access point. The SMD codec directly segments the fragmented media data into a plurality of segmented media data, which are a start segment and at least one play segment. The SMD codec automatically and sequentially transmits the segmented media data to the server. Finally, the server pushes the segmented media data to the client terminal for play through a browser.

Abstract: A method for manufacturing a graphene composite film includes preparing a zeolite suspension containing zeolite nanocrystals with a concentration of 50-100 ppm and with a particle size of 50-80 nm. The zeolite suspension has a pH value of 11-13. A graphene oxide suspension containing graphene oxide with a concentration of 50-200 ppm is mixed with the zeolite suspension to form a composite solution. The composite solution is transferred into a 15° C. water bath when a color of the composite solution turns from brownish-yellow into deep brown. A surfactant is added into the composite solution in the 15° C. water bath. The composite solution is then sonicated for 5-30 minutes and removed out of the 15° C. water bath, with the color of the composite solution turning from deep brown into black. The composite solution is further processed to form a graphene composite film having not more than 5 layers.

Abstract: Provided herein are methods, systems and kits for stratification of risk of disease occurrence of a sample obtained from a subject by combining two or more feature spaces to improve individualization of subject management.

Abstract: A power board and ballast module includes a housing, a power board, a ballast and an electrical connector. The power board is disposed in the housing. The ballast is disposed in the housing and electrically connected to the power board. The electrical connector is disposed in the housing and exposed out of the housing, wherein the power board and the ballast are electrically connected to the electrical connector respectively. Projectors using the power board and ballast module are also provided.