Patents by Inventor Fei-Gwo Tsai
Fei-Gwo Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11940737Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.Type: GrantFiled: May 7, 2021Date of Patent: March 26, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Hsueh-Yi Chung, Yung-Cheng Chen, Fei-Gwo Tsai, Chi-Hung Liao, Shih-Chi Fu, Wei-Ti Hsu, Jui-Ping Chuang, Tzong-Sheng Chang, Kuei-Shun Chen, Meng-Wei Chen
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Patent number: 11150558Abstract: A developing method is provided. The developing method includes rotating a wafer. The developing method also includes dispensing, through a first nozzle, a developer solution onto the rotated wafer through a first nozzle at a first rotating speed. The developing method further includes dispensing, through a second nozzle, a rinse solution onto the rotated wafer through a second nozzle at a second rotating speed. The second rotating speed is less than the first rotating speed. In addition, the developing method includes simultaneously moving the first nozzle and the second nozzle during either the dispensing of the developer solution or the dispensing of the rinse solution.Type: GrantFiled: April 15, 2020Date of Patent: October 19, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yi-Rem Chen, Ming-Shane Lu, Chung-Hao Chang, Jui-Ping Chuang, Li-Kong Turn, Fei-Gwo Tsai
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Publication number: 20210263425Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.Type: ApplicationFiled: May 7, 2021Publication date: August 26, 2021Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Hsueh-Yi CHUNG, Yung-Cheng CHEN, Fei-Gwo TSAI, Chi-Hung LIAO, Shih-Chi FU, Wei-Ti HSU, Jui-Ping CHUANG, Tzong-Sheng CHANG, Kuei-Shun CHEN, Meng-Wei CHEN
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Patent number: 11003091Abstract: A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.Type: GrantFiled: January 10, 2020Date of Patent: May 11, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Hsueh-Yi Chung, Yung-Cheng Chen, Fei-Gwo Tsai, Chi-Hung Liao, Shih-Chi Fu, Wei-Ti Hsu, Jui-Ping Chuang, Tzong-Sheng Chang, Kuei-Shun Chen, Meng-Wei Chen
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Publication number: 20200241421Abstract: A developing method is provided. The developing method includes rotating a wafer. The developing method also includes dispensing, through a first nozzle, a developer solution onto the rotated wafer through a first nozzle at a first rotating speed. The developing method further includes dispensing, through a second nozzle, a rinse solution onto the rotated wafer through a second nozzle at a second rotating speed. The second rotating speed is less than the first rotating speed. In addition, the developing method includes simultaneously moving the first nozzle and the second nozzle during either the dispensing of the developer solution or the dispensing of the rinse solution.Type: ApplicationFiled: April 15, 2020Publication date: July 30, 2020Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yi-Rem CHEN, Ming-Shane LU, Chung-Hao CHANG, Jui-Ping CHUANG, Li-Kong TURN, Fei-Gwo TSAI
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Publication number: 20200150546Abstract: A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.Type: ApplicationFiled: January 10, 2020Publication date: May 14, 2020Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Hsueh-Yi CHUNG, Yung-Cheng CHEN, Fei-Gwo TSAI, Chi-Hung LIAO, Shih-Chi FU, Wei-Ti HSU, Jui-Ping CHUANG, Tzong-Sheng CHANG, Kuei-Shun CHEN, Meng-Wei CHEN
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Patent number: 10627718Abstract: A developing method comprises steps as follows. A wafer is rotated. A developer solution is dispensed onto the rotated wafer through a first nozzle. The first nozzle is moved back and forth between a first position and a second position, in which moving the first nozzle back and forth is performed such that the first nozzle moving forward to the second position is reversed at the second position and that the first nozzle moving forward to the first position is reversed at the first position, and the first position and the second position are directly over the wafer, and the developer solution is dispensed through the first nozzle when moving the first nozzle back and forth between the first position and the second position.Type: GrantFiled: October 15, 2018Date of Patent: April 21, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yi-Rem Chen, Ming-Shane Lu, Chung-Hao Chang, Jui-Ping Chuang, Li-Kong Turn, Fei-Gwo Tsai
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Patent number: 10534272Abstract: A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.Type: GrantFiled: September 10, 2018Date of Patent: January 14, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Hsueh-Yi Chung, Yung-Cheng Chen, Fei-Gwo Tsai, Chi-Hung Liao, Shih-Chi Fu, Wei-Ti Hsu, Jui-Ping Chuang, Tzong-Sheng Chang, Kuei-Shun Chen, Meng-Wei Chen
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Publication number: 20190049848Abstract: A developing method comprises steps as follows. A wafer is rotated. A developer solution is dispensed onto the rotated wafer through a first nozzle. The first nozzle is moved back and forth between a first position and a second position, in which moving the first nozzle back and forth is performed such that the first nozzle moving forward to the second position is reversed at the second position and that the first nozzle moving forward to the first position is reversed at the first position, and the first position and the second position are directly over the wafer, and the developer solution is dispensed through the first nozzle when moving the first nozzle back and forth between the first position and the second position.Type: ApplicationFiled: October 15, 2018Publication date: February 14, 2019Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yi-Rem CHEN, Ming-Shane LU, Chung-Hao CHANG, Jui-Ping CHUANG, Li-Kong TURN, Fei-Gwo TSAI
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Publication number: 20190027392Abstract: A substrate support apparatus includes a housing and a plurality of spherical supports. The housing has a top surface, the top surface including a plurality of openings. The housing is configured to position the plurality of spherical supports within the plurality of openings so that topmost surfaces of the plurality of spherical supports are arranged in a plane above the top surface. A spherical support of the plurality of spherical supports is rotatable within the housing.Type: ApplicationFiled: October 3, 2017Publication date: January 24, 2019Inventors: Yueh Lin YANG, Chi-Hung LIAO, Fei-Gwo TSAI
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Publication number: 20190004436Abstract: A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.Type: ApplicationFiled: September 10, 2018Publication date: January 3, 2019Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Hsueh-Yi CHUNG, Yung-Cheng CHEN, Fei-Gwo TSAI, Chi-Hung LIAO, Shih-Chi FU, Wei-Ti HSU, Jui-Ping CHUANG, Tzong-Sheng CHANG, Kuei-Shun CHEN, Meng-Wei CHEN
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Patent number: 10101662Abstract: A developing method includes rotating a wafer. A developer solution is dispensed onto the rotated wafer through a first nozzle. The first nozzle is moved from a first position to a second position. The first position and the second position are over the wafer and within a perimeter of the wafer when viewed from a top of the wafer. The developer solution is dispensed through the first nozzle when moving the first nozzle from the first position to the second position. The first nozzle is moved back from the second position to the first position immediately after the first nozzle is moved from the first position to the second position. The developer solution is dispensed through the first nozzle when moving the first nozzle from the second position to the first position.Type: GrantFiled: August 14, 2017Date of Patent: October 16, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yi-Rem Chen, Ming-Shane Lu, Chung-Hao Chang, Jui-Ping Chuang, Li-Kong Turn, Fei-Gwo Tsai
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Patent number: 10073354Abstract: A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.Type: GrantFiled: May 7, 2015Date of Patent: September 11, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Hsueh-Yi Chung, Yung-Cheng Chen, Fei-Gwo Tsai, Chi-Hung Liao, Shih-Chi Fu, Wei-Ti Hsu, Jui-Ping Chuang, Tzong-Sheng Chang, Kuei-Shun Chen, Meng-Wei Chen
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Patent number: 9908201Abstract: Systems and methods are provided for edge bead removal. A laser beam of approximately a wavelength is received. The laser beam is delivered along a predetermined beam path. The laser beam is projected on an edge portion of a wafer for edge bead removal.Type: GrantFiled: April 22, 2014Date of Patent: March 6, 2018Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Chun-Hao Chang, Hsueh-Yi Chung, Shang-Yun Huang, Jui-Ping Chuang, Li-Kong Turn, Fei-Gwo Tsai
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Publication number: 20170343899Abstract: A developing method includes rotating a wafer. A developer solution is dispensed onto the rotated wafer through a first nozzle. The first nozzle is moved from a first position to a second position. The first position and the second position are over the wafer and within a perimeter of the wafer when viewed from a top of the wafer. The developer solution is dispensed through the first nozzle when moving the first nozzle from the first position to the second position. The first nozzle is moved back from the second position to the first position immediately after the first nozzle is moved from the first position to the second position. The developer solution is dispensed through the first nozzle when moving the first nozzle from the second position to the first position.Type: ApplicationFiled: August 14, 2017Publication date: November 30, 2017Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yi-Rem CHEN, Ming-Shane LU, Chung-Hao CHANG, Jui-Ping CHUANG, Li-Kong TURN, Fei-Gwo TSAI
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Patent number: 9733568Abstract: A tool and a method of developing are provided. In various embodiments, the method of developing includes rotating a wafer at a first rotating speed. The method further includes dispensing a developer solution onto the wafer at the first rotating speed by a first nozzle above the wafer, wherein the first nozzle moves back and forth along a path during dispensing the developer solution. The method further includes rotating the wafer at a second rotating speed to spread the developer solution onto the wafer uniformly. The method further includes dispensing a rinse solution onto the wafer at the second rotating speed by a second nozzle above the wafer.Type: GrantFiled: February 25, 2014Date of Patent: August 15, 2017Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yi-Rem Chen, Ming-Shane Lu, Chung-Hao Chang, Jui-Ping Chuang, Li-Kong Turn, Fei-Gwo Tsai
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Patent number: 9618855Abstract: The present disclosure provides a method that includes capturing a first image of a mask in a first exposure apparatus using a first exposure source and a first imaging sensor; capturing a second image of the mask in a second exposure apparatus using a second exposure source and a second imaging sensor; comparing the first image of the mask and the second image of the mask for a difference therebetween; and determining an action according to the difference.Type: GrantFiled: February 11, 2013Date of Patent: April 11, 2017Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Fei-Gwo Tsai, Bo-Tsun Liu, Chieh-Huan Ku
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Patent number: 9466101Abstract: Among other things, systems and techniques are provided for detecting defects on a wafer based upon non-correctable error data yielded from a scan of the wafer to determine a topology of the wafer. The non-correctable error data is reconstructed to generate a non-correctable error image map, which is transformed to generate a projection. In some embodiments, the non-correctable error image map is transformed via a feature extraction transform such as a Hough transform or a Radon transform. In some embodiments, the projection is compared to a set of rules to identify a signature in the non-correctable error image map indicative of a defect.Type: GrantFiled: July 25, 2013Date of Patent: October 11, 2016Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDInventors: Chun-Hsien Lin, Liu Bo-Tsun, Chin-Ti Ko, Wu Cheng-Hung, Kuo-Hung Chao, Peng Jui-Chun, Fei-Gwo Tsai, Heng-Hsin Liu, Jong-I Mou
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Publication number: 20160124323Abstract: A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.Type: ApplicationFiled: May 7, 2015Publication date: May 5, 2016Inventors: Hsueh-Yi CHUNG, Yung-Cheng CHEN, Fei-Gwo TSAI, Chi-Hung LIAO, Shih-Chi FU, Wei-Ti HSU, Jui-Ping CHUANG, Tzong-Sheng CHANG, Kuei-Shun CHEN, Meng-Wei CHEN
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Patent number: 9188876Abstract: A method of determining overlay error. The method includes transferring a pattern from a reticle to a wafer and selecting a first set of data points to measure the positional difference between features on the reticle and features on the wafer. The method also includes determining a second set of data points characteristic of the first set of data points but containing fewer data points. A control system for using the second set of data points to dynamically adjust the position of the reticle.Type: GrantFiled: February 7, 2012Date of Patent: November 17, 2015Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yung-Yao Lee, Sophia Wang, Fei-Gwo Tsai, Heng-Hsin Liu