Patents by Inventor Feng Chen

Feng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12232630
    Abstract: An extendable and retractable sofa armrest assembly includes, a fixed inner panel for sofa attachment, a movable outer panel parallel and spaced on the sides, and an extendable and retractable assembly between them. The extendable and retractable assembly includes interconnected rotational rods, allowing the movable outer panel to switch between folded and open positions. An armrest cover wraps both panels, creating a flexible support portion. In use, the outer panel is open, tensioning the support. In a packed state, the outer panel draws close to the fixed panel, compressing the assembly.
    Type: Grant
    Filed: September 7, 2023
    Date of Patent: February 25, 2025
    Assignee: ANJI QIANYUAN FURNITURE CO., LTD.
    Inventor: Feng Chen
  • Patent number: 12235586
    Abstract: Impurities in a liquefied solid fuel utilized in a droplet generator of an extreme ultraviolet photolithography system are removed from vessels containing the liquefied solid fuel. Removal of the impurities increases the stability and predictability of droplet formation which positively impacts wafer yield and droplet generator lifetime.
    Type: Grant
    Filed: August 7, 2023
    Date of Patent: February 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng-Hao Lai, Ming-Hsun Tsai, Hsin-Feng Chen, Wei-Shin Cheng, Yu-Kuang Sun, Cheng-Hsuan Wu, Yu-Fa Lo, Shih-Yu Tu, Jou-Hsuan Lu, Shang-Chieh Chien, Li-Jui Chen, Heng-Hsin Liu
  • Patent number: 12234282
    Abstract: The invention provides compositions and methods for treating optic neuropathic disorders.
    Type: Grant
    Filed: May 16, 2023
    Date of Patent: February 25, 2025
    Assignee: The Schepens Eye Research Institute, Inc.
    Inventors: Dong Feng Chen, Ji Min, Kin-Sang Cho
  • Publication number: 20250061534
    Abstract: One embodiment provides a parallel processor comprising a hardware scheduler to schedule pipeline commands for compute operations to one or more of multiple types of compute units, a plurality of processing resources including a first sparse compute unit configured for input at a first level of sparsity and hybrid memory circuitry including a memory controller, a memory interface, and a second sparse compute unit configured for input at a second level of sparsity that is greater than the first level of sparsity.
    Type: Application
    Filed: August 29, 2024
    Publication date: February 20, 2025
    Applicant: Intel Corporation
    Inventors: Eriko Nurvitadhi, Balaji Vembu, Nicolas C. Galoppo Von Borries, Rajkishore Barik, Tsung-Han Lin, Kamal Sinha, Nadathur Rajagopalan Satish, Jeremy Bottleson, Farshad Akhbari, Altug Koker, Narayan Srinivasa, Dukhwan Kim, Sara S. Baghsorkhi, Justin E. Gottschlich, Feng Chen, Elmoustapha Ould-Ahmed-Vall, Kevin Nealis, Xiaoming Chen, Anbang Yao
  • Publication number: 20250062160
    Abstract: A method of forming a metal interconnect in a semiconductor structure includes performing a barrier layer deposition process to deposit a barrier layer within an opening formed through a dielectric layer, performing a liner deposition process to deposit a liner layer on the barrier layer, performing a metal treatment process to implant metal dopants into a surface of the liner layer, and performing a gap fill process to form a metal interconnect on the metal treated surface of the liner layer within the opening.
    Type: Application
    Filed: June 20, 2024
    Publication date: February 20, 2025
    Inventors: Ge QU, Zhiyuan WU, Jiajie CEN, Feng CHEN, Kevin KASHEFI, Chengyu LIU
  • Patent number: 12230595
    Abstract: A method of forming an integrated circuit structure includes forming a patterned passivation layer over a metal pad, with a top surface of the metal pad revealed through a first opening in the patterned passivation layer, and applying a polymer layer over the patterned passivation layer. The polymer layer is substantially free from N-Methyl-2-pyrrolidone (NMP), and comprises aliphatic amide as a solvent. The method further includes performing a light-exposure process on the polymer layer, performing a development process on the polymer layer to form a second opening in the polymer layer, wherein the top surface of the metal pad is revealed to the second opening, baking the polymer, and forming a conductive region having a via portion extending into the second opening.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: February 18, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Da Cheng, Yung-Ching Chao, Chun Kai Tzeng, Cheng Jen Lin, Chin Wei Kang, Yu-Feng Chen, Mirng-Ji Lii
  • Publication number: 20250051458
    Abstract: Described are methods for the treatment of disorders associated with microglial activation, including neurodegenerative diseases and immunomodulatory diseases, particularly immunomodulatory diseases of the eye. Generally, the methods include administering a therapeutically effective amount of an IGF1 or IGF1R antibody or antigen binding fragment thereof, or an IGF1R agonist, as described herein, to a subject who is in need of, or who has been determined to be in need of, such treatment.
    Type: Application
    Filed: May 31, 2022
    Publication date: February 13, 2025
    Inventor: Dong Feng Chen
  • Publication number: 20250045573
    Abstract: The disclosure relates to decimal-bit network quantization of CNN models.
    Type: Application
    Filed: March 3, 2022
    Publication date: February 6, 2025
    Inventors: Anbang YAO, Yikai WANG, Zhaole SUN, Yi YANG, Feng CHEN, Zhuo WANG, Shandong WANG, Yurong CHEN
  • Publication number: 20250046667
    Abstract: A method includes forming a device die including forming integrated circuits on a semiconductor substrate; and forming a thermally conductive pillar extending into the semiconductor substrate. A cooling medium is attached over and contacting the semiconductor substrate to form a package, wherein the cooling medium is thermally coupled to the thermally conductive pillar.
    Type: Application
    Filed: October 6, 2023
    Publication date: February 6, 2025
    Inventors: Tsung-Chieh Hsiao, Ke-Gang Wen, Chih-Pin Chiu, Hsin-Feng Chen, Yu-Bey Wu, Liang-Wei Wang, Dian-Hau Chen
  • Patent number: 12215703
    Abstract: The present disclosure relates to air assemblies having an inflation, a deflation, and a closed state for use with inflatable products, such as air mattresses. Specifically, the present disclosure relates to air assemblies where the configuration of the air assembly can be changed manually by a user by operating a directional control valve to inflate, deflate, or close the inflatable product. The directional control valve may also activate a pump in the inflation and deflation states and deactivate the pump in the closed state.
    Type: Grant
    Filed: October 25, 2023
    Date of Patent: February 4, 2025
    Assignee: Intex Marketing Ltd.
    Inventors: Zhi Xiong Huang, Feng Chen, Huai Tian Wang, Yaw Yuan Hsu
  • Patent number: 12213732
    Abstract: Methods, systems, and devices are provided for assessing visual function, especially in animals. For example, a device can be used for assessing visual functions, such as PLR and OMR, in animals that includes a visual stimulus unit. The device can also include one or more input devices that include at least one camera that is configured to monitor movement of the test subject and a processor that is configured to analyze the movement of the test subject taken by the camera and to assess visual functions of the test subject. The device can be used in a system including a designated general location for the test subject in which the test subject can see the visual stimulus unit and move freely while being monitored by the camera.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: February 4, 2025
    Assignee: The Schepens Eye Research Institute, Inc.
    Inventors: Dong Feng Chen, Gang Luo, Cong Shi, Kin-Sang Cho
  • Publication number: 20250031929
    Abstract: A cleaning system and a cleaning method are provided. The cleaning system includes a main body, an air suctioning device, a light source, an optical sensor, a memory and a processing unit. The air suctioning device includes an air flow passage and a fan-motor assembly that is disposed in the air flow passage and generates a suction force to suction outside air through the air flow passage. The light source emit light to the air flow passage. The optical sensor captures a plurality of successive image frames from the air flow passage. The processing unit is configured to: obtain first and second image frames from the successive image frames; compare the first image frame with the second image frame to identify dust particles; obtain a particle feature of the dust particles; and determine a current cleanness condition according to the particle feature.
    Type: Application
    Filed: October 14, 2024
    Publication date: January 30, 2025
    Inventors: SHIH-FENG CHEN, HAN-LIN CHIANG, NING SHYU
  • Publication number: 20250036021
    Abstract: An attenuated phase-shifting mask (APSM) includes a substrate, a multi-layer structure, a capping layer and an absorber layer. The substrate has a first side and a second side opposite to the first side. The multi-layer structure is disposed over the first side of the substrate. The capping layer is disposed over the multi-layer structure. The absorber layer is disposed over a portion of the capping layer. The absorber layer includes a first material and a second material different from the first material. A thickness of the absorber layer is between approximately 30 nm and approximately 65 nm. A refractive index (n) of the absorber layer is between approximately 0.860 and approximately 0.945. An extinction coefficient (k) of the absorber layer is between approximately 0.070 and approximately 0.015.
    Type: Application
    Filed: July 28, 2023
    Publication date: January 30, 2025
    Inventors: CHIEN-MIN LEE, YEN-LIANG CHEN, SHY-JAY LIN, LEE-FENG CHEN, KUO LUN TAI
  • Publication number: 20250031988
    Abstract: A method and system for extracting a target signal based on maximum correlated kurtosis deconvolution are provided, which relate to a field of signal processing. The method includes: obtaining a microwave signal of a brain of a subject to be tested; filtering the microwave signal by using maximum correlated kurtosis deconvolution to obtain a filtered signal; performing mode decomposition on the filtered signal by using a complete ensemble empirical mode decomposition with adaptive noise to obtain a target response signal; and performing image reconstruction on the target response signal by using a delay sum beamforming to obtain a target bleeding image.
    Type: Application
    Filed: July 27, 2023
    Publication date: January 30, 2025
    Inventors: Ming Yu, Qinwei Li, Feng Chen, Hang Wu, Guang Zhang
  • Patent number: 12211743
    Abstract: Methods of forming devices comprise forming a dielectric layer on a substrate, the dielectric layer comprising at least one feature defining a gap including sidewalls and a bottom. A self-assembled monolayer (SAM) is formed on the bottom of the gap, and a barrier layer is formed on the SAM before selectively depositing a metal liner on the barrier layer. The SAM is removed after selectively depositing the metal liner on the barrier layer.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: January 28, 2025
    Assignee: Applied Materials, Inc.
    Inventors: Ge Qu, Zhiyuan Wu, Feng Chen, Carmen Leal Cervantes, Yong Jin Kim, Kevin Kashefi, Xianmin Tang, Wenjing Xu, Lu Chen, Tae Hong Ha
  • Publication number: 20250028424
    Abstract: This disclosure provides an icon splicing method and related device. In this method, a terminal device may display a first icon, and display a second icon in response to an operation of triggering to splice the first icon; display, in response to an operation of selecting the second icon and the first icon for splicing, options of a plurality of functions corresponding to the second icon; and display, in response to an operation of selecting an option of a second function, a spliced icon of the first icon and the second icon. The second function includes one or more of the plurality of functions corresponding to the second icon. The spliced icon has a function of supporting linkage between a first function and the second function. The first function includes one or more of a plurality of functions corresponding to the first icon.
    Type: Application
    Filed: December 9, 2022
    Publication date: January 23, 2025
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Li Zhang, Wanyi Yang, Feng Chen, Yuan Cao
  • Publication number: 20250029874
    Abstract: Provided are methods of forming vias with decreased resistance by selectively depositing a barrier layer on an insulating layer and not on a metallic surface. Some embodiments of the disclosure utilize a planar hydrocarbon to form a blocking layer on metallic surfaces. Deposition is performed to selectively deposit on the unblocked insulating surfaces.
    Type: Application
    Filed: October 8, 2024
    Publication date: January 23, 2025
    Applicant: Applied Materials, Inc.
    Inventors: Roey Shaviv, Suketu Arun Parikh, Feng Chen, Lu Chen
  • Publication number: 20250022750
    Abstract: Embodiments of the disclosure provide methods of forming interconnect structures in the manufacture of microelectronic devices. In one or more embodiments, microelectronic devices described herein comprise at least one top interconnect structure that is interconnected to at least one bottom interconnect structure. Embodiments of the disclosure relate to methods of improving barrier layer and metal liner properties in the interconnect structures without increasing capacitance and/or damaging other layers. In some embodiments, the barrier layer is treated with microwave radiation. The treatment process can be implemented in a processing tool including a modular high-frequency emission source.
    Type: Application
    Filed: June 25, 2024
    Publication date: January 16, 2025
    Applicant: Applied Materials, Inc.
    Inventors: Shinjae Hwang, Yoon Ah Shin, Feng Chen, Bencherki Mebarki, Joung Joo Lee, Xianmin Tang
  • Publication number: 20250021046
    Abstract: An adapter is installed on a cartridge detachably disposed on a main body of an image forming apparatus. The main body includes a first conductive contact and a protective structure. The protective structure is disposed on a rear frame of the main body. The protective structure includes a protective element. When the cartridge is not inserted into the main body, the protective element is in a first position to protect the first conductive contact. The cartridge includes a housing, an accommodation part, and a second conductive contact. The accommodation part is disposed on the housing. The second conductive contact is used to electrically connect with the first conductive contact. The adapter includes a pressing element that is used to cooperate with the protective structure.
    Type: Application
    Filed: July 9, 2024
    Publication date: January 16, 2025
    Inventors: Shujia HOU, Feng CHEN, Shun QIAN
  • Patent number: D1059483
    Type: Grant
    Filed: September 22, 2022
    Date of Patent: January 28, 2025
    Assignee: Yuyao Ruifeng Tool Factory
    Inventor: Feng Chen