Abstract: An electromagnetic induction hub includes a first disc having a first magnet, a second disc having a second magnet, a coil disc formed between the first disc and the second disc, a bearing penetrates the first disc, the second disc and the coil disc.

Abstract: An electronic device package and a method for manufacturing an electronic device package are provided. The electronic device package includes electronic device structure which includes a first electronic device and a first encapsulant, a second electronic device, and a second encapsulant. The first encapsulant encapsulates the first electronic device. The second electronic device is adjacent to the electronic device structure. The second encapsulant encapsulates the electronic device structure and the second electronic device. A first extension line along a lateral surface of the first electronic device and a second extension line along a lateral surface of the first encapsulant define a first angle, the second extension line along the lateral surface of the first encapsulant and a third extension line along a lateral surface of the second electronic device define a second angle, and the first angle is different from the second angle.

Abstract: A basic structural body for constructing heat dissipation device and a heat dissipation device are disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed in a more flexible manner.

Abstract: According to various embodiments, a collimator includes a substrate defining a plurality of channels through the substrate. The substrate includes a first surface and a second surface opposite the first surface. Each of the channels includes a first aperture exposed from the first surface, a second aperture between the first surface and the second surface, and a third aperture exposed from the second surface. The first aperture and the third aperture are larger than the second aperture.

Abstract: The present disclosure provides an optical assembly and a method of using an optical assembly. The optical assembly includes a carrier, a filter module on a primary surface of the carrier and disposed on a predetermined optical path, wherein the filter module includes a plurality of filter elements corresponding to a plurality of beams of different channels, a focal length adjuster disposed on the predetermined optical path, wherein at least a focal length of one of the plurality of beams is altered by the focal length adjuster, and a receiver extension configured to receive the plurality of beams via a plurality of sensing areas respectively at a receiving surface, wherein a beam size of each beams at the receiving surface is less than an area of each of the corresponding sensing areas.

Abstract: The present invention discloses a noise reduction touch light adjustment device including a light adjustment film, a capacitive touch panel, a noise reduction film, a glass substrate, a control circuit module, and an alternating current (AC) transformer. The noise reduction film is disposed between the light adjustment film and the capacitive touch panel to lower noise inputted from the AC transformer into the light adjustment film such that the capacitive touch panel is ensured to be operated precisely.

Abstract: A system performs the operations of a neural network agent and a circuit simulator for analog circuit sizing. The system receives an input indicating a specification of an analog circuit and design parameters. The system iteratively searches a design space until a circuit size is found to satisfy the specification and the design parameters. In each iteration, the neural network agent calculates measurement estimates for random sample generated in a trust region, which is a portion of the design space. Based on the measurement estimate, the system identifies a candidate size that optimizes a value metric. The circuit simulator receives the candidate size and generates a simulation measurement. The system calculates updates to weights of the neural network agent and the trust region for a next iteration based on, at least in part, the simulation measurement.

Abstract: A semiconductor device package comprises a semiconductor device, a first encapsulant surrounding the semiconductor device, a second encapsulant covering the semiconductor device and the first encapsulant, and a redistribution layer extending through the second encapsulant and electrically connected to the semiconductor device.

Abstract: A method of manufacturing a heat dissipation device is disclosed. The heat dissipation device manufactured with the method includes two titanium metal sheets and a metal mesh. According to the method, the two titanium metal sheets and the metal mesh are subjected to a surface treatment, so that surface of any one of the titanium metal sheets and the metal mesh is modified to form a hydrophilic layer. With these arrangements, the titanium metal material can be freely plastically deformed and possess a capillary force, and the titanium metal sheet can therefore be used in place of the conventional copper sheet to serve as a material for making heat dissipation devices. The heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.

Abstract: A semiconductor device package comprises a semiconductor device, a first encapsulant surrounding the semiconductor device, a second encapsulant covering the semiconductor device and the first encapsulant, and a redistribution layer extending through the second encapsulant and electrically connected to the semiconductor device.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a dielectric layer. The semiconductor device package further includes an antenna structure disposed in the dielectric layer. The semiconductor device package further includes a semiconductor device disposed on the dielectric layer. The semiconductor device package further includes an encapsulant covering the semiconductor device. The semiconductor device package further includes a conductive pillar having a first portion and a second portion. The first portion surrounded by the encapsulant and the second portion embedded in the dielectric layer.

Abstract: A method of manufacturing a heat dissipation device is disclosed. The heat dissipation device manufactured with the method includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.

Abstract: A semiconductor heat dissipation structure includes a first semiconductor device including a first active surface and a first back surface opposite to the first active surface, a second semiconductor device including a second active surface and a second back surface opposite to the second active surface, a first heat conductive layer embedded in the first back surface of the first semiconductor device, a second heat conductive layer embedded in the second back surface of the second semiconductor device, and a third heat conductive layer disposed adjoining the first heat conductive layer and extending to the first active surface of the first semiconductor device. The first back surface of the first semiconductor device and the second back surface of the second semiconductor device are in contact with each other. At least a portion of the first heat conductive layer are in contact with the second heat conductive layer.

Abstract: A manufacturing method of heat dissipation unit is disclosed. The heat dissipation unit is mainly composed of two titanium metal plate bodies. The titanium metal plate bodies are heat-treated, whereby the titanium metal plate bodies can be mechanical processed, shaped and surface-modified. Accordingly, the titanium metal can be freely shaped and provide capillary attraction. In this case, the titanium metal plate bodies can be used as the material of the heat dissipation unit instead of the conventional copper plate bodies to greatly reduce the weight and enhance the heat dissipation performance.

Abstract: A semiconductor heat dissipation structure includes a first semiconductor device including a first active surface and a first back surface opposite to the first active surface, a second semiconductor device including a second active surface and a second back surface opposite to the second active surface, a first heat conductive layer embedded in the first back surface of the first semiconductor device, a second heat conductive layer embedded in the second back surface of the second semiconductor device, and a third heat conductive layer disposed adjoining the first heat conductive layer and extending to the first active surface of the first semiconductor device. The first back surface of the first semiconductor device and the second back surface of the second semiconductor device are in contact with each other. At least a portion of the first heat conductive layer are in contact with the second heat conductive layer.

Abstract: A semiconductor device package includes a redistribution layer, a plurality of conductive pillars, a reinforcing layer and an encapsulant. The conductive pillars are in direct contact with the first redistribution layer. The reinforcing layer surrounds a lateral surface of the conductive pillars. The encapsulant encapsulates the first redistribution layer and the reinforcing layer. The conductive pillars are separated from each other by the reinforcing layer.

Abstract: A heat dissipation device includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.

Abstract: A manufacturing method of heat dissipation unit includes steps of: providing a mold having an upper mold section and a lower mold section, the lower mold section being formed with a receiving depression and at least one sink; providing an upper plate, a lower plate, a capillary structure and at least one heat conduction member, the heat conduction member being positioned in the sink, the lower plate, the capillary structure and the upper plate being sequentially positioned in the receiving depression, then the heat conduction member, the lower plate, the capillary structure and the upper plate being thermally pressed and connected with each other by means of the upper and lower mold sections; and integrally connecting the heat conduction member with the lower plate when the upper and lower plates are thermally pressed and connected to form the plate body by means of the upper and lower mold sections.

Abstract: According to various embodiments, a collimator includes a substrate defining a plurality of channels through the substrate. The substrate includes a first surface and a second surface opposite the first surface. Each of the channels includes a first aperture exposed from the first surface, a second aperture between the first surface and the second surface, and a third aperture exposed from the second surface. The first aperture and the third aperture are larger than the second aperture.

Abstract: An integrated module of acoustic wave device with active thermal compensation comprises a substrate, an acoustic wave filter, an active adjustment circuit and at least one variable capacitance device. The acoustic wave filter comprises a plurality of series acoustic wave resonators formed on the substrate, at least one shunt acoustic wave resonator formed on the substrate and a thermal sensing acoustic wave resonator. Each of the variable capacitance device is connected in parallel to one of the series and shunt acoustic wave resonators. The active adjustment circuit outputs an active thermal compensation signal correlated to a thermal variation sensed by the thermal sensing acoustic wave resonator to the variable capacitance device. The active thermal compensation signal induces a capacitance variation of the variable capacitance device such that the impact of the thermal variation to the acoustic wave device is compensated.