Abstract: Embodiments of through array contact structures of a 3D memory device and fabricating method thereof are disclosed. The memory device includes an alternating layer stack disposed on a first substrate. The alternating layer stack includes a first region including an alternating dielectric stack, and a second region including an alternating conductor/dielectric stack. The memory device further comprises a barrier structure including two parallel barrier walls extending vertically through the alternating layer stack and laterally along a word line direction to laterally separate the first region from the second region. The memory device further comprises a plurality of through array contacts in the first region, each through array contact extending vertically through the alternating dielectric stack.

Abstract: A surface acoustic wave (SAW) device having a high electromechanical coupling coefficient based on double-layer electrodes and a preparation method thereof. A structure of the SAW device includes a Cu electrode, a piezoelectric film and an Al electrode on a substrate in sequence. A signal terminal of the Cu electrode is opposite to a ground terminal of the Al electrode. A ground terminal of the Cu electrode is opposite to a signal terminal of the Al electrode. Since Sezawa wave mode that is adopted is formed by coupling film thickness vibration and transverse vibration, a longitudinal electric field (in a direction of thickness of a film) and a transverse electric field (in a propagation direction of SAW) are excited through the double-layer electrodes so that the electromechanical coupling coefficient of the SAW device is improved by changing a coupling pattern between the electric fields and the piezoelectric film.

Abstract: Methods and apparatus provide cloud-based video encoding that generates encoded video data by one or more encoders in a cloud platform for a plurality of cloud encoding sessions. The methods and apparatus generate operational improvement tradeoff data in response to operational encoding metrics associated with the one or more encoders and change operational characteristics of the one or more encoders for at least one of the cloud encoding sessions based on the operational improvement tradeoff data.

Abstract: Joint opening structures of 3D memory devices and fabricating method are provided. A joint opening structure comprises a first through hole penetrating a first stacked layer and a first insulating connection layer, a first channel structure at the bottom of the first through hole, a first functional layer on the sidewall of the first through hole, a second channel structure on the sidewall of the first functional layer, a third channel structure over the first through hole, a second stacked layer on the third channel structure, a second insulating connection layer on the second stacked layer, a second through hole penetrating the second stacked layer and the second insulating connection layer, a second functional layer disposed on the sidewall of the second through hole, a fourth channel structure on the sidewall of the second functional layer, and a fifth channel structure over the second through hole.

Abstract: Embodiments relate to digital low-dropout (DLDO) with fast feedback and optimized frequency response. Certain embodiments may relate more particularly to ferroelectric memory circuit configurations. For example, a low dropout regulator may include a first circuit path configured to regulate an input voltage to an output voltage at a load, wherein the first path comprises a first transistor. The apparatus may also include a second circuit path configured to feed back an error signal based on the input voltage and the output voltage, wherein the second circuit path comprises an error amplifier.

Abstract: An audio transmission device coupled to an electronic device and including a detection circuit, a vendor-defined class circuit, and an audio class circuit is provided. The detection circuit detects an external sound to generate an input voice. The vendor-defined class circuit provides a first voice signal to the electronic device according to the input voice. An audio processing application program of the electronic device processes the first voice signal to generate a processed voice to the vendor-defined class circuit. The audio class circuit receives the processed voice from the vendor-defined class circuit, uses the processed voice as a second voice signal, and provides the second voice signal to the media manager of the electronic device.

Abstract: The disclosure provides an adjustable device including plates and at least two adjustable modules connect with two adjacent of the plates. The adjustable module can stretch or shrink to change a distance between plates. The disclosure also provides an adjustable storage box including an upper cover and a lower cover. A storage space is formed by the upper cover and the lower cover and for the accommodating of the adjustable device. When the upper cover moves upward relative to the lower cover, the adjustable modules changes from a compression state to a stretch state and increase a distance between plates. Whereby, it is easy to pick and place object when a distance of two adjacent plates increases. The overall volume of the adjustable device is reduced when a distance of two adjacent plates decrease, thereby saving the working space.

Abstract: Fast simultaneous feasibility testing (SFT) for management of an electrical power grid is achieved through various innovations. The computation problem relates to evaluation of candidate solutions for external power flows into a power grid, with respect to predetermined constraints and contingencies. Storage and computations are reduced by formulating the problem in terms of transactional nodes (e.g. third party connections for generators and loads) instead of the larger number of bus nodes. Further advantages are achieved by precomputing matrices that can be reused across multiple SFT invocations, organizing matrices and operations to reduce storage and computation, and eliminating branches that have no contingency violations.

Abstract: The present invention relates to an absorbable biomedical composite material and a preparation method therefor, wherein the absorbable biomedical composite material comprises: a substrate particle containing a calcium phosphate compound; an intermediate layer which is coated on the surfaces of the substrate particle and has a first glass transition temperature, the first glass transition temperature being not higher than a normal body temperature; and a polymer matrix which is formed on the outer surface of the intermediate layer and has a second glass transition temperature, the second glass transition being higher than the first glass transition temperature. The present invention can provide an absorbable biomedical composite material which not only increases the mechanical strength but also improves the toughness.

Abstract: The present invention relates to an absorbable biomedical composite material and a preparation method therefor, wherein the absorbable biomedical composite material comprises: a substrate particle containing a calcium phosphate compound; an intermediate layer which is coated on the surfaces of the substrate particle and has a first glass transition temperature, the first glass transition temperature being not higher than a normal body temperature; and a polymer matrix which is formed on the outer surface of the intermediate layer and has a second glass transition temperature, the second glass transition being higher than the first glass transition temperature. The present invention can provide an absorbable biomedical composite material which not only increases the mechanical strength but also improves the toughness.

Abstract: Some embodiments provide a method of identifying packet latency in a software defined datacenter (SDDC) that includes a network and multiple host computers executing multiple machines. At a first host computer, the method identifies and stores (i) multiple time values associated with several packet processing operations performed on a particular packet sent by a first machine executing on the first host computer, and (ii) a time value associated with packet transmission through the SDDC network from the first host computer to a second host computer that is a destination of the particular packet. The method provides the stored time values to a set of one or more controllers to process to identify multiple latencies experienced by multiple packets processed in the SDDC.

Abstract: Example methods and systems for logical overlay tunnel monitoring are described. One example may involve a first computer system obtaining control information identifying a list of multiple logical overlay tunnels to be monitored, including a first logical overlay tunnel between a first virtual tunnel endpoint (VTEP) and a second VTEP. Based on the control information, a first monitoring agent may configure and inject a probe packet at the first VTEP to cause the first VTEP to perform encapsulation and send an encapsulated probe packet over the first logical overlay tunnel. In response, an encapsulated response packet that includes a response packet may be received from the second monitoring agent over the first logical overlay tunnel. Based on the response packet, a tunnel performance metric associated with the first logical overlay tunnel may be determined.

Abstract: Methods and apparatus provide cloud-based video encoding that generates encoded video data by one or more encoders in a cloud platform for a plurality of cloud encoding sessions. The methods and apparatus generate operational improvement tradeoff data in response to operational encoding metrics associated with the one or more encoders and change operational characteristics of the one or more encoders for at least one of the cloud encoding sessions based on the operational improvement tradeoff data.

Abstract: A processing apparatus and video encoding method are provided which include receiving a portion of a video sequence and determining complexities for blocks of pixels of the portion of the video sequence. Quantization parameter values for corresponding blocks of pixels are selected based on complexities of the corresponding blocks and visually perceived coding artifacts of the corresponding blocks produced by the quantization parameter values. The blocks of pixels are encoded, using the selected quantization parameter values. The blocks of pixels are decoded and the portion of the video sequence is provided for display.

Abstract: The present disclosure is related to an image processing method of virtual reality. The image processing method may include obtaining position information of a gaze point; performing a compression process on an original image to obtain a compressed image based on the position information of the gaze point; performing a compression process on a distorted image of the original image in an lens to obtain a compressed distorted image based on the position information of the gaze point; and performing an anti-distortion process on the compressed image to obtain an anti-distortion image based on a relationship between the compressed image and the compressed distorted image. The position information of the gaze point may be position information of a gaze point of a user's eye on an original image.

Abstract: An encoding method is provided which includes receiving a plurality of images, obtaining values of elements in a portion of the images, sorting the elements according to different values of the elements, sorting the elements according to a number of occurrences of the different values and encoding the elements using a subset of the different values having corresponding numbers of occurrences that are higher than corresponding numbers of occurrences of other values. Examples also include a processing device and method for use with palette mode encoding in which the elements are a portion of pixels in images and the values are color values of the portion of pixels in the images.

Abstract: A wafer storage box, wafer transfer device and wafer storage box and transfer assembly. The wafer storage and transfer assembly includes a chassis which is capable of translating or rotating, a sliding shaft, connecting levers, arms and at least two positioning sidewall. The chassis includes a groove. The sliding shaft can translate along the groove. The connecting levers are connected to the sliding shaft. Each arm extends from a connecting lever. The two positioning sidewall are respectively arranged on opposite sides of the chassis. Each positioning sidewall includes tracks accommodating the pins of connecting levers. The width of each of the tracks reduces from the front end of the positioning sidewall to the back end of the positioning sidewall. The wafer storage and transfer assembly can vacuum adsorb several wafers to achieve high efficiency of wafer storing and transferring.

Abstract: A supercapacity lithium ion battery cathode material, a preparation method therefor and an application thereof. The supercapacity lithium ion battery cathode material consists of a transition metal-containing lithium ion cathode material and carbon which is coated on the surface of the lithium ion cathode material. The transition metal on the surface of the lithium ion cathode material is coordinated with carbon by means of X—C bonds to form transition metal-X—C chemical bonds, such that carbon stably coats the surface of the cathode material, wherein C is SP3 hybridization and/or SP2 hybridization, and X is at least one selected from among N, O and S.