Abstract: In one aspect, the invention provides methods and compositions for the expression of small RNA molecules within a cell using a retroviral vector (FIG. 1A). Small interfering RNA (siRNA) can be expressed using the methods of the invention within a cell. In a further aspect, the invention provides methods for producing siRNA encoding lentivirus where the siRNA activity may interfere with the lentiviral life cycle. In yet a further aspect, the invention provides methods for expression of a small RNA molecule within a cell, such as an siRNA capable of downregulating CCR5, wherein expression of the small RNA molecule is relatively non-cytotoxic to the cell. The invention also includes small RNA molecules, such as an siRNA capable of downregulating CCR5, that are relatively non-cytotoxic to cells.

Abstract: An electric power steering system and its brush motor are disclosed. The brush motor includes a stator and a rotor rotatably mounted to the stator. The rotor includes a rotary shaft, a commutator and a rotor core fixed to the rotary shaft, and a rotor winding wound around the rotor core. The commutator includes a plurality of commutator segments. The rotor core includes a plurality of teeth. The rotor winding includes a plurality of winding elements. Adjacent teeth define therebetween wire slots for receiving the winding elements. The winding elements include a plurality of first winding elements and a plurality of second winding elements. The first winding elements are connected in series through the commutator segments. The second winding elements are connected in series through the commutator segments. The first winding elements and the second winding elements are received in different wire slots. Implementation of the present invention can improve the reliability of the product.

Abstract: Liquid crystal display panel and liquid crystal display device are provided. A liquid crystal display panel includes a first substrate, a second substrate, and a liquid crystal layer there-between. The first substrate includes a first base substrate, and gate lines and data lines, on the first base substrate and defining a plurality of sub-pixels. The second substrate includes a second base substrate. At least one heating sensor is disposed between the first and second base substrates. A non-display area includes a first non-display area, disposed around a display area, and a second non-display area, disposed around the first non-display area. Each heating sensor includes at least one sub-sensor and two sensor terminals, including a first and second sensor terminal, respectively connected to two ends of the at least one sub-sensor. At least one of the at least one sub-sensor is disposed in the first non-display area.

Abstract: An array substrate and a display panel are provided. The array substrate includes a base layer, a first metal layer, a first insulating layer, a second metal layer, a second insulating layer, a first electrode layer, and a reflective layer successively stacked along a direction perpendicular to a plane in which the base layer is located. The second metal layer is used to form a source and a drain of a thin film transistor. The first electrode layer is used to form a pixel electrode. The second insulating layer is provided with a through-hole. The pixel electrode is connected to the drain of the thin film transistor through the through-hole. The reflective layer is provided with a first through-hole, and an orthographic projection of the first through-hole onto the base layer covers an orthographic projection of the through-hole onto the base layer.

Abstract: A display component and a display device are provided. The display component includes a display panel including a first substrate, a thin-film transistor array layer, a second substrate and a coil-containing film layer. The coil-containing film layer at least includes a first metal layer, a first insulation layer, a second metal layer, and a second insulation layer. The first metal layer includes at least one first coil and the second metal layer includes at least one signal line, where the one first coil of the first metal layer is electrically connected to one or two signal lines of the second metal layer. An orthographic projection of the first coil on the first substrate is at least partially in the display region. The display component further includes a coil drive circuit, where the coil drive circuit is electrically connected to each of the first coil and the signal line, respectively.

Abstract: Provided are a display panel and a display apparatus. The display panel has a bonding region where a chip is bonded, and a fan-out region where fan-out leads is arranged. Bonding pads in the bonding region include a first pad array and a second pad array, the first pad array being at a side of the second pad array close to the display region. The first pad array includes first pads arranged in at least two rows. The first pad array includes at least one inclined section including at least three first pads that are arranged sequentially and obliquely away from the display region. Such an arrangement allows at least a portion of the fan-out leads to be displaced into the bonding region, to increase the area for arranging the fan-out leads. Therefore, the lower border of the display panel is narrowed.

Abstract: The disclosure relates to a one-way valve, a top cover component, a box and a battery module. The one-way valve includes: a valve body including an inlet end, an exhaust end and an air-flow passage, the air-flow passage including a first flow-passing hole, a second flow-passing hole and a protrusion disposed on a bottom wall of the first flow-passing hole, the second flow-passing hole penetrating through the protrusion; an elastic valve cap, the protrusion being sheathed with and in a sealed connection with the elastic valve cap, a flow-passing gap is formed between an outer surface of the elastic valve cap and a hole wall of the first flow-passing hole, the second flow-passing hole includes a conical hole-section; a valve cover in connection with the exhaust end, wherein the valve cover is disposed within the first flow-passing hole and includes an exhaust passage in connection with the first flow-passing hole.

Abstract: The present disclosure provides a shell, a battery module and a battery pack. The shell according to the present disclosure comprises: an enclosing frame which has two side walls, a top wall, a bottom wall and a receiving cavity; two end plates which respectively securely connect with the two ends of the enclosing frame. And each side wall is formed with a fixing rib protruding outwardly along a width direction, the fixing rib is provided with at least one through hole. A battery module comprises the above-mentioned shell. A battery pack according to the present disclosure comprises: a lower casing; the plurality of above-mentioned battery modules received in the lower casing; and a plurality of fasteners, each fastener passes through the corresponding through hole of the battery module to secure the battery module in the lower casing.

Abstract: Provided are a display panel and a display device. Along a column direction of the matrix, adjacent N rows of sub-pixels form a pixel unit group, N scanning lines of a same pixel unit group are electrically connected, and sub-pixels of the same pixel unit group are electrically connected to different data lines; a length of a first edge of the sub-pixel along the column direction of the matrix is smaller than a length of a second edge along a row direction; along the column direction of the matrix, adjacent N sub-pixels form a pixel unit; among N switch transistors of a same pixel unit, orthographic projections of at least two switch transistors on a preset plane at least partially overlap; among N data lines of the same pixel unit, an orthographic projection of at least one data line overlaps an orthographic projection of at least one pixel electrode.

Abstract: A touch-control display panel, driving method, and a touch-control display device are provided. The touch-control display panel includes: a display area including a plurality of pixels; a non-display area; a first substrate; and a second substrate opposing the first substrate. A portion of the first substrate in the first region includes a pixel electrode layer and a first electrode layer. The first electrode layer is located on a side of the pixel electrode layer away from the second substrate and includes a plurality of first electrodes. The pixel electrode layer includes a plurality of pixel electrodes. A touch-control electrode layer is located on a side of the second substrate toward the first substrate and includes a plurality of touch-control electrodes. Along a direction perpendicular to the touch-control display panel, each touch-control electrode of the plurality of the touch-control electrode overlaps with and connects with one or more first electrode of the plurality of the first electrodes.

Abstract: A panel-level chip device and a packaging method for forming the panel-level chip device are provided. The panel-level chip device includes a plurality of first bare chips disposed on a supporting base, and a plurality of first connection pillars. The panel-level chip device also includes a first encapsulation layer, and a first redistribution layer. The first redistribution layer includes a plurality of first redistribution elements and a plurality of second redistribution elements. Further, the panel-level chip device includes a solder ball group including a plurality of first solder balls. First connection pillars having a same electrical signal are electrically connected to each other by a first redistribution element. Each of remaining first connection pillars is electrically connected to one second redistribution element. The one second redistribution element is further electrically connected to a first solder ball of the plurality of first solder balls.

Abstract: A drive circuit and its drive method, and a panel and its drive method are provided. The drive circuit includes a step-up unit, a plurality of signal input terminals and a signal output terminal. The step-up unit includes a first module, a second module and a first capacitor. The first module is configured to transmit a signal of a third signal input terminal to a first electrode of the first capacitor. The second module is configured to transmit a signal of a fourth signal input terminal to a second electrode of the first capacitor at a first time period which generates a voltage difference between two electrodes of the first capacitor, and to transmit the signal of the fourth signal input terminal to the second electrode of the first capacitor at a second time period which further increases a signal of the first electrode of the first capacitor.

Abstract: A driving circuit includes a first signal-input terminal, a second signal-input terminal, a third signal-input terminal, a fourth signal-input terminal, a signal-output terminal, and a voltage-boosting unit including a first module, a second module, a third module, and a first capacitor. The first module transmits the signal at the third signal-input terminal to a first terminal of the first capacitor during a first time period, and blocks signal transmission during a second time period. During the first time period and the second time period, the second module transmits the signal at the third signal-input terminal to the third module to allow the signal at the fourth signal-input terminal to be transmitted to a second terminal of the first capacitor. During a third time period, the second module and the third module both block signal transmission. The first terminal of the first capacitor is connected to the signal-output terminal for output.

Abstract: A drive circuit and its drive method, and a panel and its drive method are provided. The drive circuit includes a step-up unit, a plurality of signal input terminals and a signal output terminal, which are electrically connected with each other. The step-up unit includes a first module, a second module, a third module and a first capacitor, which are electrically connected with each other. The first module is configured to transmit a signal of a third signal input terminal to a first electrode of the first capacitor. The second module is configured to transmit a signal of a fourth signal input terminal to a second electrode of the first capacitor. The third module is configured to transmit a signal of the third signal input terminal to the second electrode of the first capacitor, which further increases the signal of the first electrode of the first capacitor.

Abstract: A liquid-crystal display panel and a liquid-crystal display device are provided. The display panel includes a display region and a non-display region surrounding the display region. The display panel also includes a first base including a first substrate, and a plurality of gate lines, a plurality of data lines, and a plurality of sub-pixels disposed in the display region. Moreover, the display panel includes a second base including a second substrate, and a liquid-crystal layer disposed between the first base and the second base. In addition, the display panel includes a heating power terminal disposed in the non-display region and including a first heating power terminal for outputting a high voltage and a second heating power terminal for outputting a low voltage. Further, the display panel includes at least one heating electrode disposed between the first substrate and the second substrate and used to heat the liquid-crystal layer.

Abstract: Backlight module and display device are provided. The backlight module includes an accommodation frame including a base and an extending part, a first light guide plate, a second light guide plate; a first reflector, a first light source, and a second light source. The first light guide plate and the second light guide plate are disposed sequentially along a direction perpendicular to a plane of the base in an accommodation space formed by the base and the extending part, and are controlled independently. The first light source has a wavelength ?1 of 780 nm<?1?1310 nm, and the second light source has a wavelength ?2 of 380 nm??2?780 nm. A reflectivity of the first reflector on light emitted by the second light source is larger than a reflectivity of the first reflector on light emitted by the first light source.

Abstract: Chip package structure and chip package method are provided. The chip package structure includes an encapsulating layer, a redistribution layer, a soldering pad group, and bare chips. Connecting posts is formed on a side of the bare chips. The encapsulating layer covers the bare chips and the connecting posts, while exposes a side of the connecting posts away from the bare chips. The redistribution layer on the connecting posts includes a first redistribution wire, a second redistribution wire, and a third redistribution wire. The first redistribution wire and the second redistribution wire are electrically connected to at least one connecting post respectively, and the third redistribution layer is electrically connected to remaining connecting posts. The soldering pad group on the redistribution layer includes an input soldering pad electrically connected to the first redistribution wire and an output soldering pad electrically connected to the second redistribution wire.

Abstract: A microfluidic chip, a method for driving a microfluidic chip and an analysis apparatus are provided. An exemplary microfluidic chip includes a substrate; a number of M driving electrodes disposed on a side of the substrate and arranged along a first direction; and a number of N signal terminals electrically connected to the number of M driving electrodes. Any three adjacent driving electrodes are connected to different signal terminals, respectively; a number of A of the number of M driving electrodes are connected to a same signal terminal; and M, N and A are positive integers, and M?4, N?3, M>N, and A?2.

Abstract: Chip package method and chip package structure are provided. The chip package method includes: providing a transparent substrate including a first side and a second side; coating the first side of the transparent substrate with an organic polymer material layer; depositing a protective layer on the organic polymer material layer; forming alignment parts on the protective layer; attaching a plurality of chips including metal pins; forming an encapsulating layer on the protective layer; polishing the encapsulating layer to expose the metal pins; forming a first insulating layer; forming first through holes in the first insulating layer; forming metal parts extending along sidewalls of the first through holes; and irradiating the second side of the transparent substrate by a laser to lift off the transparent substrate. The metal parts are insulated from each other and electrically connected to the metal pins.

Abstract: Chip package structure and chip package method are provided. The chip package structure includes an encapsulating layer, a first metal layer, a second metal layer, and bare chips. The bare chips include first bare chips and second bare chips. First-connecting-posts are formed on a side of the first bare chips and on a side of the second bare chips. The encapsulating layer covers the bare chips and the first-connecting-posts. The first metal layer is disposed on the side of the first-connecting-posts away from the bare chips and includes first capacitor polar plates and conductive parts. The first capacitor polar plates are electrically connected to the first-connecting-posts on the first bare chips, and the conductive parts are electrically connected to the first-connecting-posts on the second bare chips. The second metal layer is disposed on a side of the first metal layer away from the encapsulating layer and includes second capacitor polar plates electrically connected to the conductive parts.