Abstract: The present disclosure provides chip package structure, packaging method, camera module and electronic equipment. The package structure includes chip package module, which includes light-transmitting substrate, wiring layer located on side of light-transmitting substrate and including first metal wire, conductor located on side of wiring layer facing away from light-transmitting substrate, photosensitive chip located on side of wiring layer facing away from the light-transmitting substrate, active chip located on side of wiring layer facing away from light-transmitting substrate, and plastic encapsulation layer encapsulating photosensitive chip and active chip. The conductor includes first end electrically connected to first metal wire, and second end. The photosensitive chip includes pin electrically connected to first metal wire and has photosensitive surface facing towards light-transmitting substrate. The photosensitive surface includes photosensitive region that is not overlapping first metal wire.

Abstract: Provided are a display panel and a display device. Along a column direction of the matrix, adjacent N rows of sub-pixels form a pixel unit group, N scanning lines of a same pixel unit group are electrically connected, and sub-pixels of the same pixel unit group are electrically connected to different data lines; a length of a first edge of the sub-pixel along the column direction of the matrix is smaller than a length of a second edge along a row direction; along the column direction of the matrix, adjacent N sub-pixels form a pixel unit; among N switch transistors of a same pixel unit, orthographic projections of at least two switch transistors on a preset plane at least partially overlap; among N data lines of the same pixel unit, an orthographic projection of at least one data line overlaps an orthographic projection of at least one pixel electrode.

Abstract: A light-emitting module includes a light-emitting panel which includes a first rigid substrate, a flexible substrate, a circuit layer, a light-emitting element, and a driver chip. The flexible substrate includes a light-emitting region, a bending region, and an epitaxial region, and the light-emitting region and the epitaxial region are located on two ends of the bending region. The circuit layer includes a first connection terminal located on the epitaxial region and the driver chip is bonded to the first connection terminal. The light-emitting element is located on the light-emitting region, and the light-emitting element emits light toward the first rigid substrate. The flexible substrate is bent in the bending region and the flexible substrate in the epitaxial region is bent to a side of the light-emitting elements facing away from the first rigid substrate. The process difficulty can be reduced and the product yield can be improved.

Abstract: A chip package structure, manufacturing method thereof, and module are described. In an embodiment, the chip package structure includes: a substrate, a wiring layer, a chip, and a second conductive bump, wherein, in an embodiment, the substrate includes a first region and a second region surrounding the first region, and the wiring layer is located on side of the substrate and includes metal wire, wherein at least part of a metal wire is in contact with the substrate in direction perpendicular to the substrate, and the metal wire overlaps with the second region, wherein the chip is located on side of the wiring layer facing away from the substrate, and the chip corresponds to the first region. In an embodiment, a first conductive bump is provided on side of the chip facing away from the substrate and is electrically connected to the metal wire.

Abstract: The present application provides a current collecting member and a manufacturing method thereof, a secondary battery and a manufacturing method thereof, a battery module, and an apparatus. In the current collecting member of the secondary battery, a terminal connection part is perpendicular to a height direction. a transition part is connected to the terminal connection part and is bent to a side of the terminal connection part along a height direction, a connection between the transition part and the terminal connection part extends along a direction which is inclined relative to a length direction and a width direction. The tab connection part is connected to the transition part and is bent relative to the transition part, and a connection between the transition part and the tab connection part is parallel to the length direction. The tab connection part is at least partially perpendicular to the width direction.

Abstract: Chip package structure is provided. The chip package structure includes: a chip, the chip including metal pins; an organic polymer material layer, the organic polymer material layer being located on a side of the metal pins away from the chip, the organic polymer material layer including a first via hole, and the organic polymer material layer including a first surface away from the chip; metal parts, at least a portion of the metal parts being located in the first via hole, the metal parts and metal pins being electrically connected, the metal parts including a second surface away from the chip, and the second surface and the first surface being flush to each other; and an encapsulating layer, the encapsulating layer being located on a side of the metal parts away from the organic polymer material layer.

Abstract: Disclosed antenna unit includes first substrate and second substrate opposite to each other, phase shifting units and driver circuit. Region facing the first substrate and the second substrate form phase shifting region. In first direction, the first substrate formed with first step region, and used for connecting radio-frequency signal terminal; in second direction, the second substrate formed with second step region, and included angle between the first direction and the second direction greater than or equal to 0° and smaller than 180°. At least part of the first step region does not overlap at least part of the second step region. Phase shifting units used for radiating radio-frequency signal and distributed in phase shifting region, each phase shifting unit. At least part of the driver circuit disposed in the second step region and the driver circuit electrically connected to each phase shifting unit to adjust radio-frequency signal.

Abstract: A stacking power supply cabinet is provided. The stacking power supply cabinet includes a top assembly and at least one battery module. In a case that the number of the battery module is more than one and the multiple battery modules are stacked sequentially from top to bottom, an electric connection path for power supply and/or storage is established among the stacked multiple battery modules, and the electric connection path is conducted via a power transmission line in the top assembly, and then the battery modules are charged. Thus, in the installation process of the power supply cabinet, the electric connection path for the power supply and/or storage among the multiple stacked battery modules is uncharged before the top assembly is installed, thereby reducing the risk of electric shock to the human body and improving the safety during the installation process of the stacking power supply cabinet.

Abstract: The present application discloses an energy storage cabinet, including a battery management module and a battery assembly. The battery management module is located on the side wall of the battery assembly, and the battery management module is electrically connected to the battery assembly. In the energy storage cabinet according to the present application, because the battery management module is located on the side wall of the battery assembly, the mounting height of the battery management module is effectively reduced, which is convenient for workers to control the battery management module, further facilitates the operation of the energy storage cabinet, and improves the safety of workers operating the energy storage cabinet.

Abstract: Chip package structure and chip package method are provided. The chip package structure includes an encapsulating layer, a redistribution layer, a soldering pad group, and bare chips. Connecting posts is formed on a side of the bare chips. The encapsulating layer covers the bare chips and the connecting posts, while exposes a side of the connecting posts away from the bare chips. The redistribution layer on the connecting posts includes a first redistribution wire, a second redistribution wire, and a third redistribution wire. The first redistribution wire and the second redistribution wire are electrically connected to at least one connecting post respectively, and the third redistribution layer is electrically connected to remaining connecting posts. The soldering pad group on the redistribution layer includes an input soldering pad electrically connected to the first redistribution wire and an output soldering pad electrically connected to the second redistribution wire.

Abstract: In an array substrate, an electronic paper display panel and a drive method thereof, and a display device, a display area includes multiple sub-display areas. A plurality of scanning lines in each sub-display area are electrically insulated from each other, corresponding scanning lines in different sub-display areas are electrically connected to each other and display time of each sub-display area is controlled through control signal lines. When a control chip and a flexible circuit board are employed, only a small number of control chips and/or flexible circuit boards, or even only one control chip and/or one flexible circuit board, may drive multiple sub-display areas to display pictures.

Abstract: Provided are an array substrate, an electronic paper display panel and a drive method thereof and a display device. A display area includes a plurality of sub-display areas, a plurality of data lines in each sub-display area are electrically insulated from each other, corresponding data lines in different sub-display areas are electrically connected to each other, and a control signal line is configured to control display time of each sub-display area. When a control chip and a flexible circuit board are employed, only a small number of control chips and flexible circuit boards may drive the plurality of sub-display areas to display pictures.

Abstract: Provided are a display panel and a vehicle. The display device includes a knob and a main display panel; the knob includes a first magnetic adhering piece; the display device further includes a second magnetic adhering structure, and the second magnetic adhering structure is disposed on a non-light exiting side of the main display panel; the second magnetic adhering structure includes a plurality of first magnetic adhering regions, and at least two first magnetic adhering regions are not overlapped; when the knob is magnetically adhered to any one of the plurality of first magnetic adhering regions, the knob is disposed on a light exiting side of the main display panel.

Abstract: A phase shifter and a manufacturing method thereof and an antenna and a manufacturing method thereof are provided. The phase shifter includes: first and second substrates opposite to each other; a first electrode provided on the first substrate and configured to receive a ground signal; a second electrode provided on a side of the second substrate facing towards the first substrate; liquid crystals encapsulated between the first substrate and the second substrate and driven by the first electrode and the second electrode to rotate; and a support structure provided between the first substrate and the second substrate and including a first spacer. The first spacer is located on a side of the second electrode facing away from the second substrate, and an orthographic projection of the first spacer on the second substrate is within an orthographic projection of the second electrode on the second substrate.

Abstract: The present disclosure relates to the technical field of energy storage devices, and in particular, to a battery module. The battery module includes a set of batteries, a case receiving the set of batteries, and a sampling unit for collecting a voltage signal and a temperature signal of the set of batteries. The sampling unit is provided with a connector, and a stopper for fixing the connector is formed on the case. By forming the stopper on the case, the connector can be directly assembled to the stopper during assembling process of the set of batteries without the need to fix the connector by glue or bolt connection. Therefore, not only an assembling process is simplified, but also the connector is not easily damaged during the assembling process.

Abstract: A phased-array antenna and a method for controlling the same are provided. The phased-array antenna includes first and second substrates between which a cavity is formed. Phase-shifting units in the cavity each includes: a power feeder located on a surface of the first substrate facing away from the second substrate and connected to a radio-frequency signal terminal, a radiator located on the surface and insulated from the power feeder, a ground electrode located on a surface of the first substrate facing towards the second substrate. The ground electrode connects to the ground signal terminal and overlaps with the power feeder and the radiator and includes a first and a second openings. A transmission electrode located on a surface of the second substrate facing the first substrate and connects to the control signal line.

Abstract: The present disclosure relates to the technical field of battery, and particularly to a battery module. The battery module includes a case body having a cavity, a plurality of battery units accommodated in the cavity of the case body, an output electrode assembly disposed on the case body and electrically connected to output terminals of the plurality of battery units, and an end cap connected to the case body and arranged to press and cover at least a part of the output electrode assembly. The battery module according to the present disclosure has a sound design, through which the airtightness of the output electrode assembly is not liable to be broken during the running of the vehicle.

Abstract: Chip package method and chip package structure are provided. The chip package method includes: providing a transparent substrate including a first side and a second side; coating the first side of the transparent substrate with an organic polymer material layer; depositing a protective layer on the organic polymer material layer; forming alignment parts on the protective layer; attaching a plurality of chips including metal pins; forming an encapsulating layer on the protective layer; polishing the encapsulating layer to expose the metal pins; forming a first insulating layer; forming first through holes in the first insulating layer; forming metal parts extending along sidewalls of the first through holes; and irradiating the second side of the transparent substrate by a laser to lift off the transparent substrate. The metal parts are insulated from each other and electrically connected to the metal pins.

Abstract: A semiconductor package and a method of forming the semiconductor package are provided. The method includes providing a first substrate, forming a wiring structure containing at least two first wiring layers, disposing a first insulating layer between adjacent two first wiring layers, and patterning the first insulating layer to form a plurality of first through-holes. The adjacent two first wiring layers are electrically connected to each other through the plurality of first through-holes. The method also includes providing at least one semiconductor element each including a plurality of pins. In addition, the method includes disposing the plurality of pins of the each semiconductor element on a side of the wiring structure away from the first substrate. Further, the method includes encapsulating the at least one semiconductor element, and placing a ball on a side of the wiring structure away from the at least one semiconductor element.