Patents by Inventor Feng Qin

Feng Qin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220173468
    Abstract: Disclosed are a battery, an electric apparatus, and a manufacturing method of the battery, belonging to the technical field of batteries. The battery includes a plurality of battery cells and a mounting base, where the plurality of battery cells are electrically connected; the mounting base is used to fix an output electrode of the battery, the output electrode is used to export electric energy of the plurality of battery cells, the mounting base includes at least one limiting surface, and the limiting surface is matched with the contour of the battery cell. Through the battery, the electric apparatus, and the manufacturing method of the battery, the occupied space of the mounting base is reduced, and the energy density of the battery is increased.
    Type: Application
    Filed: December 28, 2021
    Publication date: June 2, 2022
    Applicant: JIANGSU CONTEMPORARY AMPEREX TECHNOLOGY LIMITED
    Inventors: Yongguang WANG, Peng WANG, Feng QIN, Jinqing JI, Mu QIAN
  • Patent number: 11334740
    Abstract: Fingerprint recognition circuit, fingerprint recognition structure, fingerprint recognition device, display panel, and display device are provided. The circuit includes: a fingerprint recognition driving transistor; a first capacitor; a driving signal input terminal; and a sensing signal output terminal. The first capacitor has a terminal electrically connected to a gate of the fingerprint recognition driving transistor and another terminal electrically connected to a ground. The driving signal input terminal is electrically connected to an input terminal of the fingerprint recognition driving transistor. An output terminal of the fingerprint recognition driving transistor is electrically connected to the sensing signal output terminal.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: May 17, 2022
    Assignees: Shanghai Tianma Micro-Electronics Co., Ltd., Shanghai AVIC OPTO Electronics Co., Ltd.
    Inventors: Kerui Xi, Tingting Cui, Feng Qin, Xuhui Peng, Linzhi Wang
  • Publication number: 20220137463
    Abstract: A light-emitting structure, a backlight module, a display module, and a display device are provided. The light-emitting structure includes a circuit substrate, including a first surface and a second surface sequentially arranged along a light-exiting direction of the light-emitting structure. The circuit substrate also includes a light-transparent substrate and a wiring structure located on a side of the light-transparent substrate in a thickness direction. The light-emitting structure also includes a plurality of light-emitting elements, arranged in an array on one of the first surface or the second surface of the circuit substrate. The plurality of the light-emitting elements is electrically connected to the wiring structure. The light-emitting structure also includes a heat sink, located on a side of the first surface of the circuit substrate. The heat sink is configured for dissipating heat generated by the plurality of the light-emitting elements.
    Type: Application
    Filed: December 17, 2020
    Publication date: May 5, 2022
    Inventors: Feng QIN, Zhiqi CHEN, Dandan QIN, Shoufu JIAN
  • Publication number: 20220131264
    Abstract: Provided are a liquid crystal phase shifter, a manufacturing method thereof, and a liquid crystal antenna. The liquid crystal phase shifter includes a first substrate, a second substrate, microstrips, a ground electrode, and liquid crystals located between the at least one microstrip and the ground electrode. The microstrip line is disposed on a side of the second substrate facing towards the first substrate and includes a first transmission line and a second transmission line that are each a coil and are nested with each other in a direction perpendicular to a plane of the second substrate. The coiling transmission directions of radio frequency signals transmitted on the first and second transmission lines are opposite. The ground electrode overlaps both the first transmission line and the second transmission line in the direction perpendicular to the plane of the second substrate.
    Type: Application
    Filed: December 17, 2020
    Publication date: April 28, 2022
    Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
    Inventors: Zhenyu JIA, Kerui XI, Baiquan LIN, Qinyi DUAN, Feng QIN
  • Publication number: 20220102406
    Abstract: The present disclosure provides chip package structure, packaging method, camera module and electronic equipment. The package structure includes chip package module, which includes light-transmitting substrate, wiring layer located on side of light-transmitting substrate and including first metal wire, conductor located on side of wiring layer facing away from light-transmitting substrate, photosensitive chip located on side of wiring layer facing away from the light-transmitting substrate, active chip located on side of wiring layer facing away from light-transmitting substrate, and plastic encapsulation layer encapsulating photosensitive chip and active chip. The conductor includes first end electrically connected to first metal wire, and second end. The photosensitive chip includes pin electrically connected to first metal wire and has photosensitive surface facing towards light-transmitting substrate. The photosensitive surface includes photosensitive region that is not overlapping first metal wire.
    Type: Application
    Filed: December 9, 2021
    Publication date: March 31, 2022
    Applicants: Shanghai AVIC OPTO Electronics Co., Ltd., Shanghai Tianma Micro-Electronics Co., Ltd.
    Inventors: Kerui XI, Xuhui PENG, Feng QIN, Tingting CUI, Zhenyu JIA
  • Publication number: 20220102871
    Abstract: Provided is an antenna. The antenna includes a first metal electrode, a second metal electrode, and a dielectric functional layer. The first metal electrode and the second metal electrode are located on two opposite sides of the dielectric functional layer, respectively; and the first metal electrode includes a plurality of transmission electrodes. The antenna further includes a flexible coplanar waveguide and a feed network. The flexible coplanar waveguide is electrically connected to the feed network and configured to feed an electrical signal to the feed network.
    Type: Application
    Filed: December 10, 2021
    Publication date: March 31, 2022
    Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
    Inventors: Zhenyu JIA, Kerui XI, Baiquan LIN, Linzhi WANG, Qinyi DUAN, Zuocai YANG, Feng QIN
  • Patent number: 11281059
    Abstract: Provided are a display panel and a display device. Along a column direction of the matrix, adjacent N rows of sub-pixels form a pixel unit group, N scanning lines of a same pixel unit group are electrically connected, and sub-pixels of the same pixel unit group are electrically connected to different data lines; a length of a first edge of the sub-pixel along the column direction of the matrix is smaller than a length of a second edge along a row direction; along the column direction of the matrix, adjacent N sub-pixels form a pixel unit; among N switch transistors of a same pixel unit, orthographic projections of at least two switch transistors on a preset plane at least partially overlap; among N data lines of the same pixel unit, an orthographic projection of at least one data line overlaps an orthographic projection of at least one pixel electrode.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: March 22, 2022
    Assignee: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventors: Jian Zhao, Ling Shen, Yongli Qian, Feng Qin
  • Publication number: 20220084973
    Abstract: Chip package structure is provided. The chip package structure includes: a chip, the chip including metal pins; an organic polymer material layer, the organic polymer material layer being located on a side of the metal pins away from the chip, the organic polymer material layer including a first via hole, and the organic polymer material layer including a first surface away from the chip; metal parts, at least a portion of the metal parts being located in the first via hole, the metal parts and metal pins being electrically connected, the metal parts including a second surface away from the chip, and the second surface and the first surface being flush to each other; and an encapsulating layer, the encapsulating layer being located on a side of the metal parts away from the organic polymer material layer.
    Type: Application
    Filed: October 20, 2021
    Publication date: March 17, 2022
    Inventors: Kerui XI, Feng QIN, Jine LIU, Xiaohe LI, Tingting CUI
  • Publication number: 20220085000
    Abstract: A light-emitting module includes a light-emitting panel which includes a first rigid substrate, a flexible substrate, a circuit layer, a light-emitting element, and a driver chip. The flexible substrate includes a light-emitting region, a bending region, and an epitaxial region, and the light-emitting region and the epitaxial region are located on two ends of the bending region. The circuit layer includes a first connection terminal located on the epitaxial region and the driver chip is bonded to the first connection terminal. The light-emitting element is located on the light-emitting region, and the light-emitting element emits light toward the first rigid substrate. The flexible substrate is bent in the bending region and the flexible substrate in the epitaxial region is bent to a side of the light-emitting elements facing away from the first rigid substrate. The process difficulty can be reduced and the product yield can be improved.
    Type: Application
    Filed: November 30, 2021
    Publication date: March 17, 2022
    Applicant: Shanghai Tianma Microelectronics Co., Ltd.
    Inventors: Lu YAO, Wanchun DU, Jine LIU, Xupeng WANG, Feng QIN
  • Publication number: 20220085465
    Abstract: The present application provides a current collecting member and a manufacturing method thereof, a secondary battery and a manufacturing method thereof, a battery module, and an apparatus. In the current collecting member of the secondary battery, a terminal connection part is perpendicular to a height direction. a transition part is connected to the terminal connection part and is bent to a side of the terminal connection part along a height direction, a connection between the transition part and the terminal connection part extends along a direction which is inclined relative to a length direction and a width direction. The tab connection part is connected to the transition part and is bent relative to the transition part, and a connection between the transition part and the tab connection part is parallel to the length direction. The tab connection part is at least partially perpendicular to the width direction.
    Type: Application
    Filed: November 19, 2021
    Publication date: March 17, 2022
    Applicant: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED
    Inventors: Liangyi WANG, Runyong HE, Feng QIN, Hua ZHANG, Liangmei CHEN, Zhi WANG
  • Publication number: 20220084923
    Abstract: A chip package structure, manufacturing method thereof, and module are described. In an embodiment, the chip package structure includes: a substrate, a wiring layer, a chip, and a second conductive bump, wherein, in an embodiment, the substrate includes a first region and a second region surrounding the first region, and the wiring layer is located on side of the substrate and includes metal wire, wherein at least part of a metal wire is in contact with the substrate in direction perpendicular to the substrate, and the metal wire overlaps with the second region, wherein the chip is located on side of the wiring layer facing away from the substrate, and the chip corresponds to the first region. In an embodiment, a first conductive bump is provided on side of the chip facing away from the substrate and is electrically connected to the metal wire.
    Type: Application
    Filed: November 22, 2021
    Publication date: March 17, 2022
    Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
    Inventors: Mingyu WANG, Kerui XI, Xuhui PENG, Feng QIN, Jie ZHANG
  • Publication number: 20220077596
    Abstract: Disclosed antenna unit includes first substrate and second substrate opposite to each other, phase shifting units and driver circuit. Region facing the first substrate and the second substrate form phase shifting region. In first direction, the first substrate formed with first step region, and used for connecting radio-frequency signal terminal; in second direction, the second substrate formed with second step region, and included angle between the first direction and the second direction greater than or equal to 0° and smaller than 180°. At least part of the first step region does not overlap at least part of the second step region. Phase shifting units used for radiating radio-frequency signal and distributed in phase shifting region, each phase shifting unit. At least part of the driver circuit disposed in the second step region and the driver circuit electrically connected to each phase shifting unit to adjust radio-frequency signal.
    Type: Application
    Filed: November 18, 2021
    Publication date: March 10, 2022
    Applicants: Shanghai AVIC OPTO Electronics Co., Ltd., Shanghai Tianma Micro-Electronics Co., Ltd.
    Inventors: Kerui Xi, Xuhui Peng, Feng Qin, Tingting Cui, Zhenyu Jia
  • Publication number: 20220059895
    Abstract: The present application discloses an energy storage cabinet, including a battery management module and a battery assembly. The battery management module is located on the side wall of the battery assembly, and the battery management module is electrically connected to the battery assembly. In the energy storage cabinet according to the present application, because the battery management module is located on the side wall of the battery assembly, the mounting height of the battery management module is effectively reduced, which is convenient for workers to control the battery management module, further facilitates the operation of the energy storage cabinet, and improves the safety of workers operating the energy storage cabinet.
    Type: Application
    Filed: January 27, 2021
    Publication date: February 24, 2022
    Applicant: SUNGROW POWER SUPPLY CO., LTD.
    Inventors: Feng PAN, Shengli YU, Puyun DONG, Juntao ZHI, Feng QIN, Shangfang DAI, Xiaoxun LI, Yongqiang YANG
  • Publication number: 20220059896
    Abstract: A stacking power supply cabinet is provided. The stacking power supply cabinet includes a top assembly and at least one battery module. In a case that the number of the battery module is more than one and the multiple battery modules are stacked sequentially from top to bottom, an electric connection path for power supply and/or storage is established among the stacked multiple battery modules, and the electric connection path is conducted via a power transmission line in the top assembly, and then the battery modules are charged. Thus, in the installation process of the power supply cabinet, the electric connection path for the power supply and/or storage among the multiple stacked battery modules is uncharged before the top assembly is installed, thereby reducing the risk of electric shock to the human body and improving the safety during the installation process of the stacking power supply cabinet.
    Type: Application
    Filed: July 27, 2021
    Publication date: February 24, 2022
    Applicant: SUNGROW POWER SUPPLY CO., LTD.
    Inventors: Feng PAN, Shengli YU, Puyun DONG, Juntao ZHI, Feng QIN, Xiaoxun LI, Shangfang DAI, Yongqiang YANG
  • Patent number: 11257765
    Abstract: Chip package structure and chip package method are provided. The chip package structure includes an encapsulating layer, a redistribution layer, a soldering pad group, and bare chips. Connecting posts is formed on a side of the bare chips. The encapsulating layer covers the bare chips and the connecting posts, while exposes a side of the connecting posts away from the bare chips. The redistribution layer on the connecting posts includes a first redistribution wire, a second redistribution wire, and a third redistribution wire. The first redistribution wire and the second redistribution wire are electrically connected to at least one connecting post respectively, and the third redistribution layer is electrically connected to remaining connecting posts. The soldering pad group on the redistribution layer includes an input soldering pad electrically connected to the first redistribution wire and an output soldering pad electrically connected to the second redistribution wire.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: February 22, 2022
    Assignee: Shanghai AVIC OPTO Electronics Co., Ltd.
    Inventors: Kerui Xi, Feng Qin, Jine Liu, Xiaohe Li, Tingting Cui, Yuan Ding
  • Patent number: 11222907
    Abstract: In an array substrate, an electronic paper display panel and a drive method thereof, and a display device, a display area includes multiple sub-display areas. A plurality of scanning lines in each sub-display area are electrically insulated from each other, corresponding scanning lines in different sub-display areas are electrically connected to each other and display time of each sub-display area is controlled through control signal lines. When a control chip and a flexible circuit board are employed, only a small number of control chips and/or flexible circuit boards, or even only one control chip and/or one flexible circuit board, may drive multiple sub-display areas to display pictures.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: January 11, 2022
    Assignee: SHANGHAI AVIC OPTO ELECTRONICS CO., LTD.
    Inventors: Kerui Xi, Tingting Cui, Feng Qin, Jine Liu, Xiaohe Li
  • Patent number: 11215897
    Abstract: Provided are an array substrate, an electronic paper display panel and a drive method thereof and a display device. A display area includes a plurality of sub-display areas, a plurality of data lines in each sub-display area are electrically insulated from each other, corresponding data lines in different sub-display areas are electrically connected to each other, and a control signal line is configured to control display time of each sub-display area. When a control chip and a flexible circuit board are employed, only a small number of control chips and flexible circuit boards may drive the plurality of sub-display areas to display pictures.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: January 4, 2022
    Assignee: Shanghai Tianma Micro-Electronics Co., Ltd.
    Inventors: Zuzhao Xu, Kerui Xi, Baiquan Lin, Xiaohe Li, Jine Liu, Feng Qin, Qiongqin Mao, Tinghai Wang, Mingwei Zhang
  • Publication number: 20210402879
    Abstract: Provided are a display panel and a vehicle. The display device includes a knob and a main display panel; the knob includes a first magnetic adhering piece; the display device further includes a second magnetic adhering structure, and the second magnetic adhering structure is disposed on a non-light exiting side of the main display panel; the second magnetic adhering structure includes a plurality of first magnetic adhering regions, and at least two first magnetic adhering regions are not overlapped; when the knob is magnetically adhered to any one of the plurality of first magnetic adhering regions, the knob is disposed on a light exiting side of the main display panel.
    Type: Application
    Filed: September 10, 2020
    Publication date: December 30, 2021
    Applicant: Shanghai AVIC OPTO Electronics Co., Ltd.
    Inventors: Ming WANG, Feng QIN
  • Publication number: 20210408680
    Abstract: A phase shifter and a manufacturing method thereof and an antenna and a manufacturing method thereof are provided. The phase shifter includes: first and second substrates opposite to each other; a first electrode provided on the first substrate and configured to receive a ground signal; a second electrode provided on a side of the second substrate facing towards the first substrate; liquid crystals encapsulated between the first substrate and the second substrate and driven by the first electrode and the second electrode to rotate; and a support structure provided between the first substrate and the second substrate and including a first spacer. The first spacer is located on a side of the second electrode facing away from the second substrate, and an orthographic projection of the first spacer on the second substrate is within an orthographic projection of the second electrode on the second substrate.
    Type: Application
    Filed: August 21, 2020
    Publication date: December 30, 2021
    Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
    Inventors: Kerui XI, Xuhui PENG, Feng QIN, Tingting CUI, Zhenyu JIA, Ping SU, Yuantao WU
  • Patent number: 11211654
    Abstract: The present disclosure relates to the technical field of energy storage devices, and in particular, to a battery module. The battery module includes a set of batteries, a case receiving the set of batteries, and a sampling unit for collecting a voltage signal and a temperature signal of the set of batteries. The sampling unit is provided with a connector, and a stopper for fixing the connector is formed on the case. By forming the stopper on the case, the connector can be directly assembled to the stopper during assembling process of the set of batteries without the need to fix the connector by glue or bolt connection. Therefore, not only an assembling process is simplified, but also the connector is not easily damaged during the assembling process.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: December 28, 2021
    Assignee: JIANGSU CONTEMPORARY AMPEREX TECHNOLOGY LIMITED
    Inventors: Hua Zhang, Feng Qin, Peng Wang, Zhiyi You, Liangyi Wang