Abstract: A power conversion module, a vehicle-mounted charger, and an electric vehicle may be used in the field of new energy vehicles. The power conversion module includes a power factor correction PFC module and a first direct current-direct current DC-DC converter. A first primary circuit of the first DC-DC converter has a first bridge arm, a second bridge arm, a third bridge arm, and a fourth bridge arm. A first switch is disposed between the first bridge arm and an inductor at an interface of the PFC module, and a second switch is disposed between the third bridge arm and another interface of the PFC module.

Abstract: A method, charging device, and non-transitory computer readable medium for detecting charging state comparing obtaining data packages from a chargeable electrical device, each of the data packages comprising a first transmitting power; counting a quantity of the data packages of the first transmitting power data package being smaller than a theoretical transmitting power in a predetermined time period; and based on the quantity of the data packages, determining whether the chargeable electrical device is fully charged.

Abstract: A method is disclosed to dynamically design acceleration units of neural networks. The method comprises steps of generating plural circuit description files through a neural network model; reading a model weight of the neural network model to determine a model data format of the neural network model; selecting one circuit description file from the plural circuit description files according to the model data format, so that the chip is reconfigured according to the selected circuit description file to form an acceleration unit adapted to the model data format. The acceleration unit is suitable for running a data segmentation algorithm, which may accelerate the inference process of the neural network model. Through this method the chip may be dynamically reconfigured into an efficient acceleration unit for the different model data format, thereby speeding up the inference process of the neural network model.

Abstract: Systems and methods for upgrading the firmware of a wireless communication device (202). A wireless communication device (202) may comprise a first processor (204) and a first memory (206) configured to receive monitored data from one or more sensors (210), and wirelessly communicate the received monitored data.

Abstract: According to one aspect of the present disclosure, there is provided an apparatus that includes a battery, a Direct Current (DC) bus connected to the battery, and a DC to DC converter connected to the battery in parallel with the DC bus. A Motor Control Unit (MCU) is connected between the DC to DC converter and an electric motor. An Alternating Current (AC) port is connected to the electric motor. Switches connect the DC bus and an output of the DC to DC converter in series as an input to the MCU in a drive mode and disconnect the DC bus from the MCU in a charge mode.

Abstract: A power conversion module, a vehicle-mounted charger, and an electric vehicle may be used in the field of new energy vehicles. The power conversion module includes a power factor correction PFC module and a first direct current-direct current DC-DC converter. A first primary circuit of the first DC-DC converter has a first bridge arm, a second bridge arm, a third bridge arm, and a fourth bridge arm. A first switch is disposed between the first bridge arm and an inductor at an interface of the PFC module, and a second switch is disposed between the third bridge arm and another interface of the PFC module.

Abstract: A package structure includes a redistribution layer having an upper surface and a lower surface opposite to each other, in which the redistribution layer has at least one recess on its lower surface, an electronic element disposed on the upper surface of the redistribution layer, at least one first conductive ball disposed on the at least one recess of the redistribution layer, in which a portion of the at least one first conductive ball is filled into the at least one recess, and a plurality of second conductive balls disposed on the lower surface of the redistribution layer. The height of the first conductive ball is larger than the height of each of the second conductive balls in a direction perpendicular to the lower surface of the redistribution layer.

Abstract: A semiconductor package with an internal heat sink has a substrate, a chip and an encapsulation. The substrate has an embedded heat sink, a first wiring surface and a second wiring surface. The embedded heat sink has a first surface and a second surface. The second wiring surface of the substrate and the second surface of the heat sink are coplanar. The chip has an active surface and a rear surface mounted on the first surface of heat sink through a thermal interface material layer and the active surface is electrically connected to the first wiring surface of the substrate. The encapsulation is formed on the first wiring surface of the substrate and the encapsulation encapsulates the chip. The heat generated from the chip is quickly transmitted to the heat sink and dissipated to air through the heat sink. Therefore, a heat dissipation performance of the semiconductor package is increased.

Abstract: A wireless signal transceiving system includes includes a first wireless signal transceiver device and a second wireless signal transceiver device. The first wireless signal transceiver device and the second wireless signal transceiver device are configured to establish an assimilation link to become a pseudo single device through an assimilation process, and to establish a wireless link between the pseudo single device with an electronic device. After the pseudo single device receives a first packet wirelessly transmitted by the electronic device, the pseudo single device transmits an second packet to the electronic device.

Abstract: A wireless signal transceiving system includes includes a first wireless signal transceiver device and a second wireless signal transceiver device. The first wireless signal transceiver device and the second wireless signal transceiver device are configured to establish an assimilation link to become a pseudo single device through an assimilation process, and to establish a wireless link between the pseudo single device with an electronic device. After the pseudo single device receives a first packet wirelessly transmitted by the electronic device, the pseudo single device transmits an second packet to the electronic device.

Abstract: Frequency selective analog front-end circuitry, used to convert a sensed charge signal to an analog voltage is disclosed. In one aspect, the frequency selective analog front-end circuitry includes an op-amp having an output, an inverting input and a noninverting input, a first resistor connected between the terminal of the first capacitor and the inverting input of the op-amp, a second capacitor connected between the output of the op-amp and the inverting input of the op-amp, a second resistor connected between the output of the op-amp and the inverting input of the op-amp, a third capacitor connected between the terminal of the first capacitor and the noninverting input of the op-amp, and a third resistor connected between the noninverting input of the op-amp and a reference voltage.

Abstract: A semiconductor device package has a die, a pattern of dielectric material formed on an active surface of the die, a plurality of metal contacts electrically connected to the die and surrounded by the pattern, a mold compound formed around the pattern, the die and the metal contacts, and a redistribution layer formed on a grinded surface of the mold compound and electrically connected to the metal contacts. The dielectric material has a young's modulus lower than a young's modulus of the mold compound, and the dielectric material has a coefficient of thermal expansion lower than a coefficient of thermal expansion of the mold compound.

Abstract: A chip structure including a chip and a redistribution layer is provided. The chip includes a plurality of pads. The redistribution layer includes a dielectric layer and a plurality of conductive traces. The dielectric layer is disposed on the chip and has a plurality of contact windows located above the pads. The conductive traces are located on the dielectric layer and are electrically coupled to the pads through the contact windows. At least one of the conductive traces includes a body and at least one protrusion coupled to the body, and the at least one protrusion is coupled to an area of the body other than where the contact windows are coupled to on the body.

Abstract: A driving state warning method is used for judging a driving state by a vehicle path of a vehicle. An image recognizing step is for providing an image capturing device to capture an image and recognize a lane marking of a vehicle lane according to the image. A vehicle speed judging step is for providing a vehicle speed capturing device to judge an actual vehicle speed. A crossing lane judging step is for providing a processing unit to judge whether or not the vehicle is crossing the lane marking according to the image. A consciousness judging step is for calculating a displacement of the vehicle according to the image by the processing unit and comparing whether or not the displacement is greater than a threshold value for judging consciousness of the driver. Therefore, the present disclosure can easily perform installations without any directional light detecting device.

Abstract: A chip structure including a chip and a redistribution layer is provided. The chip includes a plurality of pads. The redistribution layer includes a dielectric layer and a plurality of conductive traces. The dielectric layer is disposed on the chip and has a plurality of contact windows located above the pads. The conductive traces are located on the dielectric layer and are electrically coupled to the pads through the contact windows. At least one of the conductive traces includes a body and at least one protrusion coupled to the body, and the at least one protrusion is coupled to an area of the body other than where the contact windows are coupled to on the body.