Patents by Inventor Feng-Wei Kuo
Feng-Wei Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240361530Abstract: An optical coupler is provided. The optical coupler includes: a first optical structure, and a second optical structure disposed over the first optical structure. The first optical structure includes: a first substrate, a first cladding layer disposed on the first substrate, and a first waveguide disposed on the first cladding layer. The first waveguide includes a first coupling portion, and the first coupling portion including a first taper part. The second optical structure includes: a second substrate, a dielectric layer disposed on the second substrate; and a second waveguide disposed on the dielectric layer. The second waveguide includes a second coupling portion, and the second coupling portion including a second taper part. The second taper part is disposed on and optically coupled with the first taper part, and a taper direction of the first taper part is the same as a taper direction of the second taper part.Type: ApplicationFiled: July 8, 2024Publication date: October 31, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Feng-Wei KUO, Chewn-Pu Jou, Cheng-Tse Tang, Hung-Yi Kuo
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Publication number: 20240355769Abstract: A method and a system for verifying an integrated circuit stack having at least one silicon photonic device is introduced. A dummy layer and a dummy layer text are added to a terminal of at least one silicon photonic device of the integrated circuit. The method may perform a layout versus schematic check of the integrated circuit including the dummy layer and the dummy layer text.Type: ApplicationFiled: July 2, 2024Publication date: October 24, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Feng-Wei Kuo, Hui-Yu Lee
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Patent number: 12124119Abstract: An optical modulator includes a carrier and a waveguide disposed on the carrier. The waveguide includes a first optical coupling region, a second optical coupling region, first regions, and second regions. The first optical coupling region is doped with first dopants. The second optical coupling region abuts the first optical coupling region and is doped with second dopants. The first dopants and the second dopants are of different conductivity type. The first regions are doped with the first dopants and are arrange adjacent to the first optical coupling region. The first regions have respective increasing doping concentrations as distances of the first regions increase from the first optical coupling region. The second regions are doped with the second dopants and are arranged adjacent to the second optical coupling region. The second regions have respective increasing doping concentrations as distances of the second regions increase from the second optical coupling region.Type: GrantFiled: February 8, 2023Date of Patent: October 22, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Lan-Chou Cho, Chewn-Pu Jou, Feng-Wei Kuo, Huan-Neng Chen, Min-Hsiang Hsu
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Publication number: 20240337528Abstract: A device includes a scattering structure and a collection structure. The scattering structure is arranged to concurrently scatter incident electromagnetic radiation along a first scattering axis and along a second scattering axis. The first scattering axis and the second scattering axis are non-orthogonal. The collection structure includes a first input port aligned with the first scattering axis and a second input port aligned with the second scattering axis. A method includes scattering electromagnetic radiation along a first scattering axis to create first scattered electromagnetic radiation and along a second scattering axis to create second scattered electromagnetic radiation. The first scattering axis and the second scattering axis are non-orthogonal. The first scattered electromagnetic radiation is detected to yield first detected radiation and the second scattered electromagnetic radiation is detected to yield second detected radiation.Type: ApplicationFiled: June 20, 2024Publication date: October 10, 2024Inventors: Chewn-Pu JOU, Feng Wei KUO, Huan-Neng CHEN, Lan-Chou CHO
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Publication number: 20240329304Abstract: An optical attenuating structure is provided. The optical attenuating structure includes a substrate, a waveguide, doping regions, an optical attenuating member, and a dielectric layer. The waveguide is extended over the substrate. The doping regions are disposed over the substrate, and include a first doping region, a second doping region opposite to the first doping region and separated from the first doping region by the waveguide, a first electrode extended over the substrate and in the first doping region, and a second electrode extended over the substrate and in the second doping region. The first optical attenuating member is coupled with the waveguide and disposed between the waveguide and the first electrode. The dielectric layer is disposed over the substrate and covers the waveguide, the doping regions and the first optical attenuating member.Type: ApplicationFiled: March 29, 2023Publication date: October 3, 2024Inventors: HUAN-NENG CHEN, FENG-WEI KUO, MIN-HSIANG HSU, LAN-CHOU CHO, CHEWN-PU JOU, WEN-SHIANG LIAO
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Patent number: 12105324Abstract: Disclosed are apparatuses for optical coupling and a system for communication. In one embodiment, an apparatus for optical coupling having an optical coupling region is disclosed. The apparatus for optical coupling includes a substrate and a core layer disposed on the substrate. The core layer includes a plurality of holes located in the optical coupling region. An effective refractive index of the core layer gradually decrease from a first end of the optical coupling region to a second end of the optical coupling region.Type: GrantFiled: July 28, 2023Date of Patent: October 1, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Feng-Wei Kuo, Chewn-Pu Jou
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Patent number: 12095711Abstract: An integrated circuit includes first through fourth devices positioned over one or more substrates, a first radio frequency interconnect (RFI) including a first transmitter included in the first device, a first receiver included in the second device, and a first guided transmission medium coupled to each of the first transmitter and the first receiver, a second RFI including a second transmitter included in the first device, a second receiver included in the third device, and a second guided transmission medium coupled to each of the second transmitter and the second receiver, and a third RFI including a third transmitter included in the first device, a third receiver included in the fourth device, and the second guided transmission medium coupled to each of the third transmitter and the third receiver.Type: GrantFiled: March 27, 2023Date of Patent: September 17, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Huan-Neng Chen, William Wu Shen, Chewn-Pu Jou, Feng Wei Kuo, Lan-Chou Cho, Tze-Chiang Huang, Jack Liu, Yun-Han Lee
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Patent number: 12078845Abstract: An optical coupler is provided. The optical coupler includes: a first optical structure, and a second optical structure disposed over the first optical structure. The first optical structure includes: a first substrate, a first cladding layer disposed on the first substrate, and a first waveguide disposed on the first cladding layer. The first waveguide includes a first coupling portion, and the first coupling portion including a first taper part. The second optical structure includes: a second substrate, a dielectric layer disposed on the second substrate; and a second waveguide disposed on the dielectric layer. The second waveguide includes a second coupling portion, and the second coupling portion including a second taper part. The second taper part is disposed on and optically coupled with the first taper part, and a taper direction of the first taper part is the same as a taper direction of the second taper part.Type: GrantFiled: March 3, 2023Date of Patent: September 3, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Feng-Wei Kuo, Chewn-Pu Jou, Cheng-Tse Tang, Hung-Yi Kuo
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Patent number: 12074125Abstract: A semiconductor package includes a first semiconductor device, a second semiconductor device vertically positioned above the first semiconductor device, and a ground shielded transmission path. The ground shielded transmission path couples the first semiconductor device to the second semiconductor device. The ground shielded transmission path includes a first signal path extending longitudinally between a first end and a second end. The first signal path includes a conductive material. A first insulating layer is disposed over the signal path longitudinally between the first end and the second end. The first insulating layer includes an electrically insulating material. A ground shielding layer is disposed over the insulating material longitudinally between the first end and the second end of the signal path. The ground shielding layer includes a conductive material coupled to ground.Type: GrantFiled: March 21, 2023Date of Patent: August 27, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Feng Wei Kuo, Wen-Shiang Liao, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho, William Wu Shen
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Publication number: 20240280765Abstract: A package structure comprises photonic dies and an interposer structure. Each photonic die includes a dielectric layer and a first grating coupler embedded in the dielectric layer. The interposer structure is disposed below the photonic dies. The interposer structure includes an oxide layer and a second grating coupler embedded in the oxide layer. The photonic dies are optically coupled through the first grating couplers of the photonic dies and the second grating coupler of the interposer structure.Type: ApplicationFiled: May 1, 2024Publication date: August 22, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Feng-Wei KUO, Chewn-Pu Jou, Hsing-Kuo Hsia, Chih-Wei TSENG
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Patent number: 12066658Abstract: An integrated optical device includes a substrate, a waveguide structure and a grating structure. The substrate has a waveguide region and a grating region adjacent to each other. The waveguide structure is disposed on the substrate in the waveguide region. The grating structure is disposed on the substrate in the grating region. In some embodiments, the grating structure includes grating bars and grating intervals arranged alternately, and widths of the grating bars of the grating structure are varied.Type: GrantFiled: April 21, 2022Date of Patent: August 20, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Feng-Wei Kuo, Wen-Shiang Liao
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Patent number: 12068269Abstract: A method and a system for verifying an integrated circuit stack having a silicon photonic (SIPH) device is introduced. A single first dummy layer is added to at least one terminal of the SIPH device in a first layout of the first integrated circuit, wherein a shape of the single first dummy layer added to the at least one terminal of the SIPH device maps a shape of the at least one terminal of the SIPH device. A first layout versus schematic (LVS) check is performed on the first integrated circuit based on the single first dummy layer added to the at least one terminal of the SIPH device to verify a connection of the SIPH device in the first integrated circuit.Type: GrantFiled: April 25, 2023Date of Patent: August 20, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Feng-Wei Kuo, Hui-Yu Lee
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Patent number: 12066662Abstract: Disclosed are apparatuses for optical coupling and a system for communication. In one embodiment, an apparatus for optical coupling including a substrate and a grating coupler is disclosed. The grating coupler is disposed on the substrate and includes a plurality of coupling gratings arranged along a first direction, wherein effective refractive indices of the plurality of coupling gratings gradually decrease along the first direction.Type: GrantFiled: June 14, 2023Date of Patent: August 20, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Feng-Wei Kuo, Wen-Shiang Liao, Robert Bogdan Staszewski, Jianglin Du
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Patent number: 12062629Abstract: Systems and methods are provided for an integrated chip. An integrated chip includes a package substrate including a plurality of first layers and a plurality of second layers, each second layer being disposed between a respective adjacent pair of the first layers. A transceiver unit is disposed above the package substrate. A waveguide unit including a plurality of waveguides having top and bottom walls formed in the first layers of the package substrate and sidewalls formed in the second layers of the package substrate.Type: GrantFiled: August 31, 2017Date of Patent: August 13, 2024Assignees: Taiwan Semiconductor Manufacturing Company Limited, The University of California, Los Angeles (UCLA)Inventors: Huan-Neng Chen, Chewn-Pu Jou, Feng Wei Kuo, Lan-Chou Cho, Wen-Shiang Liao, Yanghyo Kim
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Publication number: 20240266296Abstract: An integrated circuit package integrates a photonic die (oDie) and an electronic die (eDie). More specifically, the integrated circuit package may include a plurality of redistribution layers communicatively coupled to at least one of the oDie and/or the eDie, where molded material at least partially surrounds the at least one of the oDie and/or the eDie.Type: ApplicationFiled: February 13, 2024Publication date: August 8, 2024Inventors: Feng Wei Kuo, Chewn-Pu Jou, Shuo-Mao Chen
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Publication number: 20240232499Abstract: A method and system for generating a physical layout for a grating coupler integrated in a photonically-enabled circuit are disclosed herein. In some embodiments, the method receives a parametrized wavelength, a parametrized first refractive index, a parametrized second refractive index, a parametrized taper length, a parametrized width, a parametrized grating length, and a parametrized incident angle of the optical beam incident onto the grating coupler and generates a physical layout for the grating coupler based on the received parametrized inputs, the generating of the physical layout is according to a predefined model, and outputs the physical layout of the grating coupler for manufacturing under a semiconductor fabrication process.Type: ApplicationFiled: February 16, 2024Publication date: July 11, 2024Inventors: Feng-Wei KUO, Wen-Shiang LIAO
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Patent number: 12027478Abstract: A method of forming a semiconductor structure includes forming a first redistribution structure including a first conductive pattern. The method further includes placing a die over the first redistribution structure. The method further includes disposing a molding material over the first redistribution structure to surround the die. The method further includes removing a portion of the molding material to form an opening. The method further includes disposing a dielectric material into the opening to form a dielectric member. The method further includes forming a second redistribution structure over the molding material and the dielectric member, wherein the second redistribution structure includes an antenna structure over the dielectric member and electrically connected to the die.Type: GrantFiled: June 22, 2022Date of Patent: July 2, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Feng-Wei Kuo, Wen-Shiang Liao
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Publication number: 20240210619Abstract: A device includes a dielectric layer, a plurality of grating structures, and a dielectric material between the plurality of grating structures and on top of the plurality of grating structures. The grating structures are arranged on the dielectric layer and separated from each other, the plurality of grating structures each having a bottom portion and top portion, the top portion having a first width and the bottom portion having a second width, the second width being larger than the first width.Type: ApplicationFiled: March 6, 2024Publication date: June 27, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Feng-Wei KUO, Chewn-Pu JOU, Hsing-Kuo Hsia
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Publication number: 20240210617Abstract: A thermally tunable waveguide including an optical waveguide and a heater is provided. The optical waveguide includes a phase shifter. The heater is disposed over the optical waveguide. The heater includes a heating portion, pad portions and tapered portions. The heating portion overlaps with the phase shifter of the optical waveguide. The pad portions are disposed aside of the heating portion. Each of the pad portions is connected to the heating portion through one of the tapered portions respectively.Type: ApplicationFiled: March 7, 2024Publication date: June 27, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Feng-Wei KUO, Wen-Shiang Liao
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Publication number: 20240210628Abstract: A device for optical signal processing includes a first layer, a second layer and a waveguiding layer. A lens is disposed within the first layer and adjacent to a surface of the first layer. The second layer is underneath the first layer and adjacent to another surface of the first layer. The waveguiding layer is located underneath the second layer and configured to waveguide a light beam transmitted in the waveguiding layer. A grating coupler is disposed over the waveguiding layer. The lens is configured to receive, from one of the grating coupler or a light-guiding element, the light beam, and focus the light beam towards another one of the light-guiding element or the grating coupler.Type: ApplicationFiled: March 7, 2024Publication date: June 27, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Feng-Wei KUO, Hsing-Kuo HSIA, Chewn-Pu JOU