Abstract: Methods, systems, and apparatuses for a power card for use in a vehicle. The power card includes an N lead frame, a P lead frame, and an O lead frame each having a body portion and a terminal portion. The O lead frame is located between the N lead frame and the P lead frame. The power card includes a first power device located between the N lead frame and the O lead frame, with a first side coupled to the body portion of the N lead frame and a second side coupled to the body portion of the O lead frame. The power card includes a second power device located between the O lead frame and the P lead frame, with a first side coupled to the body portion of the O lead frame and a second side coupled to the body portion of the P lead frame.

Abstract: CD73 (also known as ecto-5?-nucleotidase) inhibitor compounds are provided, as well as compositions and uses thereof for treating or preventing CD73-associated or related diseases, disorders and conditions, including cancer- and immune-related disorders. CD73 inhibitor compounds include compounds having the structure set forth in Formula I and pharmaceutically acceptable esters or salts thereof.

Abstract: The present disclosure relates to a backlight module, a display module and an assembling method thereof. The backlight module includes: a backplane; a fixing member fixedly connected to the backplane; and an insertion clamp including a mounting portion fixedly connected to the fixing member, and a clamping portion for clamping to a circuit board inserted between the fixing member and the insertion clamp.

Abstract: A double-sided cold plate includes a manifold comprising openings extending from a first surface of the manifold through the manifold to a second surface of the manifold forming recesses within the manifold and an inlet channel and an outlet channel fluidly coupled to the recesses within the manifold, a plurality of first heat sinks coupled to the first surface of the manifold enclosing the openings on the first surface, and a plurality of second heat sinks positioned adjacent each other along a length of the manifold and coupled to the second surface of the manifold, enclosing the openings on the second surface, a width of the plurality of second heat sinks is greater than a width of the manifold thereby forming an overhanging portion on each lengthwise side of the manifold, the overhanging portion configured to mechanically support a plurality of electrical components positioned around a perimeter of the manifold.

Abstract: Printed circuit board (PCB) substrates include at least one pre-preg layer interposed between one or more electrically conductive layers, power device stacks, each having a power device embedded within the PCB substrate in a vertical stack configuration, and a flat heat pipe positioned between the power device stacks within the at least one pre-preg layer, one surface of the flat heat pipe directly bonded to a first one of the power device stacks and an opposite surface of the flat heat pipe thermally coupled to a second one of the power device stacks.

Abstract: A circuit board assembly includes a printed circuit board (PCB) substrate, a cooling assembly, an intermediate layer, one or more power devices, and a plurality of conductive layers arranged within the PCB substrate. The PCB substrate has a first surface and an opposite second surface that has a first electrical pattern. The cooling assembly is thermally coupled to the second surface of the PCB substrate. The intermediate layer is sandwiched between the PCB substrate and the cooling assembly. The one or more power devices are embedded within the PCB substrate. The plurality of conductive layers are configured to electrically couple the one or more power devices and thermally couple the one or more power devices to the cooling assembly. At least a portion of the intermediate layer has a second electrical pattern that is similarly patterned to the first electrical pattern of the second surface of the PCB substrate.

Abstract: The present disclosure relates to the field of cable processing apparatus and discloses a cable radial cutting system and a reaction force cone processing apparatus with the cable radial cutting system. The cable radial cutting system includes a cutting bracket, a planetary gear set, a first driving piece and a second driving piece which are mounted on the cutting bracket, and a cutting tool driven by the planetary gear set to rotate and move radially, where the first driving piece and the second driving piece jointly drive the planetary gear set to rotate.

Abstract: A power device assembly includes a heat-generating device, one or more porous bonding layers, and one or more cap layers. The one or more porous bonding layers are formed on a surface of the heat-generating device and define a plurality of embedded vapor channels. The one or more cap layers are engaged with a porous bonding layer of the one or more porous bonding layers opposite the heat-generating device. The one or more cap layer comprise a plurality of liquid feed channels for feeding cooling fluid to the heat-generating device via the porous bonding layer.

Abstract: The present invention provides a waterborne self-polishing antifouling paint and a preparation method and application thereof, and belongs to the technical field of marine antifouling paints. The waterborne self-polishing antifouling paint provided by the present invention includes the following components in parts by weight: 30-60 parts of waterborne self-polishing emulsion, 30-70 parts of waterborne slurry, 0.1-0.5 parts of waterborne leveling agent, 0.2-1 parts of waterborne defoamer, 0.5-1 parts of film-forming additive and 10-20 parts of water. The waterborne self-polishing antifouling paint provided by the present invention has an ultra-low content of volatile organic compounds (VOCs) (less than 20 g/L), and is environmentally friendly. The waterborne self-polishing antifouling paint can be formed into a paint film with good mechanical properties, stable self-polishing rate, and excellent water immersion resistance and antifouling performance.

Abstract: A resistor-capacitor (RC) oscillator with shared circuit architecture includes a current mirror circuit, a comparator circuit, a bias voltage generator, and a clock buffer. The current mirror circuit utilizes a plurality of transistors to perform current control, to adjust a second current on a second current path according to a first current on a first current path. The comparator circuit includes a first transistor, a second transistor, a resistor, and a capacitor, wherein a comparison result signal generated by the comparator circuit corresponds to a voltage of the capacitor. The bias voltage generator generates a bias voltage as a comparator reference voltage between the first transistor and the resistor. The clock buffer buffers the comparison result signal to generate an output signal. The bias voltage generator at least shares the resistor with the comparator circuit, and the RC oscillator may achieve targets of low cost and high performance.

Abstract: A thin gauge wear-resistant steel sheet, including the following chemical elements expressed in percentage by weight: 0.15-0.20 wt. % of carbon; 1.2-1.8 wt. % of manganese; 0.1-0.40 wt. % of copper; 0.15-0.30 wt. % of molybdenum; 0.20-0.40 wt. % of chromium; 0.03-0.06 wt. % of niobium; 0.01-0.03 wt. % of titanium; 0.0006-0.0015 wt. % boron; less than 0.015 wt. % of phosphorus; less than 0.010 wt. % of sulphur; and the balance being ferrum and unavoidable impurities, wherein the thickness of the steel sheet is in a range of 3.0 to 8 mm.

Abstract: A two-phase cold plate includes an outer enclosure having a fluid inlet and a fluid outlet each fluidly coupled to a fluid pathway, an inner enclosure having a vapor cavity and a vapor outlet, and one or more wicking structures disposed in the outer enclosure. The one or more wicking structures fluidly couple the fluid pathway of the outer enclosure with the vapor cavity of the inner enclosure and the one or more wicking structures comprise a plurality of nucleation sites configured to induce vaporization of a cooling fluid and facilitate vapor flow into the vapor cavity of the inner enclosure.

Abstract: Disclosed are a light module and a mobile terminal. The light module includes: a support body, substrate, and light-transmitting element. The support body has a light path channel. The substrate is connected to the support body, is located at one end of the light path channel, and has a light source located in the light path channel. The light-transmitting element is connected to the support body, to seal an opening at the other end of the light path channel. A side face of the light-transmitting element that faces the light source has first and second electrical contact points, and a photosensitive coating capable of converting light energy into electrical energy; the first and second electrical contact points are electrically connected by the photosensitive coating, and are configured to connect to a detection module, so that the detection module detects a voltage across the first and second electrical contact points.

Abstract: The present disclosure relates to a backlight module, a display module and an assembling method thereof. The backlight module includes: a backplane; a fixing member fixedly connected to the backplane; and an insertion clamp including a mounting portion fixedly connected to the fixing member, and a clamping portion for clamping to a circuit board inserted between the fixing member and the insertion clamp.

Abstract: An electronic device includes: a display screen; a main processing chip configured to output first display data; and a co-processing chip configured to output second display data; wherein the co-processing chip includes a switching module, the switching module is electrically connected to the display screen, and the switching module is configured to output the first display data to the display screen according to control of the co-processing chip to control the display screen to work in a first display mode or configured to output the second display data to the display screen to control the display screen to work in a second display mode; and the main processing chip is further configured to enter a hibernate state when the display screen works in the second display mode. A co-processing chip is further provided.

Abstract: A cold plate having a manifold includes a recess extending from a first side to a second side of the manifold, where the recess includes openings to the recess positioned lengthwise along the first side and a single opening to the recess on the second side, an inlet and an outlet fluidly coupled to the recess, a plurality of plates fastened to the first side enclosing the openings, a heat sink fastened to the second side enclosing the single opening on the second side, and a plurality of fluid cores one of each positioned between each of the plurality of plates and the heat sink. The plurality of fluid cores include a flow distribution insert, a first plate fin positioned between the flow distribution insert and the heat sink fastened to the second side, and a second plate fin positioned between the flow distribution insert and the heat sink.

Abstract: Methods, systems, and apparatuses for a power card for use in a vehicle. The power card includes an N lead frame, a P lead frame, and an O lead frame each having a body portion and a terminal portion, with the O lead frame located between the N lead frame and the P lead frame. The power card includes a first power device being located on a first side of the O lead frame and a second power device being located on a second side of the O lead frame, the body portion of the O lead frame having one or more channels configured to receive a cooling liquid for cooling the first power device and the second power device.

Abstract: A method of forming a device on a substrate with recessed first/third areas relative to a second area by forming a fin in the second area, forming first source/drain regions (with first channel region therebetween) by first/second implantations, forming second source/drain regions in the third area (defining second channel region therebetween) by the second implantation, forming third source/drain regions in the fin (defining third channel region therebetween) by third implantation, forming a floating gate over a first portion of the first channel region by first polysilicon deposition, forming a control gate over the floating gate by second polysilicon deposition, forming an erase gate over the first source region and a device gate over the second channel region by third polysilicon deposition, and forming a word line gate over a second portion of the first channel region and a logic gate over the third channel region by metal deposition.

Abstract: A method and an apparatus for generating vehicle damage information are provided. The method includes: acquiring a to-be-processed vehicle image; for a target detection model in at least one pre-trained target detection model: inputting the vehicle image to the target detection model to generate a suspected damage area detection result; and determining a location of a suspected damage area in the vehicle image based on the generated suspected damage area detection result. A mechanism for detecting a suspected damage area is provided based on the target detection model, improving the vehicle damage assessment efficiency.

Abstract: An optical path test system includes a return light test unit for emitting laser light to an optical path monitoring unit to simulate return light received by the optical path monitoring unit in a normal operation; a light path monitoring unit arranged on a light path of the return light testing unit for receiving the return light and normally emitting laser light; and a power detector for receiving the laser light emitted by the light path monitoring unit so as to monitor stability of output power of the chip when the light path monitoring unit receives the return light emitted by the return light testing unit. The technical solution in the present invention emits laser light to a tested laser chip to simulate return light received by the tested laser chip in a normal operation, and a return light resistance threshold of the laser chip can be accurately evaluated.