Abstract: A method for a packaged leadless semiconductor device including a heat sink flange to which semiconductor dies are coupled using a high temperature die attach process. The semiconductor device further includes a frame structure pre-formed with bent terminal pads. The frame structure is combined with the flange so that a lower surface of the flange and a lower section of each terminal pad are in coplanar alignment, and so that an upper section of each terminal pad overlies the flange. Interconnects interconnect the die with the upper section of the terminal pad. An encapsulant encases the frame structure, flange, die, and interconnects with the lower section of each terminal pad and the lower surface of the flange remaining exposed from the encapsulant.

Abstract: A packaged semiconductor device may include a leadframe and a die carrier mounted to the leadframe. The die carrier is formed from an electrically and thermally conductive material. A die is mounted to a surface of the die carrier with die attach material having a melting point in excess of 240° C. A method may include providing the die carrier, melting the die attach material at a temperature in excess of 240° C. to attach the die to the surface of the die carrier to form a sub-assembly, attaching the sub-assembly to a leadframe, electrically interconnecting the die and the leadframe, and enclosing at least portions of the die and the leadframe to form a packaged device.

Abstract: A system and method for packaging a semiconductor device that includes a wall to reduce electromagnetic coupling is presented. A semiconductor device has a substrate on which a first circuit and a second circuit are formed proximate to each other. An isolation wall of electrically conductive material is located between the first circuit and the second circuit, the isolation wall being configured to reduce inductive coupling between the first and second circuits during an operation of the semiconductor device. Several types of isolation walls are presented.

Abstract: A packaged semiconductor device may include a leadframe and a die carrier mounted to the leadframe. The die carrier is formed from an electrically and thermally conductive material. A die is mounted to a surface of the die carrier with die attach material having a melting point in excess of 240° C. A first electrical interconnect couples the die and the leadframe. A housing covers portions of the leadframe, die carrier, die and first electrical interconnect.

Abstract: A bond pad region is provided that reduces parasitic capacitance generated between bond pad metallization and underlying silicon by reducing the effective area of the bond pad, while maintaining flexibility of wire bond sites and ensuring mechanical integrity of the wire bonds. Embodiments provide, in a region that would be populated by a traditional bus bar bond pad, a small bus bar bond pad that is less than half the area of the region and populating at least a portion of the remaining area with metal tiles that are not electrically connected to the small bus bar bond pad or to each other. The metal tiles provide an attachment area for at least a portion of one or more wire bonds. Only those tiles involved in connection to a wire bond contribute to parasitic capacitance, along with the small bus bar pad.

Abstract: A packaged semiconductor device may include a termination surface having terminations configured as leadless interconnects to be surface mounted to a printed circuit board. A first flange has a first surface and a second surface. The first surface provides a first one of the terminations, and the second surface is opposite to the first surface. A second flange also has a first surface and a second surface, with the first surface providing a second one of the terminations, and the second surface is opposite to the first surface. A die is mounted to the second surface of the first flange with a material having a melting point in excess of 240° C. An electrical interconnect extends between the die and the second surface of the second flange opposite the termination surface, such that the electrical interconnect, first flange and second flange are substantially housed within a body.

Abstract: A bond pad region is provided that reduces parasitic capacitance generated between bond pad metallization and underlying silicon by reducing the effective area of the bond pad, while maintaining flexibility of wire bond sites and ensuring mechanical integrity of the wire bonds. Embodiments provide, in a region that would be populated by a traditional bus bar bond pad, a small bus bar bond pad that is less than half the area of the region and populating at least a portion of the remaining area with metal tiles that are not electrically connected to the small bus bar bond pad or to each other. The metal tiles provide an attachment area for at least a portion of one or more wire bonds. Only those tiles involved in connection to a wire bond contribute to parasitic capacitance, along with the small bus bar pad.

Abstract: A packaged semiconductor device may include a termination surface having terminations configured as leadless interconnects to be surface mounted to a printed circuit board. A first flange has a first surface and a second surface. The first surface provides a first one of the terminations, and the second surface is opposite to the first surface. A second flange also has a first surface and a second surface, with the first surface providing a second one of the terminations, and the second surface is opposite to the first surface. A die is mounted to the second surface of the first flange with a material having a melting point in excess of 240° C. An electrical interconnect extends between the die and the second surface of the second flange opposite the termination surface, such that the electrical interconnect, first flange and second flange are substantially housed within a body.

Abstract: A packaged leadless semiconductor device (20) includes a heat sink flange (24) to which semiconductor dies (26) are coupled using a high temperature die attach process. The semiconductor device (20) further includes a frame structure (28) pre-formed with bent terminal pads (44). The frame structure (28) is combined with the flange (24) so that a lower surface (36) of the flange (24) and a lower section (54) of each terminal pad (44) are in coplanar alignment, and so that an upper section (52) of each terminal pad (44) overlies the flange (24). Interconnects (30) interconnect the die (26) with the upper section (52) of the terminal pad (44). An encapsulant (32) encases the frame structure (28), flange (24), die (26), and interconnects (30) with the lower section (54) of each terminal pad (44) and the lower surface (36) of the flange (24) remaining exposed from the encapsulant (32).

Abstract: A packaged semiconductor device may include a leadframe and a die carrier mounted to the leadframe. The die carrier is formed from an electrically and thermally conductive material. A die is mounted to a surface of the die carrier with die attach material having a melting point in excess of 240° C. A first electrical interconnect couples the die and the leadframe. A housing covers portions of the leadframe, die carrier, die and first electrical interconnect.

Abstract: A packaged semiconductor device may include a termination surface having terminations configured as leadless interconnects to be surface mounted to a printed circuit board. A first flange has a first surface and a second surface. The first surface provides a first one of the terminations, and the second surface is opposite to the first surface. A second flange also has a first surface and a second surface, with the first surface providing a second one of the terminations, and the second surface is opposite to the first surface. A die is mounted to the second surface of the first flange with a material having a melting point in excess of 240° C. An electrical interconnect extends between the die and the second surface of the second flange opposite the termination surface, such that the electrical interconnect, first flange and second flange are substantially housed within a body.

Abstract: A packaged leadless semiconductor device (20) includes a heat sink flange (24) to which semiconductor dies (26) are coupled using a high temperature die attach process. The semiconductor device (20) further includes a frame structure (28) pre-formed with bent terminal pads (44). The frame structure (28) is combined with the flange (24) so that a lower surface (36) of the flange (24) and a lower section (54) of each terminal pad (44) are in coplanar alignment, and so that an upper section (52) of each terminal pad (44) overlies the flange (24). Interconnects (30) interconnect the die (26) with the upper section (52) of the terminal pad (44). An encapsulant (32) encases the frame structure (28), flange (24), die (26), and interconnects (30) with the lower section (54) of each terminal pad (44) and the lower surface (36) of the flange (24) remaining exposed from the encapsulant (32).

Abstract: A cleaning apparatus includes a bracket assembly for securely attaching a handle to a block. The bracket assembly aids in securing the handle in a fixed position during use so that the handle will not loosen and/or disengage with use. The bracket assembly may include one or more flanges for engaging multiple sides of the block. The handle and the bracket assembly may be configured to allow the handle to be reversed so that it extends first from the back face of the block and then from the front face of the block.

Abstract: A cleaning apparatus includes a bracket assembly for securely attaching a handle to a block. The bracket assembly aids in securing the handle in a fixed position during use so that the handle will not loosen and/or disengage with use. The bracket assembly may include one or more flanges for engaging multiple sides of the block. The handle and the bracket assembly may be configured to allow the handle to be reversed so that it extends first from the back face of the block and then from the front face of the block.

Abstract: A centrifugally activated device for controlling the speed of movement of an elevator cab includes the capability of controlling upward and downward movement. A first stopping device is associated with at least one elevator sheave. A second stopping device preferably is supported on an opposite side of the same sheave. The second stopping device preferably includes centrifugally activated components such as a latch member that moves from a first position into a second, stopping position responsive to an undesirably high speed of upward movement of the elevator cab. The centrifugally activated components preferably include a latch member that is rotatably supported on the sheave and has an engaging member at one end that engages a cooperating stop surface near the sheave to prevent the sheave from further rotation upon the sheave reaching an undesirably high rate of rotation.

Abstract: A dust pan has both an elongate handle and a receptacle for a removable long handle. The elongate handle may be unitary with and extend rearwardly from a back wall on the dust pan. The receptacle may be disposed along an upright back wall of the dust pan, and may include a set of internal thread segments beneath an extended channel, enabling the receptacle to accommodate either a threaded ¾? diameter handle, or a 1? diameter handle.

Abstract: A handle construction for a brush handle that includes a molded plastic handle body having a generally straight centerline axis extending from an annular flange outwardly to a distal end, where the body includes a longitudinal axial groove extending inwardly from the distal end toward the flange. The handle body also includes an arcuate groove transverse to the axis at the distal end, and a circumferential groove defining an opposing flange to the first flange. The handle construction also includes an elastomeric material gripping sleeve formed with an open end joined to a hollow passage sized and shaped to slide longitudinally axially onto the handle and including a closed end. It also includes an internal inwardly projecting rib defining a key for cooperatively engaging and fitting into the axial handle groove to guide the sleeve onto the handle, and further includes an internal circumferential rib for engaging the circumferential groove to retain the sleeve on the handle.

Abstract: A dust pan has both an elongate handle and a receptacle for a removable long handle. The elongate handle may be unitary with and extend rearwardly from a back wall on the dust pan. The receptacle may be disposed along an upright back wall of the dust pan, and may include a set of internal thread segments beneath an extended channel, enabling the receptacle to accommodate either a threaded ¾? diameter handle, or a 1? diameter handle.

Abstract: A centrifugally activated device for controlling the speed of movement of an elevator cab includes the capability of controlling upward and downward movement. A first stopping device is associated with at least one elevator sheave. A second stopping device preferably is supported on an opposite side of the same sheave. The second stopping device preferably includes centrifugally activated components such as a latch member that moves from a first position into a second, stopping position responsive to an undesirably high speed of upward movement of the elevator cab. The centrifugally activated components preferably include a latch member that is rotatably supported on the sheave and has an engaging member at one end that engages a cooperating stop surface near the sheave to prevent the sheave from further rotation upon the sheave reaching an undesirably high rate of rotation.