Patents by Inventor François Marion

François Marion has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10233837
    Abstract: The present invention relates to an assembly (20) for an aircraft turbine engine comprising a fan casing (14) having an inner surface (14b), at least one acoustic panel (26) fastened using fastening elements (48, 54) to the inner surface of the fan casing, and at least one circumferential stiffener (40) of the fan casing (14). According to the invention, the fastening elements (48, 54) connect the fan casing (14) to the stiffener (40) incorporated with the acoustic panel (26).
    Type: Grant
    Filed: March 14, 2016
    Date of Patent: March 19, 2019
    Assignee: SNECMA
    Inventors: Cédric Zaccardi, Gwenael Sébastien François Marion
  • Patent number: 10002842
    Abstract: A method of producing a hybridized device including two microelectronic components, including a first microelectronic component having conductive inserts on a connection surface, and a second microelectronic component having ductile conductive pads on a surface opposed to the connection surface, is provided. The method includes the steps of hybridizing the first and second electronic components face-to-face by arranging the connection surface of the first microelectronic component to oppose the surface of the second microelectronic component having the ductile conductive pads, and establishing an electro-mechanical connection between the first microelectronic component and the second microelectronic component by inserting, at ambient temperature, inserts of the first microelectronic component, provided with a second metal sub-layer, into the ductile conductive pads of the second microelectronic component.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: June 19, 2018
    Assignee: Commissariat A L'Energie Atomique Et Aux Energies Alternatives
    Inventor: François Marion
  • Patent number: 9985067
    Abstract: An electronic component includes a plurality of dipoles, each comprising an island solid with a base, a first electrode arranged at the top of the island and a second electrode arranged on the base. Its manufacturing includes forming, on the base, a layer of a material capable of being etched by means of a predetermined isotropic etching, forming, over the layer of material, solid patterns made of electrically-conductive material and inert to said etching, applying the isotropic etching of the thickness of material between said solid patterns to form islands totally overlooked by said solid patterns, and depositing electrically-conductive material on top of and between the islands to form the first and second electrodes of the dipoles.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: May 29, 2018
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventor: François Marion
  • Publication number: 20180066581
    Abstract: The present invention relates to an assembly (20) for an aircraft turbine engine comprising a fan casing (14) having an inner surface (14b), at least one acoustic panel (26) fastened using fastening elements (48, 54) to the inner surface of the fan casing, and at least one circumferential stiffener (40) of the fan casing (14). According to the invention, the fastening elements (48, 54) connect the fan casing (14) to the stiffener (40) incorporated with the acoustic panel (26).
    Type: Application
    Filed: March 14, 2016
    Publication date: March 8, 2018
    Inventors: Cédric ZACCARDI, Gwenael Sébastien François MARION
  • Patent number: 9793141
    Abstract: This method concerns the protection against humidity of a device including a first and a second electronic components respectively having two opposite surfaces, the surfaces: being separated by a non-zero distance shorter than 10 micrometers; having an area greater than 100 mm2; being connected by an assembly of electrical interconnection elements spaced apart from one another by a space void of matter. This method includes applying a deposit of thin atomic layers onto the device to form a layer of mineral material covering at least the interconnection elements, the layer of mineral material having a permeability to water vapor smaller than or equal to 10?3 g/m2/day.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: October 17, 2017
    Assignees: Commissariat A L'Energie Atomique Et Aux Energies Alternatives, Thales
    Inventors: Francois Marion, Tony Maindron
  • Publication number: 20170229321
    Abstract: This method concerns the protection against humidity of a device including a first and a second electronic components respectively having two opposite surfaces, the surfaces: being separated by a non-zero distance shorter than 10 micrometers; having an area greater than 100 mm2; being connected by an assembly of electrical interconnection elements spaced apart from one another by a space void of matter. This method includes applying a deposit of thin atomic layers onto the device to form a layer of mineral material covering at least the interconnection elements, the layer of mineral material having a permeability to water vapor smaller than or equal to 10?3 g/m2/day.
    Type: Application
    Filed: January 30, 2017
    Publication date: August 10, 2017
    Inventors: Francois Marion, Tony Maindron
  • Publication number: 20160380017
    Abstract: An electronic component includes a plurality of dipoles, each comprising an island solid with a base, a first electrode arranged at the top of the island and a second electrode arranged on the base. Its manufacturing includes forming, on the base, a layer of a material capable of being etched by means of a predetermined isotropic etching, forming, over the layer of material, solid patterns made of electrically-conductive material and inert to said etching, applying the isotropic etching of the thickness of material between said solid patterns to form islands totally overlooked by said solid patterns, and depositing electrically-conductive material on top of and between the islands to form the first and second electrodes of the dipoles.
    Type: Application
    Filed: June 20, 2016
    Publication date: December 29, 2016
    Inventor: François Marion
  • Publication number: 20160233186
    Abstract: Electro-mechanical connection component provided on one connection surface with conductive inserts intended to be inserted at ambient temperature into respective ductile conductive pads formed on a surface of another connection component for a face-to-face type hybridization. Each insert of the component includes: a hollow metal core formed of a bottom arranged on the connection surface and of a lateral wall protruding from said bottom, defining an internal surface of the insert, at least a portion of said internal surface being non-oxidized; and a metal layer substantially only covering the internal surface of the metal core.
    Type: Application
    Filed: April 19, 2016
    Publication date: August 11, 2016
    Applicant: Commissariat A L'Energie Atomique Et Aux Energies Alternatives
    Inventor: François MARION
  • Patent number: 9406662
    Abstract: A method of assembling a first and a second electronic components includes forming connection elements on an assembly surface of the first component and forming connection elements on an assembly surface of the second component. The method also includes depositing a liquid layer of electrically-insulating curable material on the assembly surface of the first and/or of the second component and arranging the first and second components on each other to place the connection elements of the second component in front of the connection elements of the first component. The method further includes applying a force along a predetermined direction and the first and/or the second components to create electric interconnects each formed of a connection element of the first component and of a connection element of the second component and curing the curable material.
    Type: Grant
    Filed: March 21, 2014
    Date of Patent: August 2, 2016
    Assignee: COMMISARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: François Marion, Alexis Bedoin, Frédéric Berger, Alain Gueugnot
  • Patent number: 9368473
    Abstract: The invention relates to an assembly method for connecting two electronic components together, said components each having an assembly face, wherein the two assembly faces are moved together in what is known as an assembly direction X, and a given force F is applied to one and/or the other of the components, one and/or the other assembly face(s) having: —connection inserts made of rigid material having an elongate longitudinal shape in the assembly direction X; —connection tracks made of material having a hardness less than that of the inserts and having an elongate longitudinal shape transversely to the assembly direction X, wherein, in said method: —the inserts are aligned opposite corresponding tracks such that the inserts and the tracks form in pairs, after assembly, at least one approximately transverse intersection, —the force F is applied so as make the inserts penetrate into the tracks until the assembly is produced.
    Type: Grant
    Filed: September 26, 2013
    Date of Patent: June 14, 2016
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventor: Francois Marion
  • Publication number: 20160127173
    Abstract: A master device, daisy-chained devices, and a method for configuring the daisy-chained devices are provided. The master device generates a signal having a pre-determined base frequency, and outputs the signal generated to a first device in the daisy chain communication configuration. Each daisy-chained device receives an input signal, having an input frequency, from a previous daisy-chained device. Each daisy-chained device generates an output signal having an output frequency different to and based on the input frequency of the received signal, and outputs the output signal to a following daisy-chained device. Each daisy-chained device further determines an address of a communication interface, for exchanging data with the master device, based on the input frequency of the received signal. For example, the output frequency of the output signal is half the input frequency of the received signal.
    Type: Application
    Filed: October 31, 2014
    Publication date: May 5, 2016
    Inventors: Dominic Gagnon, Danny Breton, Francois Marion
  • Publication number: 20150380395
    Abstract: A method of assembling a first and a second electronic components includes forming connection elements on an assembly surface of the first component and forming connection elements on an assembly surface of the second component. The method also includes depositing a liquid layer of electrically-insulating curable material on the assembly surface of the first and/or of the second component and arranging the first and second components on each other to place the connection elements of the second component in front of the connection elements of the first component. The method further includes applying a force along a predetermined direction and the first and/or the second components to create electric interconnects each formed of a connection element of the first component and of a connection element of the second component and curing the curable material.
    Type: Application
    Filed: March 21, 2014
    Publication date: December 31, 2015
    Inventors: François MARION, Alexis BEDOIN, Frédéric BERGER, Alain GUEUGNOT
  • Patent number: 9166338
    Abstract: A connecting system having a female element including a hollow flared part for receiving and guiding a male element and a hollow mating part for mating with the male element. A part to be mated of the male element has an outside diameter that before the mating is larger than an inside diameter of the mating part of the female element, and the part to be mated of the male element is made of a material that can be strained and has a corrugated transverse cross section, so as to contract when it is plugged into the mating part of the female element, and/or the mating part of the female connection element is made of a material that can be strained and has a corrugated transverse cross section, so as to dilate when the part to be mated of the male element is plugged into it.
    Type: Grant
    Filed: April 8, 2013
    Date of Patent: October 20, 2015
    Assignee: Commissariat A L 'Energie Atomique Et Aux Energies Alternatives
    Inventors: Francois Marion, Baptiste Goubault de Brugiere, Stéphane Lagarrigue, Marion Volpert, Michel Heitzmann
  • Publication number: 20150235985
    Abstract: The invention relates to an assembly method for connecting two electronic components together, said components each having an assembly face, wherein the two assembly faces are moved together in what is known as an assembly direction X, and a given force F is applied to one and/or the other of the components, one and/or the other assembly face(s) having: —connection inserts made of rigid material having an elongate longitudinal shape in the assembly direction X; —connection tracks made of material having a hardness less than that of the inserts and having an elongate longitudinal shape transversely to the assembly direction X, wherein, in said method: —the inserts are aligned opposite corresponding tracks such that the inserts and the tracks form in pairs, after assembly, at least one approximately transverse intersection, —the force F is applied so as make the inserts penetrate into the tracks until the assembly is produced.
    Type: Application
    Filed: September 26, 2013
    Publication date: August 20, 2015
    Inventor: Francois Marion
  • Patent number: 8898896
    Abstract: The invention relates to a method for making a connection component that comprises a set of conducting inserts to be electrically connected with another component, said inserts being hollow.
    Type: Grant
    Filed: February 19, 2009
    Date of Patent: December 2, 2014
    Assignee: Commissariat a l'Energie Atomique et aux Energies Alternatives
    Inventors: Francois Marion, Damien Saint-Patrice
  • Patent number: 8735819
    Abstract: The invention relates to a system and method for positioning and passively aligning at least one optical component as close as possible to an electromagnetic radiation detector. This system comprises supporting wedges (37) for Z positioning of the optical component (35) as close as possible to the detector (21) and passive X and Y alignment means via holding wedges and/or holding balls (36), the X, Y and Z axes being axes perpendicular to each other.
    Type: Grant
    Filed: October 21, 2009
    Date of Patent: May 27, 2014
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Manuel Fendler, Gilles Lasfargues, Francois Marion
  • Publication number: 20140075747
    Abstract: Electro-mechanical connection component provided on one connection surface with conductive inserts intended to be inserted at ambient temperature into respective ductile conductive pads formed on a surface of another connection component for a face-to-face type hybridization. Each insert of the component includes: a hollow metal core formed of a bottom arranged on the connection surface and of a lateral wall protruding from said bottom, defining an internal surface of the insert, at least a portion of said internal surface being non-oxidized; and a metal layer substantially only covering the internal surface of the metal core.
    Type: Application
    Filed: November 25, 2013
    Publication date: March 20, 2014
    Applicant: Commissariat A L'Energie Atomique Et Aux Energies Alternatives
    Inventor: François MARION
  • Patent number: 8664778
    Abstract: A method for manufacturing a microelectronic assembly including stacked first and second microelectronic components having a cavity therebetween including defining said cavity by means of a lateral wall forming a closed frame extending around a determined area of the first component except for an opening used as a vent; forming within the closed frame and opposite to the vent an obstacle capable of forming, in cooperation with the lateral wall, a bypass duct for the filling material; performing a flip-chip hybridization of the first and second components, a surface of the second component resting on the upper edge or end of the lateral wall formed on the first component to form said at least one cavity; injecting the filling material in liquid form between the two hybridized components to embed said at least one cavity and to make it tight by obstruction of the vent as said filling material solidifies.
    Type: Grant
    Filed: June 25, 2012
    Date of Patent: March 4, 2014
    Assignee: Commissariat a l'Energie Atomique et aux Energies Alternatives
    Inventor: Francois Marion
  • Publication number: 20130267113
    Abstract: A connecting system having a female element including a hollow flared part for receiving and guiding a male element and a hollow mating part for mating with the male element. A part to be mated of the male element has an outside diameter that before the mating is larger than an inside diameter of the mating part of the female element, and the part to be mated of the male element is made of a material that can be strained and has a corrugated transverse cross section, so as to contract when it is plugged into the mating part of the female element, and/or the mating part of the female connection element is made of a material that can be strained and has a corrugated transverse cross section, so as to dilate when the part to be mated of the male element is plugged into it.
    Type: Application
    Filed: April 8, 2013
    Publication date: October 10, 2013
    Applicant: Commissariat A L'Energie Atomique Et Aux Energies Alternatives
    Inventors: Francois MARION, Baptiste GOUBAULT DE BRUGIERE, Stéphane LAGARRIGUE, Marion VOLPERT, Michel HEITZMANN
  • Publication number: 20130001807
    Abstract: A method for manufacturing a microelectronic assembly including stacked first and second microelectronic components having a cavity therebetween including defining said cavity by means of a lateral wall forming a closed frame extending around a determined area of the first component except for an opening used as a vent; forming within the closed frame and opposite to the vent an obstacle capable of forming, in cooperation with the lateral wall, a bypass duct for the filling material; performing a flip-chip hybridization of the first and second components, a surface of the second component resting on the upper edge or end of the lateral wall formed on the first component to form said at least one cavity; injecting the filling material in liquid form between the two hybridized components to embed said at least one cavity and to make it tight by obstruction of the vent as said filling material solidifies.
    Type: Application
    Filed: June 25, 2012
    Publication date: January 3, 2013
    Applicant: Commissariat A L'Energie Atomique Et Aux Energies Alternatives
    Inventor: François MARION