Abstract: A component and process for making an electrical connection between a first component comprising a set of first pads and a set of hard conducting tips on one face, and a second component comprising a set of second pads and a set of ductile conducting bumps on the other face, in which the two faces are made to face each other and they are brought towards each other such that the tips can penetrate into these bumps, in which the space between two tips is less than the width of a bump and less than the width of a first pad. The process is applicable to such a component on which the set of conducting tips are installed.

Abstract: The invention relates to a method for manufacturing chips composed of at least one electrically conductive material. Such a method comprises the following steps: deposition, on a support, of an alloy comprising at least the electrically conductive material and a second material; exposure of the alloy to plasma etching, in order to cause the desorption of the materials of the alloy not forming part of the composition of the chips, that is at least the second material but not the electrically conductive material; formation of chips composed of at least said electrically conductive material.

Abstract: A connection device between two components includes a hollow conductive insert, into which is fitted another conductive insert, the electrical connection between the two inserts being provided by means of a solder element.

Abstract: The invention concerns a method of collective bonding of individual chips on a strained substrate (44), which comprises the following steps: functionalised layers (40) are arranged on a support (41), in an adjacent non-contiguous manner, with a space e between two neighboring layers (40), a calibrated drop of adhesive (43) is deposited on each of these functionalised layers, the strained substrate (44) is transferred onto these drops of adhesive, the parts of the assembly thereby formed are singularized to produce chips (45) bonded to the surface of strained substrate. The invention also concerns a method of placing under strain a semiconductor reading circuit by a substrate in a material of different coefficient of expansion.

Abstract: The invention relates to an electronic device comprising: a circuit, comprising a first and a second face, the first face being provided with electrical connection means, a transfer element, comprising a first face and a second face, and being assembled to the second face of the active element through its first face, and comprising electrical connection means on its second face, a connection between the electrical connection means of the active element and the electrical connection means of the transfer element.

Abstract: The invention relates to a method for manufacturing chips composed of at least one electrically conductive material. Such a method comprises the following steps: deposition, on a support, of an alloy comprising at least the electrically conductive material and a second material; exposure of the alloy to plasma etching, in order to cause the desorption of the materials of the alloy not forming part of the composition of the chips, that is at least the second material but not the electrically conductive material; formation of chips composed of at least said electrically conductive material.

Abstract: This method for soldering or hybridizing two components (1, 2) together using a solder material, at least one (1) of said components, called first component, comprising one or more electrically conducting metal tracks (4), connected to as many outer connection dots (5), consists in: preparing, on the opposing surfaces of the components to be welded or hybridized, a wettability surface (7, 8); depositing on one of said wettability surfaces an appropriate quantity of solder material, suitable for constituting a soldering or hybridization dot (6); contacting the wettability surface (8) of the other component (2) with the solder material thereby deposited; then raising the temperature of the chamber in which the components to be welded or hybridized are positioned, to at least the melting point of the solder material in order to ensure the effective soldering or hybridizing of the two components together by a remelt effect.

Abstract: A method for encapsulating a component by using a chamber in which there is a vacuum or controlled atmosphere, positioning a continuous sealing seam made of a metal or a metal alloy on a wettable surface previously placed on a substrate including at least one component and extending around the periphery of the component(s), positioning a package on the sealing seam, and raising the temperature inside the chamber to fuse the material that constitutes the sealing seam, thereby causing the package to drop onto the substrate and form a leaktight, hermetic seal between the package and the substrate.

Abstract: The invention relates to a method for producing a matrix of electronic components, comprising a step of producing an active layer on a substrate, and a step of individualizing the components by forming trenches in the active layer at least until the substrate emerges. The method comprises steps of depositing a layer of functional material on the active layer, depositing a photosensitive resin on the layer of material in such a way as to fill said trenches and to form a thin film on the upper face of the components, at least partially exposing the resin to radiation while underexposing the portion of resin in the trenches, developing the resin in such a way as to remove the properly exposed portion thereof, removing the functional material layer portion that shows through after the development step, and removing the remaining portion of resin.

Abstract: The invention concerns a method of collective bonding of individual chips on a strained substrate (44), which comprises the following steps: functionalised layers (40) are arranged on a support (41), in an adjacent non-contiguous manner, with a space e between two neighbouring layers (40), a calibrated drop of adhesive (43) is deposited on each of these functionalised layers, the strained substrate (44) is transferred onto these drops of adhesive, the parts of the assembly thereby formed are singularised to produce chips (45) bonded to the surface of strained substrate. The invention also concerns a method of placing under strain a semiconductor reading circuit by a substrate in a material of different coefficient of expansion.

Abstract: This invention relates to a process for making an electrical connection between a first component (10) comprising a set of first pads (8) and a set of hard conducting tips (13) on one face, and a second component (11) comprising a set of second pads (9) and a set of ductile conducting bumps (14) on the other face, in which the two faces are made to face each other and they are brought towards each other such that the tips (13) can penetrate into these bumps (14), in which the space between two tips (13) is less than the width of a bump (14) and less than the width of a first pad (8). The invention also relates to such a component on which such a set of conducting tips is installed.

Abstract: The invention relates to a method of sealing or welding two elements to one another in a chamber under vacuum or controlled atmosphere. The inventive method comprises the following steps consisting in: producing a wettability area on the opposing faces of the elements to be welded, one of said areas comprising a layer of gold and having a surface area greater than the surface area of the other wettability area; depositing a quantity of suitable sealing material on one of the areas, said material comprising indium; bringing the wettability area of the other element into contact with the material thus deposited; and raising the temperature of the chamber containing the elements to be welded or sealed to at least 250° C. in a non-oxidising atmosphere, in order to seal the two elements effectively to one another by means of remelting.

Abstract: The invention concerns a nanoprinted device comprising point shaped metallic patterns, in which. each metallic pattern has a bilayer structure controlled in hardness and in chemical properties comprising a lower layer (30) constituting the base of the point and an upper layer (31) constituting the point itself.

Abstract: This hybrid circuit comprises a substrate (20) and at least one elementary circuit (22) which comprises a first facet and a second facet, being hybridized via this second facet to a facet of the substrate. According to the invention, this facet of the substrate and each elementary circuit are coated with a first layer (24), the first layer is removed from the first facet of this elementary circuit, this first facet and the subsisting part of the first layer are coated with a second layer (28), and this subsisting part and the second layer covering it are removed. Application to obtaining an antireflection or metal layer on a chip.

Abstract: The invention relates to an electronic device comprising: a circuit, comprising a first and a second face, the first face being provided with electrical connection means, a transfer element, comprising a first face and a second face, and being assembled to the second face of the active element through its first face, and comprising electrical connection means on its second face, a connection between the electrical connection means of the active element and the electrical connection means of the transfer element.

Abstract: The hybridisation method involves: providing a first component 1 with first pads 3 for accommodating protrusions, providing a second component 2 with second pads 5 for accommodating protrusions, the first pads 3 and second pads 5 respectively being intended to line up two by two in order to form pairs of pads, then providing the first pads and/or second pads with protrusions 4 made of a fusible material, then placing the first and second components one on top of the other, then bringing the assembly consisting of the first and second components and consequently the solder protrusions to a soldering temperature in order to interconnect the first and second pads of each pair of pads by soldering the protrusions to these pads, and finally, cooling down the soldered joint thus obtained.

Abstract: A method for producing a mechanism for connecting and/or soldering or sealing a component on a substrate, including depositing on the substrate a layer made of a ductile material which, if applicable, conducts electricity, and stamping the layer thus produced by means of an etched die, the etching depending on the shape that one wishes to give the mechanism for connecting and/or soldering.

Abstract: A method for encapsulating a component by using a chamber in which there is a vacuum or controlled atmosphere, positioning a continuous sealing seam made of a metal or a metal alloy on a wettable surface previously placed on a substrate including at least one component and extending around the periphery of the component(s), positioning a package on the sealing seam, and raising the temperature inside the chamber to fuse the material that constitutes the sealing seam, thereby causing the package to drop onto the substrate and form a leaktight, hermetic seal between the package and the substrate.

Abstract: Given a component comprising at least one active area formed on a substrate and designed to be coupled to a light guide, a support is used, at least one hole is formed in the support starting from one face of this support, this hole being designed to receive one end of the guide, the substrate is fixed to the other face of the support by forming the hole facing the active area if the active area has already been formed, and otherwise it is formed on the substrate facing the hole and the end of the guide is placed in the hole. The optical system is obtained by optically coupling two devices thus obtained.

Abstract: A process and a device for the passive alignment of supports, particularly plates which carry optical components. According to the invention, in order to align supports (2, 8), holes (6, 7, 11, 12) are formed in these supports, in correspondence with each other, balls (14, 16) are placed on the holes of one of the supports and these are assembled by placing the holes of the other support onto the balls. The sizes of the holes or of the balls are chosen so as to obtain a pre-set non-zero angle (?) between the assembled supports.