Abstract: Process and device for the passive alignment of optical fibers and optoelectronic components. According to the invention, at least one component comprising a substrate layer, a first layer and a second layer comprising at least one active zone (16) is used, the component is placed on the support, the second layer facing it, the component is at least partially coated with a coating material (30) from the support to a level beyond that of the first layer and selectively up to this level at least a part of the substrate facing the active zone is removed in order to reveal a cavity (38) able to accept one end of at least one optical fiber (32).

Abstract: Device for multiplexing a matrix of optical channels, application to wavelength division multiplexing and add-drop. This device comprises N plane optical wave guides (16), each being capable of multiplexing M channels to 1 channel, where M>1 and N>1, the set of N wave guides thus being capable of multiplexing M×N channels to N first channels, and a complementary plane optical wave guide (24) capable of multiplexing N second channels to at least one coupling channel, these N second channels being optically coupled to the N first channels respectively.

Abstract: The invention relates to a device and a process for connecting at least one optical fiber (F) with an optoelectronic component. The device comprises at least one housing (8) provided with at least one mobile arm (9, 10), the housing comprising: a first zone (Z1) to insert the fiber into the housing without applying any pressure on the mobile arm, the first zone being delimited by a part of the wall of the housing and by the mobile arm, and a second zone (Z2) to fix the fiber in the housing after pressure is exerted by the fiber on the mobile arm. The invention is applicable to any type of connection between an optical fiber and an optoelectronic component such as a photo-emitter, photo-detector, wave guide, etc.

Abstract: Given a component (2) comprising at least one active area (8) formed on a substrate (4) and designed to be coupled to a light guide (18), a support (12) is used, at least one hole (14) is formed in the support starting from one face of this support, this hole being designed to receive one end of the guide, the substrate is fixed to the other face of the support by forming the hole facing the active area if the active area has already been formed, and otherwise it is formed on the substrate facing the hole and the end of the guide is placed in the hole. The optical system is obtained by optically coupling two devices thus obtained.

Abstract: Process and device for the passive alignment of optical fibres and optoelectronic components.

Abstract: The device comprises several resonant cavities of different lengths, in order to emit over several different wavelengths, depending on the length of the corresponding cavity. Each resonant cavity comprises a convex cap, preferably hemispherical, of transparent material for the emitted wavelengths. The convex cap defines, at one end of the cavity, an excessive thickness, of length li, which enables to vary the length of the corresponding cavity. The caps are, preferably, obtained by remelting cakes of preset dimensions, for example of selenium, on the material forming the cavities.

Abstract: The invention relates to a device and a process for connecting at least one optical fiber (F) with an optoelectronic component.

Abstract: Device comprising a carrier (100) and at least one cover (104) able to be bonded to the carrier to form with the carrier at least one cavity (114) having a controlled atmosphere around at least one component (102). In accordance with the invention, at least one of either the cover or the carrier is provided with at least one wedge (110) in fusible material and a strip of insulation (112) formed around said component, and before bonding, the wedge of fusible material is of sufficient thickness to prevent the strip of insulation (112) from coming into contact both with the cover and with the carrier when they are assembled together. Particular application to the encapsulation of electronic, mechanical or electromagnetic components.

Abstract: A process and a device for the passive alignment of supports, particularly plates which carry optical components.

Abstract: Method and device for the passive alignment of optic fibers and components, using slots.

Abstract: The device comprises several resonant cavities of different lengths, in order to emit over several different wavelengths, depending on the length of the corresponding cavity. Each resonant cavity comprises a convex cap, preferably hemispherical, of transparent material for the emitted wavelengths. The convex cap defines, at one end of the cavity, an excessive thickness, of length li, which enables to vary the length of the corresponding cavity. The caps are, preferably, obtained by remelting cakes of preset dimensions, for example of selenium, on the material forming the cavities.

Abstract: System of components for hybridization including a first component (410) with a first set of hybridization studs (414), and at least a second component (412) with second hybridization studs (450), the first and second studs being respectively associated in pairs of studs, one of the first and one of the second studs, with at least one pair of studs, equipped with a projection (418) of meltable material and the other aforesaid first and second studs of the pair of studs, referred to as contact studs (450, 450a, 450b), having a surface wettable by the meltable material. According to the invention at least one part of the contact stud (450) forms a protuberance (452). Application to manufacturing of electronic, electro-optic and mechanical components.

Abstract: The invention relates to a method of assembling first and second electronic components (2, 4), the first of the components being fitted with conductive connection contacts (42), the method comprising:

Abstract: The invention relates to a method of assembling first and second electronic components (2, 4), the first of the components being fitted with conductive connection contacts (42), the method comprising a step of assembling the two components, the creation of at least one electrically active zone (40) in the second component, by diffusion of the material of the connection contacts from the first component into the second component.

Abstract: This invention relates to a system of components to be hybridized including at least one first component (110) with first pads (114a) and with a first coefficient of expansion, and at least one second component (112) with second pads (114b) and with a second coefficient of expansion. According to the invention, at a hybridization temperature Th the pads are approximately superposable, and at an ambient temperature Ta the pads are mutually offset by a distance compensating for the differential expansion of the first and second components.

Abstract: A method and device for hybridization of components by solder beads on a substrate using an oven, comprising: raising the temperature of a heating element of the oven, with no contact either with substrate or with component, bringing substrate into thermal contact with heating element for time .DELTA.t, and uncoupling substrate and heating element at the end of time .DELTA.t.

Abstract: A radiation detector which senses two wave bands and a process for making this detector. A first substrate includes a first photodetection element sensitive to a first wave band. A second substrate contains a second photodetection element which is sensitive to a second wave band. The second substrate is transparent to at least the first wave band. The two photodetection elements are positioned facing each other. The substrates are interconnected by conductive spheres.

Abstract: The invention relates to a process for coating electronic components mounted on a substrate using a bump or ball hybridization method. It also relates to the coated electronic component obtained by performing this process. The process comprises placing bumps on the substrate, around an electronic component in order to form a bump belt or carpet contiguous with said electronic component and depositing at least one drop of a coating substance on said bump belt, the bumps of the belt impregnated with the substance being able to make said substance migrate by capillarity towards the bumps located between said electronic component and said substrate. The invention has applications in microelectrics, data processing and optoelectronics.

Abstract: Method and machine to interconnect electric components by welding elements.The components (20,24) are provided with electric contact blocks and, given the fact that two components are to be interconnected, the blocks of one of these components are covered with welding elements made of a low melting point metallic material able to be welded to the blocks, the latter being wettable by the material in its molten state, whereas their environment is not so. The components are placed in contact so that these elements cover the corresponding blocks of the other component and the assembly obtained is heated to a temperature enabling the material to be melted.Application for microelectronics.

Abstract: An assembly of parts forming an angle between facing surfaces of the parts and a process for producing an assembly is described. The parts (2, 4) are provided with contact elements or pads (6, 8, 10, 12) for connection to one another by means of a relatively low melting point metallic soldering material. The surface of each of the pads is wettable by the low melting point metallic material in the molten state, while areas surrounding the pads are not wettable. The contact pads of one of the parts are covered with flat coils or wafers (10, 12) of the low melting point metallic material. The wafers have the same thickness, but different volumes. The contact pads of the other part are placed on the corresponding wafers. The wafers' thickness, volumes, and spacing are chosen so that when the wafers are heated to the molten state and form truncated spherical drops due to surface tension, the parts form between them a predetermined angle. The invention has particular application to the manufacture of mirrors.