Abstract: A memory transistor for a non-volatile memory cell includes a source region and a drain region implanted in a semiconductor substrate. The source region is spaced from the drain region. A double gate region for the memory transistor extends at least partly in depth in the semiconductor substrate between the source region and the drain region and further extends beyond this source region and this drain region. The memory cell further includes a selection transistor having a gate region that partially extends over the double gate region for the memory transistor.

Abstract: A method of manufacturing electronic chips containing low-dispersion components, including the steps of: mapping the average dispersion of said components according to their position in test semiconductor wafers; associating, with each component of each chip, auxiliary correction elements; activating by masking the connection of the correction elements to each component according to the initial mapping.

Abstract: A method for writing to electrically erasable and programmable non-volatile memory and a corresponding integrated circuit are disclosed. In an embodiment a method includes operatively connecting a filter circuit belonging to a communication interface to an oscillator circuit, wherein the communication interface is physically connected to a bus, generating, by the oscillator circuit, an oscillation signal and regulating the oscillation signal by the filter circuit so as to generate a clock signal for timing a write cycle.

Abstract: The present disclosure relates to a device including a rectifying bridge including: a branch connected between first and second nodes; another branch including first and second MOS transistors series-connected between the first and second nodes and having their sources coupled together; a resistor connecting the gate of the first transistor to the second node; another resistor connecting the gate of the second transistor and the first node; and for each transistor, a circuit including first and second terminals respectively connected to the drain and to the gate of the transistor, and being configured to electrically couple its first and second terminals when a voltage between the first terminal of the circuit and the first terminal of the other circuit is greater than a threshold of the circuit.

Abstract: A test circuit and a method for testing an integrated circuit are provided. The integrated circuit includes a test circuit. The test circuit includes a conductive track extending over at least a portion of the periphery of the integrated circuit, at least one component and an activation circuit adapted to deviating an input data signal into the conductive track during a test mode, and to transmitting the input data signal to the at least one component during a normal operating mode.

Abstract: A first power supply rail is provided as a power supply tree configured with couplings to distribute a supply voltage to active elements of the circuit. A second power supply rail is provided as an electrostatic discharge channel and is not configured with distribution tree couplings to active elements of the circuit. A first electrostatic discharge circuit is directly electrically connected between one end of the second power supply rail and a ground rail. A second electrostatic discharge circuit is directly electrically connected between an interconnect node and the ground rail. The interconnect node electrically interconnects another end of the second power supply rail to the first power supply rail at the second electrostatic discharge circuit.

Abstract: A method of manufacturing electronic chips containing low-dispersion components, including the steps of: mapping the average dispersion of said components according to their position in test semiconductor wafers; associating, with each component of each chip, auxiliary correction elements; activating by masking the connection of the correction elements to each component according to the initial mapping.

Abstract: A method for writing to electrically erasable and programmable non-volatile memory and a corresponding integrated circuit are disclosed. In an embodiment a method includes operatively connecting a filter circuit belonging to a communication interface to an oscillator circuit, wherein the communication interface is physically connected to a bus, generating, by the oscillator circuit, an oscillation signal and regulating the oscillation signal by the filter circuit so as to generate a clock signal for timing a write cycle.

Abstract: Some embodiments include a method for addressing an integrated circuit for a non-volatile memory of the EEPROM type on a bus of the I2C type. The memory includes J hardware-identification pins, with J being an integer lying between 1 and 3, which are assigned respective potentials defining an assignment code on J bits. The method includes a first mode of addressing used selectively when the assignment code is equal to a fixed reference code on J bits, and a second mode of addressing used selectively when the assignment code is different from the reference code. In the first mode, the memory plane of the non-volatile memory is addressed by a memory address contained in the last low-order bits of the slave address and in the first N bytes received. In the second mode, the memory plane is addressed by a memory address contained in the first N+1 bytes received.

Abstract: A method for programming a non-volatile memory (NVM) and an integrated circuit is disclosed. In an embodiment an integrated circuit includes a memory plane organized into rows and columns of memory words, each memory word comprising memory cells and each memory cell including a state transistor having a control gate and a floating gate and write circuitry configured to program a selected memory word during a programming phase by applying a first nonzero positive voltage to control gates of the state transistors of the memory cells that do not belong to the selected memory word.

Abstract: A contactless transponder includes a non-volatile static random access memory including memory points. Each memory point is formed by a volatile memory cell and a non-volatile memory cell. A protocol processing circuit receives data and stores the received data in the volatile memory cells of the memory. A write processing circuit is configured, at the end of the reception and storage of the data, to record, in a single write cycle, the data from the volatile memory cells to the non-volatile memory cells of the respective memory points.

Abstract: The memory device of the electrically-erasable programmable read-only memory type comprises write circuitry designed to carry out a write operation in response to receiving a command for writing at least one selected byte in at least one selected memory word of the memory plane, the write operation comprising an erase cycle followed by a programming cycle, and configured for generating, during the erase cycle, an erase voltage in the memory cells of all the bytes of the at least one selected memory word, and an erase inhibit potential configured, with respect to the erase voltage, for preventing the erasing of the memory cells of the non-selected bytes of the at least one selected memory word, which are not the at least one selected byte.

Abstract: The present disclosure relates to a device including a rectifying bridge including: a branch connected between first and second nodes; another branch including first and second MOS transistors series-connected between the first and second nodes and having their sources coupled together; a resistor connecting the gate of the first transistor to the second node; another resistor connecting the gate of the second transistor and the first node; and for each transistor, a circuit including first and second terminals respectively connected to the drain and to the gate of the transistor, and being configured to electrically couple its first and second terminals when a voltage between the first terminal of the circuit and the first terminal of the other circuit is greater than a threshold of the circuit.

Abstract: An embodiment integrated circuit comprises a memory device including at least one memory point having a volatile memory cell and a single non-volatile memory cell coupled together to a common node.

Abstract: An EEPROM includes a floating gate transistor having a source region, a channel region and a drain region. A first capa implant zone on a drain-side of the floating gate transistor has a first dopant concentration level. A second capa implant zone in the first capa implant zone adjacent the drain region has a second dopant concentration level that is greater than the first dopant concentration level. A gate oxide region insulates the floating gate electrode from the channel region, first capa implant zone and second capa implant zone. A thickness of the gate oxide region is thinner at the second capa implant zone than at the channel region and first capa implant zone.

Abstract: A method to transmit data over a single-wire bus wherein a first communication channel is defined by pulses of different durations according to the state of the transmitted bit and depending on a reference duration, and a second communication channel is defined by the reference duration.

Abstract: An electronic chip is provided that includes a plurality of first transistors electrically coupled to one another in parallel. A plurality of first isolating trenches is included in the electronic chip, and the first transistors are separated from one another by the first isolating trenches. Each of the first isolation trenches has a depth and a maximum width, and the depth depends on, or is a function of, the maximum width.

Abstract: An electronic chip includes first transistors connected in parallel so that gates of the first transistors are interconnected, drain areas of the first transistors are interconnected, and source areas of the first transistors are interconnected. The first transistors are separated from one another by first isolating trenches. The chip also includes second transistors and second isolating trenches. The second transistors are separated from one another by the second isolating trenches. The first isolating trenches have a maximum width that is smaller than a maximum width of all the second isolating trenches.

Abstract: A first power supply rail is provided as a power supply tree configured with couplings to distribute a supply voltage to active elements of the circuit. A second power supply rail is provided as an electrostatic discharge channel and is not configured with distribution tree couplings to active elements of the circuit. A first electrostatic discharge circuit is directly electrically connected between one end of the second power supply rail and a ground rail. A second electrostatic discharge circuit is directly electrically connected between an interconnect node and the ground rail. The interconnect node electrically interconnects another end of the second power supply rail to the first power supply rail at the second electrostatic discharge circuit.

Abstract: An EEPROM memory integrated circuit includes memory cells arranged in a memory plane. Each memory cell includes an access transistor in series with a state transistor. Each access transistor is coupled, via its source region, to the corresponding source line and each state transistor is coupled, via its drain region, to the corresponding bit line. The floating gate of each state transistor rests on a dielectric layer having a first part with a first thickness, and a second part with a second thickness that is less than the first thickness. The second part is located on the source side of the state transistor.