Abstract: A thermal bridge for a thermally conductive transport of heat includes: a heat release portion having: a joining surface; a heat release surface spaced from the joining surface; and a first material component of the thermal bridge from the joining surface to the heat release surface. The heat release portion releases heat from the joining surface to the heat release surface in a thermally conductive manner and releases the heat at the heat release surface. The thermal bridge includes a heat absorption section connected to the heat release section at the joining surface in a material-locking manner as a material-locking connection, the heat absorption section including: a heat contact surface moldable by contact pressure; and from the joining surface up to the heat contact surface, a second material component of the thermal bridge built up by additive melt layering, the second material component being different from the first material component.

Abstract: A housing for housing an electrical heat source includes: a housing base of the housing, an extent of the housing base in a first direction determining a height dimension of the housing; a housing head of the housing facing away from the housing base in a second direction, which housing head has a head dimension in the first direction which is at most 60 percent of the height dimension of the housing; and a heat sink extending in the housing between the housing base and the housing head in the first direction, which heat sink is longer in the first direction than the head dimension and extends in the first direction on one side or on both sides of the housing head to a respective housing opening of the housing, through which the heat sink is in fluid connection with an environment of the housing.

Abstract: Tracking and/or predicting the yield of a semiconductor process. In an embodiment, a tracking method monitors the yield at each layer of the process. This can be used to determine how to proceed. In an embodiment, the prediction method measures the values of at least one attribute of each conductive via on a substrate before the lithography process. The measured values are then compared to predefined values for the same attribute, to determine any deviation. Based on this comparison, an overlay yield of the lithography process is predicted.

Abstract: An assembly of an electrical device includes: at least one electrical functional assembly which has a supporting element and electrical or electronic functional components arranged on the supporting element; a fastening device for fastening the electrical device to a higher-level assembly; a heat sink core element having at least one face wall; and an external element connectable to the heat sink core element. The heat sink core element forms a supporting structure of the electrical device on which supporting structure the fastening device is arranged. The external element is connectable to the heat sink core element such that the at least one electrical functional assembly is accommodated between the at least one face wall of the heat sink core element and the external element.

Abstract: An assembly of an electronic device includes: an electronics housing for accommodating an electronic component; a base strip attachable to the electronics housing and having a plurality of plug receptacles to which plug modules are attachable; and a locking apparatus for locking the plug modules to the plug receptacles of the base strip. The locking apparatus has an actuating part movable in an actuating direction toward the electronics housing in order to remove the plug modules from the base strip. A spring element is arranged on the electronics housing for preloading the actuating part in relation to the electronics housing counter to the actuating direction.

Abstract: A device for thermally loading an enclosure and/or a heat sink includes: at least one circuit board arranged or arrangeable in the enclosure or on the heat sink, each at least one circuit board having at least one conductor track and at least two fields within each of which a continuous electrically conductive track section of the at least one conductor track runs, a path length of the at least one conductor track section within each of the at least two fields being greater than one or each edge length of a respective field or one or each diagonal of the respective field or a perimeter of the respective field. The fields include tiles of a tiling of a first side of the circuit board The conductor track sections each thermally load the enclosure and/or the heat sink depending on a current feed to the respective conductor track.

Abstract: A method for determining a housing capable of accommodating waste heat generating electronic components on a printed circuit board includes: detecting an arrangement of the electronic components on a mounting side of the printed circuit board; determining several functional areas within the mounting side in which at least one of the electronic components is arranged according to the detected arrangement; assigning a thermal function to each of the functional areas, each of the thermal functions comprising: a function for generating waste heat due to a power dissipation of the at least one electronic component arranged in a respective functional area according to the detected arrangement during operation, and a maximum temperature up to which the at least one electronic component arranged in the respective functional area is operable without damage and performance limitation.

Abstract: An assembly of an electronic device includes: an electronics housing for accommodating an electronic component; a base strip attachable to the electronics housing and having a plurality of plug receptacles to which plug modules are attachable; and a locking apparatus for locking the plug modules to the plug receptacles of the base strip. The locking apparatus has an actuating part movable in an actuating direction toward the electronics housing in order to remove the plug modules from the base strip. A spring element is arranged on the electronics housing for preloading the actuating part in relation to the electronics housing counter to the actuating direction.

Abstract: A modular connection block includes: a plurality of electrical connection modules for conductor connection to an electronic component, the connection modules, in each case having a connection housing, being held together by holding means in an assemblage. The holding means include at least one strip-like connecting element, by which the connection housings are connected, the connection housings being arranged side by side along the strip-like connecting element in an in-line arrangement. The strip-like connecting element includes a plurality of spaced-apart connecting sections, from whose arrangement connection places are predetermined on the strip-like connecting element at which a respective connection module is connected or connectable to the strip-like connecting element by mechanical and/or frictional interlocking.

Abstract: A modular system for producing an electronic device includes: a housing, which forms an accommodating space; a printed circuit board which is insertable along an insertion direction into the accommodating space of the housing and, in a mounting position, is accommodated in the accommodating space; and a plurality of attachment parts, which are connectable to the printed circuit board and which, when viewed along the insertion direction, each have a division corresponding to a predetermined smallest dividing unit or an integral multiple of the predetermined smallest dividing unit. Each attachment part has a first guide device for guiding on a second guide device of the housing and a combination of attachment parts is connectable to the printed circuit board in a manner arranged next to one another along the insertion direction such that when the printed circuit board is inserted into the accommodating space, the combination is guided.

Abstract: An assembly of an electrical device includes: at least one electrical functional assembly which has a supporting element and electrical or electronic functional components arranged on the supporting element; a fastening device for fastening the electrical device to a higher-level assembly; a heat sink core element having at least one face wall; and an external element connectable to the heat sink core element. The heat sink core element forms a supporting structure of the electrical device on which supporting structure the fastening device is arranged. The external element is connectable to the heat sink core element such that the at least one electrical functional assembly is accommodated between the at least one face wall of the heat sink core element and the external element.

Abstract: A method for correcting misalignments is provided. An alignment for each device of a group of devices mounted on a substrate is determined. An alignment error for the group of devices mounted on the substrate is determined based on the respective alignment for each device. One or more correction factors are calculated based on the alignment error. The alignment error is corrected based on the one or more correction factors.

Abstract: A modular system for producing an electronic device includes: a housing, which forms an accommodating space; a printed circuit board which is insertable along an insertion direction into the accommodating space of the housing and, in a mounting position, is accommodated in the accommodating space; and a plurality of attachment parts, which are connectable to the printed circuit board and which, when viewed along the insertion direction, each have a division corresponding to a predetermined smallest dividing unit or an integral multiple of the predetermined smallest dividing unit. Each attachment part has a first guide device for guiding on a second guide device of the housing and a combination of attachment parts is connectable to the printed circuit board in a manner arranged next to one another along the insertion direction such that when the printed circuit board is inserted into the accommodating space, the combination is guided.

Abstract: A method for manufacturing an electrical plug-in connector, an electrical connector element, which has a first contacting portion for plug-in connection to a contact of a first contact carrier and a second contacting portion, angled with respect thereto, for connection with a contact of a second contact carrier, being introduced into a receiving chamber of a housing body, vis-à-vis a device having a housing body receptacle and a connector element receptacle, includes the following steps: a1) placing the housing body receptacle and the connector element receptacle in a receiving position for equipping them with the electrical connector element; b1) arranging the electrical connector element at the connector element receptacle; c1) arranging the housing body at the housing body receptacle; d1) moving the housing body receptacle and the connector element receptacle toward one another using a drive element such that a joining movement is produced.

Abstract: An electronic housing for housing an electronic component includes: a housing body having an upper housing part and a lower housing part, between which a receiving space for the electronic component is formed. The electronic component is held in the receiving space by a holding device. The holding device includes at least one holding body with a holding arm. The holding arm projects at least in sections from outside the receiving space into the receiving space and provides a holding section for holding the electronic component.

Abstract: A method for correcting misalignments is provided. An alignment for each device of a group of devices mounted on a substrate is determined. An alignment error for the group of devices mounted on the substrate is determined based on the respective alignment for each device. One or more correction factors are calculated based on the alignment error. The alignment error is corrected based on the one or more correction factors.

Abstract: A modular connection block includes: a plurality of electrical connection modules for conductor connection to an electronic component, the connection modules, in each case having a connection housing, being held together by holding means in an assemblage. The holding means include at least one strip-like connecting element, by which the connection housings are connected, the connection housings being arranged side by side along the strip-like connecting element in an in-line arrangement. The strip-like connecting element includes a plurality of spaced-apart connecting sections, from whose arrangement connection places are predetermined on the strip-like connecting element at which a respective connection module is connected or connectable to the strip-like connecting element by mechanical and/or frictional interlocking.

Abstract: An electronic housing for housing an electronic component includes: a housing body having an upper housing part and a lower housing part, between which a receiving space for the electronic component is formed. The electronic component is held in the receiving space by a holding device. The holding device includes at least one holding body with a holding arm. The holding arm projects at least in sections from outside the receiving space into the receiving space and provides a holding section for holding the electronic component.

Abstract: An electrical plug-in connector for forming a printed circuit board connector on a printed circuit board includes: a housing body which, when in use, overlaps a printed circuit board contact side on an upper face or lower face of the printed circuit board vis-à-vis a housing portion and includes a plug-in connection side, for a mating plug-in connector, at an angle to the printed circuit board contact side; and an electrical connector element being accommodated in the housing body, which element provides, on the printed circuit board contact side, a first contact portion for contacting a conducting track of the printed circuit board and, on the plug-in connection side, a second contact portion for contacting a mating contact of the mating plug-in connector. The connector element is formed from a punched sheet-metal part such that a center of gravity of the electrical plug-in connector is arranged within the housing portion.

Abstract: An electronics housing includes: a housing body for attachment to a mounting rail and on which a cover is arranged which is pivotable about a pivot pin, formed on a bearing point, between an open position and a closed position; and a locking device for pivotally locking the cover in at least one pivot angle position via an interlocking connection, which is configured to be released without destruction, between at least a first and a second locking member, wherein, spaced apart from the bearing point in a radial pivot pin direction, the first locking member is arranged on the housing body and the second locking member is arranged on the cover such that actuation of the cover for pivoting out of the pivot angle position produces resilient deformation of the first locking member and/or second locking member, directed radially with respect to the pivot pin, to release the interlocking connection.