Abstract: An electronics housing includes: a housing body for attachment to a mounting rail and on which a cover is arranged which is pivotable about a pivot pin, formed on a bearing point, between an open position and a closed position; and a locking device for pivotally locking the cover in at least one pivot angle position via an interlocking connection, which is configured to be released without destruction, between at least a first and a second locking member, wherein, spaced apart from the bearing point in a radial pivot pin direction, the first locking member is arranged on the housing body and the second locking member is arranged on the cover such that actuation of the cover for pivoting out of the pivot angle position produces resilient deformation of the first locking member and/or second locking member, directed radially with respect to the pivot pin, to release the interlocking connection.

Abstract: A terminal block for an electronic device, which block can be attached to an electronics housing of the electronic device, includes at least one base strip comprising a plurality of connector sockets; and a plurality of connector modules that can be attached to the connector sockets of the at least one base strip in at least one insertion direction, are held on the connector sockets in an inserted position, and can be released from the connector sockets to be removed from the at least one base strip; and a locking device. The locking device includes: an actuating part that can be moved relative to the at least one base strip in an actuation direction; and a plurality of locking elements that are engaged in a locking manner in mating elements of the connector modules in a locked position.

Abstract: The invention relates to an arrangement for increasing the insulation coordination between at least two electric potentials on a printed circuit board (2), said arrangement comprising the printed circuit board (2) and an insulation barrier (3), wherein the printed circuit board (2) has an opening (7) between the electric potentials, and the insulation barrier (3) is disposed on the printed circuit board (2) so as to be displaceble through the opening (7) and is designed such that the isolating distance between the two electric potentials can be enlarged by displacing the insulation barrier (3) relative to the printed circuit board (2). The arrangement makes it possible obtain a high packing density on the printed circuit board (2).

Abstract: A terminal row for a terminal device, which can be attached to an electronics housing in an insertion direction and which can be connected to an electronic component that is to be accommodated in the electronics housing, has a predetermined number of single electrical conductors or connectors connected thereto to produce a connection between the single electrical conductors or connectors and the electronic component. The terminal row includes a plurality of main housings, at least two of the plurality of main housings being different, wherein the main housings are separate from one another in a pre-assembly state and configured to be attached to one another in a row direction to form the terminal row.

Abstract: The invention relates to an arrangement for increasing the insulation coordination between at least two electric potentials on a printed circuit board (2), said arrangement comprising the printed circuit board (2) and an insulation barrier (3), wherein the printed circuit board (2) has an opening (7) between the electric potentials, and the insulation barrier (3) is disposed on the printed circuit board (2) so as to be displaceble through the opening (7) and is designed such that the isolating distance between the two electric potentials can be enlarged by displacing the insulation barrier (3) relative to the printed circuit board (2). The arrangement makes it possible obtain a high packing density on the printed circuit board (2).

Abstract: Connection between an electrical device and a stationary base part, with a plug type connector which can be fixed in floating fashion to a fixing plate of the device and with a corresponding mating plug type connector which can be fixed to the base part, wherein the mating plug type connector has a housing at least one guide hole. Compensation between the plug type connector and the mating plug type connector is possible when joining the electrical device to the stationary base part by at least one screw hole being formed in the housing of the plug type connector for a fixing screw which passes through the screw hole into a fixing plate of the electrical device, the diameter of the screw head being greater than the diameter of the screw hole, and the diameter of the screw neck being substantially smaller than the diameter of the screw hole.

Abstract: According to a first aspect of the invention, there is provided a lithographic method of providing an alignment mark on a layer provided on a substrate, the method including providing the alignment mark on an area of the layer which is oriented within a certain range of angles with respect to a surface of the substrate on which the layer is provided.

Abstract: Locking mechanism (1) and a housing (2) equipped with one such locking mechanism, to hold a plug-in module (5), and a modular system (3) which comprises a housing and a plug-in module, wherein the locking mechanism (1) has an actuating mechanism (4) for unlocking of the plug-in module. The invention is characterized in that the actuating mechanism (4) is connected to a lifting mechanism (6) in order to lift a plug-in module (5) held in the housing (2) when unlocking.

Abstract: Connection between an electrical device and a stationary base part, with a plug type connector which can be fixed in floating fashion to a fixing plate of the device and with a corresponding mating plug type connector which can be fixed to the base part, wherein the mating plug type connector has a housing at least one guide hole. Compensation between the plug type connector and the mating plug type connector is possible when joining the electrical device to the stationary base part by at least one screw hole being formed in the housing of the plug type connector for a fixing screw which passes through the screw hole into a fixing plate of the electrical device, the diameter of the screw head being greater than the diameter of the screw hole, and the diameter of the screw neck being substantially smaller than the diameter of the screw hole.

Abstract: Locking mechanism (1) and a housing (2) equipped with one such locking mechanism, to hold a plug-in module (5), and a modular system (3) which comprises a housing and a plug-in module, wherein the locking mechanism (1) has an actuating mechanism (4) for unlocking of the plug-in module. The invention is characterized in that the actuating mechanism (4) is connected to a lifting mechanism (6) in order to lift a plug-in module (5) held in the housing (2) when unlocking.

Abstract: According to a first aspect of the invention, there is provided a lithographic method of providing an alignment mark on a layer provided on a substrate, the method including providing the alignment mark on an area of the layer which is oriented within a certain range of angles with respect to a surface of the substrate on which the layer is provided.

Abstract: A device manufacturing method is disclosed that includes providing a substrate on a substrate table, the substrate having a target region comprising a plurality of generally planar surfaces, each surface having a different height relative to the substrate table, determining the relative heights of each generally planar surface, projecting a patterned beam of radiation onto the target region of the substrate such that the focal plane of the beam substantially coincides with the plane of one of the generally planar surfaces, moving the substrate table in a direction substantially parallel to the axis of the beam, and projecting the patterned beam of radiation onto the target region of the substrate such that the focal plane of the beam substantially coincides with the plane of another of the generally planar surfaces.

Abstract: A substrate bonding system has a first and a second substrate table for holding a first substrate and a second substrate, respectively, and a controller. The first substrate includes a first device having first contact pads and the second substrate a second device having second contact pads. The wafer bonding system is arranged to bond the first and second device in such a way that a circuit may be formed by the first and second device. The first and second substrate tables each include a position sensor arranged to measure an optical signal generated on an alignment marker of the first and second substrate, respectively. The first and second substrate tables include a first and second actuator respectively that is arranged to alter a position and orientation of the respective substrate table.

Abstract: A method is disclosed that includes introducing a substrate into a pre-aligner of a lithographic apparatus, using a detector to measure the location of an alignment mark provided on a side of the substrate which is opposite to the location of the detector, and after measurement, putting the substrate onto a substrate table of the lithographic apparatus, the substrate being positioned on the substrate table such that the alignment mark provided on the opposite side of the substrate is visible through a window of the substrate table.

Abstract: The present invention relates to a device manufacturing method wherein a plurality of front side marks are manufactured on the front side of the substrate. These marks are used to locally align the substrate when exposing. After certain processing steps, the positions of the front side marks are measured and compared with respect to their original positions. The measured position changes of the front side marks, i.e. their behaviour, can then be analyzed. The original positions and actual positions are defined with respect to a nominal grid which is defined using global alignment marks which are positioned at the back side of the substrate. Because the global alignment marks are positioned at the back side, they are not affected by any processing step.

Abstract: A second substrate, e.g. a III/V compound semiconductor, is placed on a first substrate, e.g. a wafer, in the vicinity of placement marks on the first substrate. The second substrate is exposed to patterned radiation, e.g. for the manufacture of integrated circuits.

Abstract: A substrate bonding system has a first and a second substrate table for holding a first substrate and a second substrate, respectively, and a controller. The first substrate includes a first device having first contact pads and the second substrate a second device having second contact pads. The wafer bonding system is arranged to bond the first and second device in such a way that a circuit may be formed by the first and second device. The first and second substrate tables each include a position sensor arranged to measure an optical signal generated on an alignment marker of the first and second substrate, respectively. The first and second substrate tables include a first and second actuator respectively that is arranged to alter a position and orientation of the respective substrate table.

Abstract: In a method for measuring the bonding quality of bonded substrates, such as bonded SOI wafers, a plurality of marks are created at a first side of a top substrate after, or before, the bonding of the top substrate onto a bottom substrate. Then, the positions of the plurality of marks are measured using a metrology tool. Next, for each of the marks, a difference between a measured position and an expected position is calculated. These differences can be used to determine delamination between the top substrate and the bottom substrate. By displaying a vector field representing the differences, and by not showing vectors that exceed a certain threshold, the delamination areas can be made visible.

Abstract: In an embodiment, a ring seal forming apparatus is disclosed, the apparatus including a substrate holder arranged to hold a substrate coated at least in part with resist, and a heating device configured to heat an area of the resist, relative movement between the substrate holder and heating device being possible, the movement being arranged such that, in use of the apparatus, the area of resist heated by the heating device is ring-shaped.

Abstract: A method of measuring bonding quality of a bonded substrate having an upper substrate on top of a lower substrate, the method comprising etching one or more windows in the upper substrate such that overlay measurement alignment marks on the upper substrate may be seen by a measurement system and overlay measurement alignment marks on the lower substrate may be seen by the measurement system, using the measurement system to measure the positions of the overlay measurement alignment marks, determining the distance between corresponding overlay measurement alignment marks on the upper and lower substrates, and adjusting the determined distance to take into account an offset between the overlay measurement alignment marks on the upper substrate and the overlay measurement alignment marks on the lower substrate.