Patents by Inventor Frank Daeche

Frank Daeche has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device
    Patent number: 7031170
    Abstract: An electronic device has a plastic housing. The plastic housing has components of a height-structured metallic leadframe. The components are in a matrix form and contain contact islands and chip islands on the underside of the plastic housing. Furthermore, the electronic device has a first line structure containing height-structured interconnects on the underside of the plastic housing and a second line structure containing bonding connections which are disposed within the plastic housing.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: April 18, 2006
    Assignee: Infineon Technologies AG
    Inventors: Frank Daeche, Franz Petter
  • Method for manufacturing a housing for a chip with a micromechanical structure
    Patent number: 7011986
    Abstract: In a housing manufacturing method a base is provided with first contact elements with a photolithographically patternable layer that is patterned for exposing the contact elements. A chip with a micromechanical structure lying between second contact elements at the chip is provided with a photolithographically patternable layer which is patterned in order to provide a recess in the area of the micromechanical structure and in the area of the second contact elements. After joining the base and the chip the base is removed by etching.
    Type: Grant
    Filed: October 12, 2004
    Date of Patent: March 14, 2006
    Assignee: Infineon Technologies AG
    Inventors: Frank Daeche, Hans-Joerg Timme
  • Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier
    Publication number: 20050151246
    Abstract: A multilayer circuit carrier, electronic devices and panel, and a method for producing a multilayer circuit carrier include at least one semiconductor chip, at least one rewiring layer with a rewiring structure, and at least one insulation layer, which has passage structures.
    Type: Application
    Filed: February 1, 2005
    Publication date: July 14, 2005
    Inventors: Frank Daeche, Jochen Dangelmaier, Stefan Paulus, Bernd Stadler, Horst Theuss, Michael Weber
  • Method for manufacturing a housing for a chip with a micromechanical structure
    Publication number: 20050106785
    Abstract: In a housing manufacturing method a base is provided with first contact elements with a photolithographically patternable layer that is patterned for exposing the contact elements. A chip with a micromechanical structure lying between second contact elements at the chip is provided with a photolithographically patternable layer which is patterned in order to provide a recess in the area of the micromechanical structure and in the area of the second contact elements. After joining the base and the chip the base is removed by etching.
    Type: Application
    Filed: October 12, 2004
    Publication date: May 19, 2005
    Inventors: Frank Daeche, Hans-Joerg Timme
  • Electronic device with cavity and a method for producing the same
    Publication number: 20040201090
    Abstract: An electronic device can include a top side with circuit structures. The circuit structures form the bottom region of a cavity. Each cavity can be surrounded by a cavity frame made of plastic and can have a cavity cover made of semiconductor material.
    Type: Application
    Filed: March 9, 2004
    Publication date: October 14, 2004
    Inventors: Robert Aigner, Albert Auburger, Frank Daeche, Guenter Ehrler, Andreas Meckes, Horst Theuss, Michael Weber
  • Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device
    Publication number: 20030076666
    Abstract: An electronic device has a plastic housing. The plastic housing has components of a height-structured metallic leadframe. The components are in a matrix form and contain contact islands and chip islands on the underside of the plastic housing. Furthermore, the electronic device has a first line structure containing height-structured interconnects on the underside of the plastic housing and a second line structure containing bonding connections which are disposed within the plastic housing.
    Type: Application
    Filed: September 30, 2002
    Publication date: April 24, 2003
    Inventors: Frank Daeche, Franz Petter
  • Electronic component with at least two semiconductor chips, and process for its production
    Publication number: 20030047760
    Abstract: An electronic component includes two semiconductor chips on an intermediate carrier, which is provided on its underside with external contacts, which are located on a plane with first external contacts on a first active chip surface of the first semiconductor chip. A rear side of the first semiconductor chip faces an active chip surface of the second semiconductor chip. The invention additionally relates to a process for the production of the electronic component.
    Type: Application
    Filed: August 30, 2002
    Publication date: March 13, 2003
    Inventors: Frank Daeche, Bernhard Zuhr