Abstract: A resistive random access memory (ReRAM) cell comprising a first conductive electrode and a dielectric storage material layer over the first conductive electrode. The dielectric storage material layer is conducive to the formation of conductive filaments during the application of a filament forming voltage to the cell. The cell includes a second conductive electrode over the dielectric storage material layer and a layer of conductive nanoclusters (911, 1211) including a plurality of nanoclusters in contact with the dielectric storage material layer and in contact with the first conductive electrode or the second conductive electrode.

Abstract: A method of erasing a non-volatile semiconductor memory device comprising determining a number of bit cells that failed to erase verify during an erase operation. The bit cells are included in a subset of bit cells in an array of bit cells. The method further comprises determining whether an Error Correction Code (ECC) correction has been previously performed for the subset of bit cells. The erase operation is considered successful if the number of bit cells that failed to erase verify after a predetermined number of erase pulses is below a threshold number and the ECC correction has not been performed for the subset of bit cells.

Abstract: A semiconductor memory device comprises a volatile memory and a non-volatile memory including a plurality of sectors. Each of the plurality of sectors configured to store a sector status indicator and a plurality of data records. A control module is coupled to the non-volatile memory and the volatile memory. The control module manages the sectors by scanning the sectors to identify the records with invalid data; changing the status indicator of a particular sector when all of the records in the particular sector are invalid, and discontinuing scanning the particular sector while all of the records in the particular sector are invalid.

Abstract: A method of forming an NVM cell and a logic transistor uses a semiconductor substrate. In an NVM region, a polysilicon select gate of the NVM cell is formed over a first thermally-grown oxygen-containing layer, and in a logic region, a work-function-setting material is formed over a high-k dielectric and a polysilicon dummy gate is formed over the work-function-setting material. Source/drains, a sidewall spacer, and silicided regions of the logic transistor are formed after the first thermally-grown oxygen-containing layer is formed. The polysilicon dummy gate is replaced by a metal gate. The logic transistor is protected while the NVM cell is then formed including forming a charge storage region.

Abstract: A thermally-grown oxygen-containing layer is formed over a control gate in an NVM region, and a high-k dielectric layer and barrier layer are formed in a logic region. A polysilicon layer is formed over the oxygen-containing layer and barrier layer and is planarized. A first masking layer is formed over the polysilicon layer and control gate defining a select gate location laterally adjacent the control gate. A second masking layer is formed defining a logic gate location. Exposed portions of the polysilicon layer are removed such that a select gate remains at the select gate location and a polysilicon portion remains at the logic gate location. A dielectric layer is formed around the select and control gates and polysilicon portion. The polysilicon portion is removed to result in an opening at the logic gate location which exposes the barrier layer.

Abstract: A control gate overlying a charge storage layer is formed. A thermally-grown oxygen-containing layer is formed over the control gate. A polysilicon layer is formed over the oxygen-containing layer and planarized. A first masking layer is formed defining a select gate location laterally adjacent the control gate and a second masking layer is formed defining a logic gate location. Exposed portions of the polysilicon layer are removed such that a select gate remains at the select gate location and a polysilicon portion remains at the logic gate location. A dielectric layer is formed around the select and control gates and polysilicon portion. The polysilicon portion is removed to result in an opening in the dielectric. A high-k gate dielectric and logic gate are formed in the opening.

Abstract: A control gate overlying a charge storage layer is formed. A thermally-grown oxygen-containing layer is formed over the control gate. A polysilicon layer is formed over the oxygen-containing layer and planarized. A first masking layer is formed defining a select gate location laterally adjacent the control gate and a second masking layer is formed defining a logic gate location. Exposed portions of the polysilicon layer are removed such that a select gate remains at the select gate location and a polysilicon portion remains at the logic gate location. A dielectric layer is formed around the select and control gates and polysilicon portion. The polysilicon portion is removed to result in an opening in the dielectric. A high-k gate dielectric and logic gate are formed in the opening.

Abstract: A method of forming an NVM cell and a logic transistor uses a semiconductor substrate. A polysilicon select gate of the NVM cell is formed over a first thermally-grown oxygen-containing layer in an NVM region and a polysilicon dummy gate is formed over a second thermally-grown oxygen-containing layer in a logic region. Source/drains, a sidewall spacer, and silicided regions of the logic transistor are formed after the first and second thermally-grown oxygen-containing layers are formed. The second thermally-grown oxygen-containing layer and the dummy gate are replaced by a metal gate and a high-k dielectric. The logic transistor is protected while the NVM cell is then formed including forming a charge storage layer.

Abstract: A method and system wherein a volatile memory is partitioned to have a first percentage of address space dedicated to a first classification of data which is data that is expected to have greater than a predetermined number of times of being modified and a second percentage of address space dedicated to a second classification of data which is data that is expected to have less than the predetermined probability of being modified. Address assignment of data to be stored in the volatile memory is made on a basis of predicted change of the data. Memory addresses of the first and second percentages of address space are respectively assigned to first and second sections of nonvolatile memory. The memory addresses of the first percentage initially consume a smaller percentage of an address map of the first section than the memory addresses of the second percentage of the second section.

Abstract: A system includes an emulation memory having a first sector of non-volatile memory for storing information, in which the non-volatile memory includes a plurality of records. It is determined if a last record written of the plurality of records is a compromised record, if the last record written is not a compromised record, a next write is performed to a record of the plurality of records that is next to the last record written. If the last record written is a comprised record, an address of the compromised record is determined, valid data for the address of the compromised record is written into the record of the plurality of records that is next to the compromised record, and data is written into a record that is next to the record of the plurality of records that is next to the compromised record.

Abstract: Forming an NVM structure includes forming a floating gate layer; forming a first dielectric layer over the floating gate layer; forming a plurality of nanocrystals over the first dielectric layer; etching the first dielectric layer using the plurality of nanocrystals as a mask to form dielectric structures, wherein the floating gate layer is exposed between adjacent dielectric structures; etching a first depth into the floating gate layer using the plurality of dielectric structures as a mask to form a plurality of patterned structures, wherein the first depth is less than a thickness of the floating gate layer; patterning the floating gate layer to form a floating gate; forming a second dielectric layer over the floating gate, wherein the second dielectric layer is formed over the patterned structures and on the floating gate layer between adjacent patterned structures; and forming a control gate layer over the second dielectric layer.

Abstract: A system has an emulation memory having a plurality of sectors for storing information. A controller calculates a number of addresses used divided by a number of valid records in a predetermined address range of the emulation memory. An amount of remaining addresses in a currently used space of the emulation memory which have not been used to store information is calculated. A determination is made whether the calculation is greater than a first predetermined number and whether the amount of remaining addresses is greater than a second predetermined number. If both the fraction is greater than the first predetermined number and the amount of remaining addresses is greater than the second predetermined number, any subsequent update requests are responded to using the currently used space of the emulation memory. Otherwise a compression of the emulation memory is required by copying valid data to an available sector.

Abstract: In a system having an emulation memory having a first sector of non-volatile memory for storing information, wherein the non-volatile memory includes a plurality of records, a method includes determining if a last record written of the plurality of records is a compromised record; if the last record written is not a compromised record, performing a next write to a record of the plurality of records that is next to the last record written; and if the last record written is a comprised record: determining an address of the compromised record; writing valid data for the address of the compromised record into the record of the plurality of records that is next to the compromised record; and writing data into a record that is next to the record of the plurality of records that is next to the compromised record.

Abstract: A system has an emulation memory having a plurality of sectors for storing information. A controller calculates a number of addresses used divided by a number of valid records in a predetermined address range of the emulation memory. An amount of remaining addresses in a currently used space of the emulation memory which have not been used to store information is calculated. A determination is made whether the calculation is greater than a first predetermined number and whether the amount of remaining addresses is greater than a second predetermined number. If both the fraction is greater than the first predetermined number and the amount of remaining addresses is greater than the second predetermined number, any subsequent update requests are responded to using the currently used space of the emulation memory. Otherwise a compression of the emulation memory is required by copying valid data to an available sector.

Abstract: A method and system wherein a volatile memory is partitioned to have a first percentage of address space dedicated to a first classification of data which is data that is expected to have greater than a predetermined number of times of being modified and a second percentage of address space dedicated to a second classification of data which is data that is expected to have less than the predetermined probability of being modified. Address assignment of data to be stored in the volatile memory is made on a basis of predicted change of the data. Memory addresses of the first and second percentages of address space are respectively assigned to first and second sections of nonvolatile memory. The memory addresses of the first percentage initially consume a smaller percentage of an address map of the first section than the memory addresses of the second percentage of the second section.

Abstract: A memory system including non-volatile memory cells. The memory system includes program circuitry that programs cells to a first threshold voltage or a second threshold voltage based on the number of times that cells of the memory system have been erased. In one embodiment, the threshold voltage is reduced when any set of cells of the memory system have been erased a specific number of times.

Abstract: A memory system including non-volatile memory cells. The memory system includes program circuitry that programs cells to a first threshold voltage or a second threshold voltage based on the number of times that cells of the memory system have been erased. In one embodiment, the threshold voltage is reduced when any set of cells of the memory system have been erased a specific number of times.

Abstract: A semiconductor device (30) comprises an underlying insulating layer (34), an overlying insulating layer (42) and a charge storage layer (36) between the insulating layers (34, 42). The charge storage layer (36) and the overlying insulating layer (42) form an interface, where at least a majority of charge in the charge storage layer (36) is stored. This can be accomplished by forming a charge storage layer (36) with different materials such as silicon and silicon germanium layers or n-type and p-type material layers, in one embodiment. In another embodiment, the charge storage layer (36) comprises a dopant that is graded. By storing at least a majority of the charge at the interface between the charge storage layer (36) and the overlying insulating layer (42), the leakage of charge through the underlying insulating layer is decreased allowing for a thinner underlying insulating layer (34) to be used.

Abstract: A memory system (200) has an array of addressable storage elements (210) arranged in a plurality of rows and a plurality of columns, and decoding circuitry (220, 230) coupled to the array of addressable storage elements (210). The decoding circuitry (220, 230), in response to decoding a first address, accesses a first storage element of a first row of the plurality of rows, and, in response to decoding a second address consecutive to the first address, accesses a second storage element of a second row of the plurality of rows. The second row of the plurality of rows is different from the first row of the plurality of rows. By implementing a memory system wherein consecutive addresses correspond to storage elements of different rows, read disturb stresses along a single row can be minimized.

Abstract: A non volatile memory includes a plurality of transistors having a non conductive storage medium. The transistors are erased by injecting holes into the storage medium from both the source edge region and drain edge region of the transistor. In one example, the storage medium is made from silicon nitride isolated from the underlying substrate and overlying gate by silicon dioxide. The injection of holes in the storage medium generates two hole distributions having overlapping portions. The combined distribution of the overlapping portions is above at least a level of the highest concentration of program charge in the overlap region of the storage medium. In one example, the transistors are programmed by hot carrier injection. In some examples, the sources of groups of transistors of the memory are decoded.