Abstract: A processor-implemented method imposes trust at the edge of a blockchain. A hardware interrogator in a terminal interrogates an Internet of Things Smart Device (IoTSD). The IoTSD is an off-line device that is associated with a physical product. The IoTSD includes a cryptographic processor and one or more state sensors that monitor a state of the physical product. The hardware interrogator detects an event that is described by an encrypted entry in the IoTSD. The terminal transmits, to a blockchain, a transaction that describes the event that is detected by the hardware interrogator, such that the blockchain adds the transaction to a blockchain that is dedicated to the physical product, and the blockchain establishes a state of the physical product.

Abstract: A private key of a public-private key pair with a corresponding identity is written to an integrated circuit including a processor, a non-volatile memory, and a cryptographic engine coupled to the processor and the non-volatile memory. The private key is written to the non-volatile memory. The integrated circuit is implemented in complementary metal-oxide semiconductor 14 nm or smaller technology. The integrated circuit is permanently modified, subsequent to the writing, such that further writing to the non-volatile memory is disabled and such that the private key can be read only by the cryptographic engine and not off-chip. Corresponding integrated circuits and wafers are also disclosed.

Abstract: A capacitive sensor array for in-situ monitoring directed self-assembly of a self-assembling material is provided. The capacitive sensor array includes a bottom electrode plate including a plurality of bottom electrodes that are spaced apart and electrically isolated from one another, template structures located on the bottom electrode plate, wherein the template structures define trenches therebetween, each of the trenches exposing at least one of the plurality of bottom electrodes; and a top electrode plate assembled on the bottom electrode plate, wherein the top electrode plate includes a plurality of top electrodes that are spaced apart and electrically isolated from one another, the top electrodes facing and intersecting, but electrically isolated from, the bottom electrodes.

Abstract: The present application provides devices, systems and methods for detecting the presence and/or length of an analyte. More specifically, the present application is directed to a structure and system that includes a micro-capacitive sensor array for detecting the presence of an analyte in a sample and determining the length and/or composition of an analyte, such as a nucleic acid, as well as methods for using the same.

Abstract: A private key of a public-private key pair with a corresponding identity is written to an integrated circuit including a processor, a non-volatile memory, and a cryptographic engine coupled to the processor and the non-volatile memory. The private key is written to the non-volatile memory. The integrated circuit is implemented in complementary metal-oxide semiconductor 14 nm or smaller technology. The integrated circuit is permanently modified, subsequent to the writing, such that further writing to the non-volatile memory is disabled and such that the private key can be read only by the cryptographic engine and not off-chip. Corresponding integrated circuits and wafers are also disclosed.

Abstract: A structure containing a vertical light emitting diode (LED) is provided. The vertical LED is present in an opening located in a display substrate, and the vertical LED is coupled to a back contact structure via a magnetic back contact structure. A first top contact structure contacts a topmost surface of the vertical LED and a second top contact structure contacts a surface of the back contact structure.

Abstract: The present invention provides a method and a structure of electrical component assembly on flexible materials. In an exemplary embodiment, the method and the structure include patterning metal on a tape, creating one or more holes in the tape, attaching one or more electronic devices to the tape in the one or more holes such that a profile of the tape and the one or more electronic devices is less than a threshold, electrically connecting the one or more electronic devices to the patterned metal, cutting the tape, resulting in one or more component portions of the tape and one or more excess portions of the tape, where the one or more component portions comprises at least one of the one or more electronic devices, attached to the patterned metal, and bonding the one or more component portions to a ribbon.

Abstract: The present application provides devices, systems and methods for detecting the presence and/or length of an analyte. More specifically, the present application is directed to a structure and system that includes a micro-capacitive sensor array for detecting the presence of an analyte in a sample and determining the length and/or composition of an analyte, such as a nucleic acid, as well as methods for using the same.

Abstract: A processor-implemented method imposes trust at the edge of a blockchain. A hardware interrogator in a terminal interrogates an Internet of Things Smart Device (IoTSD). The IoTSD is an off-line device that is associated with a physical product. The IoTSD includes a cryptographic processor and one or more state sensors that monitor a state of the physical product. The hardware interrogator detects an event that is described by an encrypted entry in the IoTSD. The terminal transmits, to a blockchain, a transaction that describes the event that is detected by the hardware interrogator, such that the blockchain adds the transaction to a blockchain that is dedicated to the physical product, and the blockchain establishes a state of the physical product.

Abstract: Magnetic regions of at least one of a chiplet or a receiving substrate are used to permit magnetically guided precision placement of a plurality of chiplets on the receiving substrate. In the present application, a solution containing dispersed chiplets is employed to facilitate the placement of the dispersed chiplets on bond pads that are present on a receiving substrate.

Abstract: The present application provides devices, systems and methods for detecting the presence and/or length of an analyte. More specifically, the present application is directed to a structure and system that includes a micro-capacitive sensor array for detecting the presence of an analyte in a sample and determining the length and/or composition of an analyte, such as a nucleic acid, as well as methods for using the same.

Abstract: A structure containing a vertical light emitting diode (LED) is provided. The vertical LED is present in an opening located in a display substrate, and the vertical LED is coupled to a back contact structure via a magnetic back contact structure. A first top contact structure contacts a topmost surface of the vertical LED and a second top contact structure contacts a surface of the back contact structure.

Abstract: Methods of transferring micro-array LEDs of various colors onto a surface of a display substrate are provided. The transferring includes releasing micro-LEDs of a specific color from a structure that includes a releasable material onto a display substrate. The releasable material may be a laser ablatable material or a material that is readily dissolved in a specific etchant.

Abstract: A structure containing a vertical light emitting diode (LED) is provided. The vertical LED is present in an opening located in a display substrate, and the vertical LED is coupled to a back contact structure via a magnetic back contact structure. A first top contact structure contacts a topmost surface of the vertical LED and a second top contact structure contacts a surface of the back contact structure.

Abstract: A private key of a public-private key pair with a corresponding identity is written to an integrated circuit including a processor, a non-volatile memory, and a cryptographic engine coupled to the processor and the non-volatile memory. The private key is written to the non-volatile memory. The integrated circuit is implemented in complementary metal-oxide semiconductor 14 nm or smaller technology. The integrated circuit is permanently modified, subsequent to the writing, such that further writing to the non-volatile memory is disabled and such that the private key can be read only by the cryptographic engine and not off-chip. Corresponding integrated circuits and wafers are also disclosed.

Abstract: A private key of a public-private key pair with a corresponding identity is written to an integrated circuit including a processor, a non-volatile memory, and a cryptographic engine coupled to the processor and the non-volatile memory. The private key is written to the non-volatile memory. The integrated circuit is implemented in complementary metal-oxide semiconductor 14 nm or smaller technology. The integrated circuit is permanently modified, subsequent to the writing, such that further writing to the non-volatile memory is disabled and such that the private key can be read only by the cryptographic engine and not off-chip. Corresponding integrated circuits and wafers are also disclosed.

Abstract: The present invention provides a method and a structure of electrical component assembly on flexible materials. In an exemplary embodiment, the method and the structure include patterning metal on a tape, creating one or more holes in the tape, attaching one or more electronic devices to the tape in the one or more holes such that a profile of the tape and the one or more electronic devices is less than a threshold, electrically connecting the one or more electronic devices to the patterned metal, cutting the tape, resulting in one or more component portions of the tape and one or more excess portions of the tape, where the one or more component portions comprises at least one of the one or more electronic devices, attached to the patterned metal, and bonding the one or more component portions to a ribbon.

Abstract: A private key of a public-private key pair with a corresponding identity is written to an integrated circuit including a processor, a non-volatile memory, and a cryptographic engine coupled to the processor and the non-volatile memory. The private key is written to the non-volatile memory. The integrated circuit is implemented in complementary metal-oxide semiconductor 14 nm or smaller technology. The integrated circuit is permanently modified, subsequent to the writing, such that further writing to the non-volatile memory is disabled and such that the private key can be read only by the cryptographic engine and not off-chip. Corresponding integrated circuits and wafers are also disclosed.

Abstract: A method, system, and apparatus for alleviating an obstruction caused by an object from a view of an observer includes a hardware device affixed to the object such that the observer observes a presentation on the device when observing the object. The device is enabled to receive a signal, wherein the signal corresponds to a portion of an ambience obscured by the object from a view of the observer. The signal is processed at the device and without using a data processing system, to generate a version of the signal. Using the device, the version of the signal is presented to the observer as the presentation, wherein the version of the signal alleviates the portion of the ambience obstructed by the object in the view of the observer.

Abstract: The present invention provides a method and a structure of electrical component assembly on flexible materials. In an exemplary embodiment, the method and the structure include patterning metal on a tape, creating one or more holes in the tape, attaching one or more electronic devices to the tape in the one or more holes such that a profile of the tape and the one or more electronic devices is less than a threshold, electrically connecting the one or more electronic devices to the patterned metal, cutting the tape, resulting in one or more component portions of the tape and one or more excess portions of the tape, where the one or more component portions comprises at least one of the one or more electronic devices, attached to the patterned metal, and bonding the one or more component portions to a ribbon.