Patents by Inventor Frank R. Libsch

Frank R. Libsch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190299702
    Abstract: The present invention provides a method and a structure of electrical component assembly on flexible materials. In an exemplary embodiment, the method and the structure include patterning metal on a tape, creating one or more holes in the tape, attaching one or more electronic devices to the tape in the one or more holes such that a profile of the tape and the one or more electronic devices is less than a threshold, electrically connecting the one or more electronic devices to the patterned metal, cutting the tape, resulting in one or more component portions of the tape and one or more excess portions of the tape, where the one or more component portions comprises at least one of the one or more electronic devices, attached to the patterned metal, and bonding the one or more component portions to a ribbon.
    Type: Application
    Filed: June 18, 2019
    Publication date: October 3, 2019
    Inventors: Frank R. Libsch, Ghavam G. Shahidi
  • Patent number: 10423805
    Abstract: A private key of a public-private key pair with a corresponding identity is written to an integrated circuit including a processor, a non-volatile memory, and a cryptographic engine coupled to the processor and the non-volatile memory. The private key is written to the non-volatile memory. The integrated circuit is implemented in complementary metal-oxide semiconductor 14 nm or smaller technology. The integrated circuit is permanently modified, subsequent to the writing, such that further writing to the non-volatile memory is disabled and such that the private key can be read only by the cryptographic engine and not off-chip. Corresponding integrated circuits and wafers are also disclosed.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: September 24, 2019
    Assignee: International Business Machines Corporation
    Inventors: Richard H. Boivie, Eduard A. Cartier, Daniel J. Friedman, Kohji Hosokawa, Charanjit Jutla, Wanki Kim, Chandrasekara Kothandaraman, Chung Lam, Frank R. Libsch, Seiji Munetoh, Ramachandran Muralidhar, Vijay Narayanan, Dirk Pfeiffer, Devendra K. Sadana, Ghavam G. Shahidi, Robert L. Wisnieff
  • Patent number: 10397532
    Abstract: A method, system, and apparatus for alleviating an obstruction caused by an object from a view of an observer includes a hardware device affixed to the object such that the observer observes a presentation on the device when observing the object. The device is enabled to receive a signal, wherein the signal corresponds to a portion of an ambience obscured by the object from a view of the observer. The signal is processed at the device and without using a data processing system, to generate a version of the signal. Using the device, the version of the signal is presented to the observer as the presentation, wherein the version of the signal alleviates the portion of the ambience obstructed by the object in the view of the observer.
    Type: Grant
    Filed: April 9, 2014
    Date of Patent: August 27, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Eric V. Kline, Frank R. Libsch, Thomas S. Mazzeo
  • Patent number: 10391805
    Abstract: The present invention provides a method and a structure of electrical component assembly on flexible materials. In an exemplary embodiment, the method and the structure include patterning metal on a tape, creating one or more holes in the tape, attaching one or more electronic devices to the tape in the one or more holes such that a profile of the tape and the one or more electronic devices is less than a threshold, electrically connecting the one or more electronic devices to the patterned metal, cutting the tape, resulting in one or more component portions of the tape and one or more excess portions of the tape, where the one or more component portions comprises at least one of the one or more electronic devices, attached to the patterned metal, and bonding the one or more component portions to a ribbon.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: August 27, 2019
    Assignee: International Business Machines Corporation
    Inventors: Frank R. Libsch, Ghavam G. Shahidi
  • Patent number: 10375364
    Abstract: A method, system, and apparatus for alleviating an obstruction caused by an object from a view of an observer includes a hardware device affixed to the object such that the observer observes a presentation on the device when observing the object. The device is enabled to receive a signal, wherein the signal corresponds to a portion of an ambience obscured by the object from a view of the observer. The signal is processed at the device and without using a data processing system, to generate a version of the signal. Using the device, the version of the signal is presented to the observer as the presentation, wherein the version of the signal alleviates the portion of the ambience obstructed by the object in the view of the observer.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: August 6, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Eric V. Kline, Frank R. Libsch, Thomas S. Mazzeo
  • Publication number: 20190195819
    Abstract: The present application provides devices, systems and methods for detecting the presence and/or length of an analyte. More specifically, the present application is directed to a structure and system that includes a micro-capacitive sensor array for detecting the presence of an analyte in a sample and determining the length and/or composition of an analyte, such as a nucleic acid, as well as methods for using the same.
    Type: Application
    Filed: December 22, 2017
    Publication date: June 27, 2019
    Inventors: Frank R. Libsch, Venkat K. Balagurusamy
  • Publication number: 20190193308
    Abstract: A capacitive sensor array for in-situ monitoring directed self-assembly of a self-assembling material is provided. The capacitive sensor array includes a bottom electrode plate including a plurality of bottom electrodes that are spaced apart and electrically isolated from one another, template structures located on the bottom electrode plate, wherein the template structures define trenches therebetween, each of the trenches exposing at least one of the plurality of bottom electrodes; and a top electrode plate assembled on the bottom electrode plate, wherein the top electrode plate includes a plurality of top electrodes that are spaced apart and electrically isolated from one another, the top electrodes facing and intersecting, but electrically isolated from, the bottom electrodes.
    Type: Application
    Filed: December 22, 2017
    Publication date: June 27, 2019
    Inventors: Frank R. Libsch, Venkat K. Balagurusamy
  • Patent number: 10319893
    Abstract: Magnetic regions of at least one of chiplet or a receiving substrate are used to permit magnetically guided precision placement of chiplets on the receiving substrate. In some embodiments, a scanning magnetic head can be used to release individual chiplets from a temporary support substrate to the receiving substrate. Structures are provided in which a magnetic moment of a controlled orientation exists between the transferred chiplets and the receiving substrate.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: June 11, 2019
    Assignee: International Business Machines Corporation
    Inventors: Stephen W. Bedell, Bing Dang, Ning Li, Frank R. Libsch, Devendra K. Sadana
  • Publication number: 20190092083
    Abstract: The present invention provides a method and a structure of electrical component assembly on flexible materials. In an exemplary embodiment, the method and the structure include patterning metal on a tape, creating one or more holes in the tape, attaching one or more electronic devices to the tape in the one or more holes such that a profile of the tape and the one or more electronic devices is less than a threshold, electrically connecting the one or more electronic devices to the patterned metal, cutting the tape, resulting in one or more component portions of the tape and one or more excess portions of the tape, where the one or more component portions comprises at least one of the one or more electronic devices, attached to the patterned metal, and bonding the one or more component portions to a ribbon.
    Type: Application
    Filed: September 25, 2017
    Publication date: March 28, 2019
    Inventors: Frank R. Libsch, Ghavam G. Shahidi
  • Patent number: 10170036
    Abstract: Systems and methods for displaying at least one image on an active display include a graphics generator for generating one or more graphics in form of at least one ghost image and a projector for projecting the generated at least one ghost image as an excitation light signal on the active display. The projector is a low power projector. Also included are number of detection diodes associated with pixels for detecting one or more excitation light signals for exciting each pixel associated with the detection diodes. Further included, is a photon detection circuit for generating at least one high power image photon based on the emitted light signal of each pixel on the active display and a number of light emitting diodes (LEDs) associated with each of the detection diodes for generating an emitted light signal for each of the pixels of the incident ghost image for generating an image on the active display.
    Type: Grant
    Filed: April 22, 2015
    Date of Patent: January 1, 2019
    Assignee: International Business Machines Corporation
    Inventors: Eric V. Kline, Frank R Libsch
  • Patent number: 10115711
    Abstract: A structure containing a vertical light emitting diode (LED) is provided. The vertical LED is present in an opening located in a display substrate, and the vertical LED is coupled to a back contact structure via a magnetic back contact structure. A first top contact structure contacts a topmost surface of the vertical LED and a second top contact structure contacts a surface of the back contact structure.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: October 30, 2018
    Assignee: International Business Machines Corporation
    Inventors: Stephen W. Bedell, Bing Dang, Ning Li, Frank R. Libsch, Devendra K. Sadana
  • Publication number: 20180301440
    Abstract: A structure containing a vertical light emitting diode (LED) is provided. The vertical LED is present in an opening located in a display substrate, and the vertical LED is coupled to a back contact structure via a magnetic back contact structure. A first top contact structure contacts a topmost surface of the vertical LED and a second top contact structure contacts a surface of the back contact structure.
    Type: Application
    Filed: June 21, 2018
    Publication date: October 18, 2018
    Inventors: Stephen W. Bedell, Bing Dang, Ning Li, Frank R. Libsch, Devendra K. Sadana
  • Publication number: 20180254395
    Abstract: Magnetic regions of at least one of chiplet or a receiving substrate are used to permit magnetically guided precision placement of chiplets on the receiving substrate. In some embodiments, a scanning magnetic head can be used to release individual chiplets from a temporary support substrate to the receiving substrate. Structures are provided in which a magnetic moment of a controlled orientation exists between the transferred chiplets and the receiving substrate.
    Type: Application
    Filed: May 2, 2018
    Publication date: September 6, 2018
    Inventors: Stephen W. Bedell, Bing Dang, Ning Li, Frank R. Libsch, Devendra K. Sadana
  • Publication number: 20180219005
    Abstract: Methods of transferring micro-array LEDs of various colors onto a surface of a display substrate are provided. The transferring includes releasing micro-LEDs of a specific color from a structure that includes a releasable material onto a display substrate. The releasable material may be a laser ablatable material or a material that is readily dissolved in a specific etchant.
    Type: Application
    Filed: March 29, 2018
    Publication date: August 2, 2018
    Inventors: Stephen W. Bedell, Bing Dang, Ning Li, Frank R. Libsch, Devendra K. Sadana
  • Publication number: 20180212120
    Abstract: Magnetic regions of at least one of chiplet or a receiving substrate are used to permit magnetically guided precision placement of chiplets on the receiving substrate. In some embodiments, a scanning magnetic head can be used to release individual chiplets from a temporary support substrate to the receiving substrate. Structures are provided in which a magnetic moment of a controlled orientation exists between the transferred chiplets and the receiving substrate.
    Type: Application
    Filed: January 26, 2017
    Publication date: July 26, 2018
    Inventors: Stephen W. Bedell, Bing Dang, Ning Li, Frank R. Libsch, Devendra K. Sadana
  • Publication number: 20180211941
    Abstract: A structure containing a vertical light emitting diode (LED) is provided. The vertical LED is present in an opening located in a display substrate, and the vertical LED is coupled to a back contact structure via a magnetic back contact structure. A first top contact structure contacts a topmost surface of the vertical LED and a second top contact structure contacts a surface of the back contact structure.
    Type: Application
    Filed: January 25, 2017
    Publication date: July 26, 2018
    Inventors: Stephen W. Bedell, Bing Dang, Ning Li, Frank R. Libsch, Devendra K. Sadana
  • Publication number: 20180211992
    Abstract: Magnetic regions of at least one of a chiplet or a receiving substrate are used to permit magnetically guided precision placement of a plurality of chiplets on the receiving substrate. In the present application, a solution containing dispersed chiplets is employed to facilitate the placement of the dispersed chiplets on bond pads that are present on a receiving substrate.
    Type: Application
    Filed: November 6, 2017
    Publication date: July 26, 2018
    Inventors: Stephen W. Bedell, Ning Li, Frank R. Libsch, Devendra K. Sadana, Bing Dang
  • Patent number: 10032973
    Abstract: Magnetic regions of at least one of chiplet or a receiving substrate are used to permit magnetically guided precision placement of chiplets on the receiving substrate. In some embodiments, a scanning magnetic head can be used to release individual chiplets from a temporary support substrate to the receiving substrate. Structures are provided in which a magnetic moment of a controlled orientation exists between the transferred chiplets and the receiving substrate.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: July 24, 2018
    Assignee: International Business Machines Corporation
    Inventors: Stephen W. Bedell, Bing Dang, Ning Li, Frank R. Libsch, Devendra K. Sadana
  • Publication number: 20180181774
    Abstract: A private key of a public-private key pair with a corresponding identity is written to an integrated circuit including a processor, a non-volatile memory, and a cryptographic engine coupled to the processor and the non-volatile memory. The private key is written to the non-volatile memory. The integrated circuit is implemented in complementary metal-oxide semiconductor 14 nm or smaller technology. The integrated circuit is permanently modified, subsequent to the writing, such that further writing to the non-volatile memory is disabled and such that the private key can be read only by the cryptographic engine and not off-chip. Corresponding integrated circuits and wafers are also disclosed.
    Type: Application
    Filed: December 22, 2016
    Publication date: June 28, 2018
    Inventors: Richard H. Boivie, Eduard A. Cartier, Daniel J. Friedman, Kohji Hosokawa, Charanjit Jutla, Wanki Kim, Chandrasekara Kothandaraman, Chung Lam, Frank R. Libsch, Seiji Munetoh, Ramachandran Muralidhar, Vijay Narayanan, Dirk Pfeiffer, Devendra K. Sadana, Ghavam G. Shahidi, Robert L. Wisnieff
  • Patent number: 10002856
    Abstract: Methods of transferring micro-array LEDs of various colors onto a surface of a display substrate are provided. The transferring includes releasing micro-LEDs of a specific color from a structure that includes a releasable material onto a display substrate. The releasable material may be a laser ablatable material or a material that is readily dissolved in a specific etchant.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: June 19, 2018
    Assignee: International Business Machines Corporation
    Inventors: Stephen W. Bedell, Bing Dang, Ning Li, Frank R. Libsch, Devendra K. Sadana