Abstract: A simply constructed and economical optical connector, wherein a fiber ribbon or waveguide ribbon cable incorporates a plurality of projecting fiber or waveguide ends adapted to engage into a guiding feature in a structure that incorporates an array of microlenses, upon said structure being aligned with and attached to a ferrule housing the ribbon cable. The guiding feature enables apertures in the ferrule within which the projecting fiber or waveguide ends are guides towards engagement with guiding feature in the microlens containing structure, to be formed or dimensioned with relaxed tolerances relative to the fiber or waveguide ends, thereby considerable reducing manufacturing costs for the ferrule.

Abstract: An optical assembly includes a waveguide assembly and an optical coupling element. The waveguide assembly includes a core, a cladding portion, and, preferably, at least two waveguide core fiducials, the at least two waveguide core fiducials and the core being lithographically formed substantially simultaneously in a substantially coplanar layer. The core and the at least two waveguide core fiducials are formed in a predetermined relationship with the cladding portion. The optical coupling element (for example, a lens array or mechanical transfer (MT) ferrule), includes an optical element and, preferably, at least two alignment features associated with the optical element, the at least two alignment features being mated with the at least two waveguide core fiducials to accurately position the optical element with respect to the core in an X-Y plane. A method of alignment is also provided.

Abstract: A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold are configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed.

Abstract: LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating surfaces. For those LGA types made by molding techniques such as the metal-in-polymer type (eg. Tyco Electronics MPI, or Shin Etsu RP) or the Metal-on-Elastomer type (IBM), using molds with the desired topography provides the desired LGA topography.

Abstract: A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities. Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold are configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed.

Abstract: A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities. Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold are configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed.

Abstract: A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls ale dispensed into the aligned through holes and cavities Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold ale configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed.

Abstract: Integrated optoelectronic chips or collections of chips on a module that have both electrical as well as optical interconnects offer many advantages in speed, power consumption and heat generation. Mixed signal types, however, pose significant packaging challenges. This invention describes a land grid array (LGA) interposer which can simultaneously connect electrical and optical signals from a module to a printed circuit board.

Abstract: An optical assembly includes a waveguide assembly and an optical coupling element. The waveguide assembly includes a core, a cladding portion, and, preferably, at least two waveguide core fiducials, the at least two waveguide core fiducials and the core being lithographically formed substantially simultaneously in a substantially coplanar layer. The core and the at least two waveguide core fiducials are formed in a predetermined relationship with the cladding portion. The optical coupling element (for example, a lens array or mechanical transfer (MT) ferrule), includes an optical element and, preferably, at least two alignment features associated with the optical element, the at least two alignment features being mated with the at least two waveguide core fiducials to accurately position the optical element with respect to the core in an X-Y plane. A method of alignment is also provided.

Abstract: An optical assembly includes a waveguide assembly and an optical coupling element. The waveguide assembly includes a core, a cladding portion, and, preferably, at least two waveguide core fiducials, the at least two waveguide core fiducials and the core being lithographically formed substantially simultaneously in a substantially coplanar layer. The core and the at least two waveguide core fiducials are formed in a predetermined relationship with the cladding portion. The optical coupling element (for example, a lens array or mechanical transfer (MT) ferrule), includes an optical element and, preferably, at least two alignment features associated with the optical element, the at least two alignment features being mated with the at least two waveguide core fiducials to accurately position the optical element with respect to the core in an X-Y plane A method of alignment is also provided.

Abstract: An optical assembly includes a waveguide assembly and an optical coupling element. The waveguide assembly includes a core, a cladding portion, and, preferably, at least two waveguide core fiducials, the at least two waveguide core fiducials and the core being lithographically formed substantially simultaneously in a substantially coplanar layer The core and the at least two waveguide core fiducials are formed in a predetermined relationship with the cladding portion.

Abstract: An optical assembly includes a waveguide assembly and an optical coupling element. The waveguide assembly includes a core, a cladding portion, and, preferably, at least two waveguide core fiducials, the at least two waveguide core fiducials and the core being lithographically formed substantially simultaneously in a substantially coplanar layer. The core and the at least two waveguide core fiducials are formed in a predetermined relationship with the cladding portion. The optical coupling element (for example, a lens array or mechanical transfer (MT) ferrule), includes an optical element and, preferably, at least two alignment features associated with the optical element, the at least two alignment features being mated with the at least two waveguide core fiducials to accurately position the optical element with respect to the core in an X-Y plane. A method of alignment is also provided.

Abstract: An optoelectronic device includes a substrate having a surface, a metallic coupling structure deposited on the surface of the substrate, the metallic coupling structure having a port and a waveguide interface portion with at least two waveguide interface portion sides, and a dielectric waveguide, the dielectric waveguide having a coupling interface portion deposited adjacent the at least two waveguide interface portion sides of the waveguide interface portion of the metallic coupling structure. It is possible to form high speed, CMOS-process-compatible, low power optical-electrical and electrical-optical conversion devices (i.e. optical detectors, modulators, and frequency mixer's) on the top of the semiconductor chip, after the rest of the wiling has been laid down.

Abstract: There is provided a circuit for driving a current mode light modulating device. The circuit includes (a) a capacitor for storing a data voltage, (b) a field effect transistor (FET) controlled by a signal on a scan line, for coupling the data voltage from a signal line to the capacitor, and (c) a current source, controlled by the stored data voltage, for driving the device with current provided from a power line. The power line is in a plane that is geometrically parallel to a plane within which the scan line is located.

Abstract: There is provided a circuit for driving an organic light emitting diode (OLED). The circuit includes a current source for providing current to a first terminal of the OLED, and a generator for providing a variable voltage signal to a second terminal of the OLED to facilitate control of the current.

Abstract: A circuit for providing a current to an organic light emitting diode comprising: (a) an amorphous silicon field effect transistor having a gate electrode and a drain electrode through which the current is provided to the organic light emitting diode; and (b) a controller for controlling a bias between the gate electrode and the drain electrode to maintain a threshold voltage shift of less than about 1V. The organic light emitting diode is preferably a component in an active matrix.

Abstract: A light emitting pixel circuit comprising a light emitting diode having a parasitic capacitance and coupled to a current source; nonlinear feedback means for rapidly charging the parasitic capacitance and for enabling immediately following such charging, illumination of the diode, responsive to a predefined constant current level from the current source.

Abstract: An active matrix organic light-emitting diode comprising an organic light-emitting diode portion. The organic light-emitting diode portion comprising: an underlayer having a top surface and bottom surface; a first electrode layer which is deposited and patterned on the top surface of the underlayer such that at least a portion of the underlayer is exposed, wherein the deposited first electrode layer comprises a top surface, a bottom surface and sidewalls disposed between the top and bottom surfaces, the sidewalls are positioned adjacent to the exposed portion of the underlayer; a passivation layer deposited on the exposed portion of the underlayer and the peripheral regions of the first electrode layer such that the passivation layer covers the sidewalls and the peripheral regions of the first electrode layer; a transparent conductor layer deposited on the passivation layer and the non-peripheral regions of the first electrode layer; and a second electrode layer deposited on the transparent conductor layer.

Abstract: A transistor, in accordance with the present inventions includes a gate electrode layer formed on a substrate and an insulating layer formed on the gate electrode layer. A first conductive layer forms a first portion and a second portion separated by a gap therebetween. The gap is formed at a position corresponding to a gate electrode in the gate electrode layer. A doping layer is formed on the first portion and the second portion of the first conductive layer, forming a source and a drain for the transistor. A semiconductor layer is formed over the doping layer of the first portion and the second portion and in the gap in contact with the insulating layer such that upon activation of the gate electrode current flows across the gap directly between the first portion and the second portion in the first conductive layer. Methods for fabrication and other embodiments are also included.

Abstract: There is provided a circuit for driving a current mode light modulating device. The circuit includes (a) a capacitor for storing a data voltage, (b) a field effect transistor (FET) controlled by a signal on a scan line, for coupling the data voltage from a signal line to the capacitor, and (c) a current source, controlled by the stored data voltage, for driving the device with current provided from a power line. The power line is in a plane that is geometrically parallel to a plane within which the scan line is located.