Patents by Inventor Frank Singer

Frank Singer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210111108
    Abstract: A package is disclosed. In one example, the package comprises a substrate having at least one first recess on a front side and at least one second recess on a back side, wherein the substrate is separated into a plurality of separate substrate sections by the at least one first recess and the at least one second recess, an electronic component mounted on the front side of the substrate, and a single encapsulant filling at least part of the at least one first recess and at least part of the at least one second recess. The encapsulant fully circumferentially surrounds sidewalls of at least one of the substrate sections.
    Type: Application
    Filed: October 14, 2020
    Publication date: April 15, 2021
    Applicant: Infineon Technologies AG
    Inventors: Frank Singer, Martin Gruber, Thorsten Meyer, Thorsten Scharf, Peter Strobel, Stefan Woetzel
  • Publication number: 20210104574
    Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.
    Type: Application
    Filed: September 30, 2020
    Publication date: April 8, 2021
    Inventors: Martin BEHRINGER, Andreas BIEBERSDORF, Ruth BOSS, Erwin LANG, Tobias MEYER, Alexander PFEUFFER, Marc PHILIPPENS, Julia STOLZ, Tansen VARGHESE, Sebastian WITTMANN, Siegfried HERRMANN, Berthold HAHN, Bruno JENTZSCH, Korbinian PERZLMAIER, Peter STAUSS, Petrus SUNDGREN, Jens MUELLER, Kerstin NEVELING, Frank SINGER, Christian MUELLER
  • Patent number: 10964861
    Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: March 30, 2021
    Assignee: OSRAM OLED GmbH
    Inventors: Markus Pindl, Thomas Schwarz, Frank Singer, Sandra Sobczyk
  • Publication number: 20210091283
    Abstract: An optoelectronic assembly comprises at least two electrical contacts on a surface of an optoelectronic component for supplying electrical energy for generating electromagnetic radiation, and at least two meander-shaped contact lugs, each of which comprises a first and a second section. The first section in each case of the at least two meander-shaped contact lugs is coupled to one of the at least two electrical contacts. The second section in each case of the at least two meander-shaped contact lugs comprises a fastening element which is designed to go into a mechanical linkage to a fiber structure of a carrier and to create an electrical connection to the first section.
    Type: Application
    Filed: February 22, 2019
    Publication date: March 25, 2021
    Inventors: Frank SINGER, Siegfried HERRMANN
  • Publication number: 20210080637
    Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.
    Type: Application
    Filed: September 30, 2020
    Publication date: March 18, 2021
    Inventors: Peter BRICK, Jean-Jacques DROLET, Hubert HALBRITTER, Laura KREINER, Thomas SCHWARZ, Tilman RUEGHEMIER, Frank SINGER
  • Publication number: 20210075187
    Abstract: An optoelectronic component is provided that includes a radiation-emitting semiconductor chip, which emits electromagnetic radiation from a radiation exit surface during operation, a carrier comprising at least two first contact points, and a cover comprising at least two second contact points (4c), wherein the at least two first contact points and the at least two second contact points are electrically conductively and/or thermally conductively connected to one another by a first plurality of nanowires and a second plurality (6b) of nanowires, and the nanowires provide a mechanically stable connection between the carrier and the cover. In addition, a method for producing an optoelectronic component is given.
    Type: Application
    Filed: March 6, 2019
    Publication date: March 11, 2021
    Inventors: Frank Singer, Jörg Erich Sorg
  • Publication number: 20210048594
    Abstract: A composite component, a device, and method for producing the composite component including a plurality of optical components, a removable sacrificial layer, a retaining structure and a common intermediate carrier are provided, wherein the optical components each have an optical element for shaping a light beam and the sacrificial layer is arranged in the vertical direction at least in places between the intermediate carrier and the optical components. The retaining structure includes retaining elements, wherein the retaining structure and the sacrificial layer form a mechanical connection between the intermediate carrier and the optical components. The optical components are mechanically connected to the intermediate carrier only via the retaining structure, wherein the retaining elements are formed in such a way that under mechanical load they release the optical components so that the optical components are formed to be detachable from the intermediate carrier and thus transferable.
    Type: Application
    Filed: February 5, 2019
    Publication date: February 18, 2021
    Inventors: Frank Singer, Hubert Halbritter
  • Patent number: 10923640
    Abstract: An optoelectronic component includes a carrier, and a housing material arranged above a top side of a carrier, wherein a cavity is configured in the housing material, a top side of a first optoelectronic semiconductor chip is arranged in the cavity, the first optoelectronic semiconductor chip has a first electrical connection pad arranged at the top side of the first optoelectronic semiconductor chip, and electrically conductively connects by a bond wire to a first contact pad arranged at the top side of the carrier, a first section of the bond wire is arranged in the cavity and a second section of the bond wire is embedded the housing material, a covering material is arranged in the cavity and covers at least one part of the top side of the first optoelectronic semiconductor chip, and the first section of the bond wire is embedded in the covering material.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: February 16, 2021
    Assignee: OSRAM OLED GmbH
    Inventors: Thomas Schwarz, Stefan Listl, Björn Hoxhold, Frank Singer
  • Patent number: 10916686
    Abstract: An optoelectronic component includes an optoelectronic semiconductor chip having a radiation-emitting face; and an optical element arranged over the radiation-emitting face, wherein the optical element includes a material in which light-scattering particles are embedded, and a concentration of the embedded light-scattering particles has a gradient forming an angle not equal to 90° with the radiation emission face.
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: February 9, 2021
    Assignee: OSRAM OLED GmbH
    Inventors: Thomas Schwarz, Frank Singer, Alexander Linkov, Stefan Illek, Wolfgang Moench
  • Patent number: 10903392
    Abstract: A method of producing optoelectronic semiconductor components, the method includes: a) providing a composite comprising a semiconductor layer sequence including an active region that generates or receives radiation; b) determining a position of at least one defect region of the semiconductor layer sequence; c) forming a plurality of electrically contactable functional regions that each include a part of the semiconductor layer sequence and are free of a defect region; and d) separating the composite into a plurality of optoelectronic semiconductor components that each include at least one of the functional regions.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: January 26, 2021
    Assignee: OSRAM OLED GmbH
    Inventors: Jürgen Moosburger, Matthias Sabathil, Frank Singer
  • Publication number: 20210020620
    Abstract: Optoelectronic components are described that may include a plurality of light-emitting regions arranged on a carrier substrate. Microwires may project relative to a main surface of the carrier substrate. A plurality of microwires may be arranged between each pair of adjacent light-emitting regions. The light-emitting regions may each be surrounded by rows of microwires.
    Type: Application
    Filed: March 13, 2019
    Publication date: January 21, 2021
    Inventors: Britta GOEOETZ, Frank SINGER
  • Patent number: 10886704
    Abstract: In one embodiment of the invention, the semiconductor laser (1) comprises a semiconductor layer sequence (2). The semiconductor layer sequence (2) contains an n-type region (23), a p-type region (21) and an active zone (22) lying between the two. A laser beam is produced in a resonator path (3). The resonator path (3) is aligned parallel to the active zone (22). In addition, the semiconductor laser (1) contains an electrical p-contact (41) and an electrical n-contact (43) each of which is located on the associated region (21, 23) of the semiconductor layer sequence (2) and is configured to input current directly into the associated region (21, 23). The n-contact (43) extends from the p-type region (21) through the active zone (22) and into the n-type region (23) and is located, when viewed from above, next to the resonator path (3).
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: January 5, 2021
    Assignee: OSRAM OLED GMBH
    Inventors: Frank Singer, Norwin Von Malm, Tilman Ruegheimer, Thomas Kippes
  • Patent number: 10867977
    Abstract: A display device and a method for producing a display device are disclosed. In an embodiment a display device includes a flat textile support and a plurality of optoelectronic semiconductor components disposed on the support. Each semiconductor component includes a connection substrate comprising a plurality of electrical connections, the plurality of electrical connections electrically connected via electrically conductive contact threads, wherein each electrical connection is realized by a contact hole which completely penetrates through the semiconductor component and, viewed in a plan view, is surrounded all around by the connection substrate and wherein, in each case, at least one contact thread runs through the contact hole so that the contact thread is arranged in part on an upper side of the semiconductor component facing away from the support, a plurality of semiconductor chips for generating light and at least one control unit for adjusting a color location of the light.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: December 15, 2020
    Assignee: OSRAM OLED GMBH
    Inventors: Frank Singer, Andreas Dobner
  • Patent number: 10854804
    Abstract: A light-emitting component includes a light-emitting chip and a housing including a plastic body and a reflector, the reflector includes an electrically conductive layer, the light-emitting chip includes a top side and an underside, the underside of the light-emitting chip is arranged on the plastic body, an electrical terminal on the top side of the light-emitting chip electrically conductively connects to the reflector by a bond wire, the underside of the light-emitting chip and the reflector are electrically insulated from one another, a conduction region is provided within the plastic body, thermal conductivity of the conduction region is greater than thermal conductivity of the plastic body, the conduction region adjoins the underside of the light-emitting chip, and the conduction region extends from the side of the plastic body facing the light-emitting chip as far as the side of the plastic body facing away from the light-emitting chip.
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: December 1, 2020
    Assignee: OSRAM OLED GmbH
    Inventors: Martin Haushalter, Frank Singer, Thomas Schwarz, Andreas Ploessl
  • Publication number: 20200365764
    Abstract: An optoelectronic semiconductor chip includes a plurality of core-shell rods that generate electromagnetic radiation spaced apart from each other; a first electrically conductive contact structure for n-side electrical contacting of the core-shell rods; and a second electrically conductive contact structure for p-side electrical contacting of the core-shell rods, wherein the first electrically conductive contact structure and the second electrically conductive contact structure overlap at least in sections in a vertical direction, the optoelectronic semiconductor chip is surface mountable on a mounting side, and at least a partial region of the two electrically conductive contact structures extends through a breakthrough through at least one layer of the optoelectronic semiconductor chip.
    Type: Application
    Filed: August 4, 2017
    Publication date: November 19, 2020
    Inventors: Frank Singer, Siegfried Herrmann
  • Publication number: 20200313399
    Abstract: In one embodiment the semiconductor laser (1) comprises a carrier (2) and an edge-emitting laser diode (3) which is mounted on the carrier (2) and which comprises an active zone (33) for generating a laser radiation (L) and a facet (30) with a radiation exit region (31). The semiconductor laser (1) further comprises a protective cover (4), preferably a lens for collimation of the laser radiation (L). The protective cover (4) is fastened to the facet (30) and to a side surface (20) of the carrier (2) by means of an adhesive (5). A mean distance between a light entrance side (41) of the protective cover (4) and the facet (30) is at most 60 ?m. The semiconductor laser (1) is configured to be operated in a normal atmosphere without additional gas-tight encapsulation.
    Type: Application
    Filed: October 8, 2018
    Publication date: October 1, 2020
    Inventors: Jörg Erich SORG, Harald KÖNIG, Alfred LELL, Florian PESKOLLER, Karsten AUEN, Roland SCHULZ, Herbert BRUNNER, Frank SINGER, Roland HÜTTINGER
  • Publication number: 20200286873
    Abstract: A light-emitting component may include an IC chip and an LED chip arranged on a top surface of the IC chip and electrically coupled thereto. The LED chip may be electrically controllable by means of the IC chip. The IC chip may have at least two electrical connecting surface on a bottom surface remote from the LED chip. The light-emitting component is electrically contactable and operable by means of the connecting surfaces.
    Type: Application
    Filed: September 25, 2018
    Publication date: September 10, 2020
    Inventors: Thomas Schwarz, Frank Singer
  • Patent number: 10763396
    Abstract: A light-emitting module and a display device including the same are disclosed. In an embodiment a light-emitting module includes a plurality of emission regions configured to emit light, at least one first emission region and at least one second emission region of a first type configured to emit light of a first color locus and at least one first emission region and at least one second emission region of a second type configured to emit light of a second color locus and a control device for supplying the emission regions with current, wherein the emission regions are arranged on a common semiconductor chip, wherein the first color locus is different from the second color locus, wherein the first and second emission regions of the first type are adjacent to one another, and wherein the first and second emission regions of the second type are adjacent to one another.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: September 1, 2020
    Assignee: OSRAM OLED GMBH
    Inventors: Jürgen Moosburger, Matthias Sabathil, Frank Singer
  • Publication number: 20200273842
    Abstract: An optoelectronic module is provided with: a carrier with a main plane of extension, a first emission region with a plurality of emitters of a first type, which are configured to emit light of at least one predeterminable first color location during operation of the optoelectronic module, a second emission region with a plurality of emitters of a second type, which are configured to emit light of at least one predeterminable second color location during operation of the optoelectronic module, and a third emission region with a plurality of emitters of a third type, which are configured to emit light of at least one predeterminable third color location during operation of the optoelectronic module, wherein the emission regions are arranged spaced apart from each other on the carrier. In addition, a display element with a plurality of optoelectronic modules is specified.
    Type: Application
    Filed: September 21, 2018
    Publication date: August 27, 2020
    Inventors: Peter BRICK, Hubert HALBRITTER, Mikko PERAELAE, Joachim REILL, Frank SINGER
  • Publication number: 20200273907
    Abstract: A light-emitting semiconductor chip and a display device are disclosed. In an embodiment a light-emitting semiconductor chip includes an emission surface formed with a plurality of first emission regions and second emission regions, wherein the first emission regions and the second emission regions are configured to emit light of a predeterminable color location, wherein the first and second emission regions are separately controllable from each other, wherein the first emission regions and second emission regions are arranged next to one another in a first plane, wherein all second emission regions form at least a part of an outer edge of the emission surface, and wherein the first emission regions have a smaller extent than the second emission regions along at least one direction lying in the first plane.
    Type: Application
    Filed: July 31, 2018
    Publication date: August 27, 2020
    Applicant: Osram Oled GmbH
    Inventors: Peter BRICK, Hubert HALBRITTER, Mikko PERÄLÄ, Frank SINGER