Abstract: An anti-reflection coating has an average total reflectance of less than 10%, for example less than 5.9% such as from 4.9% to 5.9%, over a spectrum of wavelengths of 400-1100 nm and a range of angles of incidence of 0-90 degrees with respect to a surface normal of the anti-reflection coating. An anti-reflection coating has a total reflectance of less than 10%, for example less than 6% such as less than 4%, over an entire spectrum of wavelengths of 400-1600 nm and an entire range of angles of incidence of 0-70 degrees with respect to a surface normal of the anti-reflection coating.

Abstract: A class of solvent resistant, flexible copolyimide substrates having high optical transparency (>80% from 400 to 750 nm) that is retained after brief exposure to 300° C., near-zero birefringence (<0.001) and a maximum CTE of approximately 60 ppm/° C. is disclosed. The copolyimides are prepared from alicyclic dianhydrides, aromatic cardo diamines, and aromatic diamines containing free carboxyl groups. The substrates are manufactured from solutions of the copolyimides containing multifunctional epoxides in the form of single layer films, multilayer laminates and glass fiber reinforced composite films. The substrates can be used in the construction of flexible optical displays, and other microelectronic and photovoltaic devices that require their unique combination of properties.

Abstract: One illustrative transistor of a first dopant type disclosed herein includes a gate structure positioned above a semiconductor substrate and first and second overall epitaxial cavities formed in the semiconductor substrate on opposite sides of the gate structure. The device also includes a counter-doped epitaxial semiconductor material positioned proximate a bottom of each of the first and second overall epitaxial cavities, wherein the counter-doped epitaxial semiconductor material is doped with a second dopant type that is opposite to the first dopant type, and a same-doped epitaxial semiconductor material positioned in each of the first and second overall epitaxial cavities above the counter-doped epitaxial semiconductor material, wherein the same-doped epitaxial semiconductor material is doped with a dopant of the first dopant type.

Abstract: A flexible substrate with a high optical transparency (>80% from 400 to 750 nm) that is retained after exposure to 300° C., near-zero birefringence (<±0.001), and a relatively low CTE (<60 ppm/° C.) is disclosed. The substrate may be manufactured as single layer, polyimide films and as a multi-layer laminate comprising a polyimide layer and a thin glass layer. The polyimides may include alicyclic dianhydrides and aromatic, cardo diamines. The films formed of the polyimides can serve as flexible substrates for optical displays and other applications that require their unique combination of properties.

Abstract: Methods, apparatus, systems, computing devices, computing entities, and/or the like for programmatic methodologies for determining and providing prior authorization requirements in a way that facilitates inputting information/data, updating information/data, searching information/data, viewing information/data, reporting information/data, and analyzing information/data while being broadly accessible to disparate systems.

Abstract: The present invention is directed toward transparent films prepared from soluble aromatic copolyamides with glass transition temperatures greater than 300 C. The copolyamides, which contain pendant carboxylic groups are solution cast into films using N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), or other polar solvents. The films are thermally cured at temperatures near the copolymer glass transition temperature. After curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant. The films are useful as flexible substrates for microelectronic devices.

Abstract: Embodiments disclosed herein provide compositions for conjugates, including fusion proteins, and methods of using them to treat a variety of conditions. In some embodiments, the conjugates and/or fusion proteins incorporate a 60-amino acid human homeodomain (e.g., peptides derived from human HOX genes), to translocate functional and regulatory peptides and proteins or other biologically active molecules such as nucleic acids, which are not naturally associated with the human homeodomain, across cell and nuclear membranes to intended sites of action without provoking an unwanted immune response that may reduce exposure to the conjugate and/or result in a clinical adverse event. In further embodiments, disclosed conjugates and fusion proteins can pass through the blood-brain barrier to allow entry into the CNS.

Abstract: Methods and apparatus to generate consumer data are disclosed. An example method of selecting a sample of transaction data corresponding to a membership program includes defining a first type of member of the membership program; defining a second type of member of the membership program; calculating, via a processor, a target for the sample; selecting, via the processor, a first portion of the transaction data for the first type of member in accordance with the target; generating, via the processor, an updated target by recalculating the target with the first portion of the transaction data removed from consideration; and selecting, via the processor, a second portion of the transaction data for the second type of member in accordance with the updated target.

Abstract: Techniques are disclosed relating to caches that support transient storage fields for cache entries. In some embodiments, cache circuitry includes a set of multiple cache entries that each include a tag field and a data field. In some embodiments, transient storage circuitry includes a transient storage field for each of the multiple cache entries. In some embodiments, cache control circuitry stores received first data in the data field of a cache entry and stores received transient data in a corresponding transient storage field. In response to an eviction determination for the cache entry, however, the cache control circuitry may write the first data but not the transient data to a backing memory for the cache circuitry. In various embodiments, disclosed techniques may allow caching additional data that is transient without increasing bandwidth to the backing memory.

Abstract: A window operating system moves a window sash between an open position and a closed position. A window has a top member operatively connected to a bottom member by a first side member and a second side member to form a frame. The sash is mounted to the frame for relative movement between the open and closed positions. The window operating system comprises an operator and an elongate member. The operator has a rotating member, and the elongate member provides rotational movement to the rotating member of the operator and movement of the elongate member rotates the rotating member thereby opening and closing the sash.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to dummy fill structures and methods of manufacture. The structure includes: a passive device formed in interlevel dielectric material; and a plurality of metal dummy fill structures composed of at least one main branch and two extending legs from at least one side of the main branch, the at least two extending legs being positioned and structured to suppress eddy currents of the passive device.

Abstract: A lifting device for the manual lifting of bird feeder covers and holding them in a temporary position above the main body of the bird feeder device while the bird feeder is refilled or cleaned manually.

Abstract: One illustrative transistor device disclosed herein includes a gate structure positioned above a semiconductor substrate and first and second overall epitaxial cavities formed in the semiconductor substrate on opposite sides of the gate structure. In one embodiment, each of the first and second overall epitaxial cavities includes a substantially vertically oriented upper epitaxial cavity and a lower epitaxial cavity, wherein the substantially vertically oriented upper epitaxial cavity extends from an upper surface of the semiconductor substrate to the lower epitaxial cavity. A lateral width of the lower epitaxial cavity is greater than a lateral width of the upper epitaxial cavity. The device also includes epitaxial semiconductor material positioned in each of the first and second overall epitaxial cavities.

Abstract: Chamferless via structures and methods of manufacture are provided. The method includes: forming at least one self-aligned via within at least dielectric material; plugging the at least one self-aligned via with material; forming a protective sacrificial mask over the material which plugs the at least one self-aligned via, after a recessing process; forming at least one trench within the dielectric material, with the protective sacrificial mask protecting the material during the trench formation; removing the protective sacrificial mask and the material within the at least one self-aligned via to form a wiring via; and filling the wiring via and the at least one trench with conductive material.

Abstract: Embodiments disclosed herein provide compositions for conjugates, including fusion proteins, and methods of using them to treat a variety of conditions. In some embodiments, the conjugates and/or fusion proteins incorporate a 60-amino acid human homeodomain (e.g., peptides derived from human HOX genes), to translocate functional and regulatory peptides and proteins or other biologically active molecules such as nucleic acids, which are not naturally associated with the human homeodomain, across cell and nuclear membranes to intended sites of action without provoking an unwanted immune response that may reduce exposure to the conjugate and/or result in a clinical adverse event. In further embodiments, disclosed conjugates and fusion proteins can pass through the blood-brain barrier to allow entry into the CNS.

Abstract: Chamferless via structures and methods of manufacture are provided. The method includes: forming at least one non-self-aligned via within at least dielectric material; plugging the at least one non-self-aligned via with material; forming a protective sacrificial mask over the material which plugs the at least one non-self-aligned via, after a recessing process; forming at least one trench within the dielectric material, with the protective sacrificial mask protecting the material during the trench formation; removing the protective sacrificial mask and the material within the at least one non-self-aligned via to form a wiring via; and filling the wiring via and the at least one trench with conductive material.

Abstract: Techniques are disclosed relating to caches that support transient storage fields for cache entries. In some embodiments, cache circuitry includes a set of multiple cache entries that each include a tag field and a data field. In some embodiments, transient storage circuitry includes a transient storage field for each of the multiple cache entries. In some embodiments, cache control circuitry stores received first data in the data field of a cache entry and stores received transient data in a corresponding transient storage field. In response to an eviction determination for the cache entry, however, the cache control circuitry may write the first data but not the transient data to a backing memory for the cache circuitry. In various embodiments, disclosed techniques may allow caching additional data that is transient without increasing bandwidth to the backing memory.

Abstract: Printed transactional documents are enclosed in a document size-inclusive envelope that gives the appearance of being a traditional windowed envelope in which the send address shows through from the address vehicle page inside, but actually has the address printed on an adhered patch that shows through the window, keeping the data inside more protected and allowing production processes to be more efficient, and the patch or envelope has a serialized identifier that ensures the address printed on the patch and seen in the window corresponds with the document on the inside.

Abstract: Chamferless via structures and methods of manufacture are provided. The method includes: forming at least one non-self-aligned via within at least dielectric material; plugging the at least one non-self-aligned via with material; forming a protective sacrificial mask over the material which plugs the at least one non-self-aligned via, after a recessing process; forming at least one trench within the dielectric material, with the protective sacrificial mask protecting the material during the trench formation; removing the protective sacrificial mask and the material within the at least one non-self-aligned via to form a wiring via; and filling the wiring via and the at least one trench with conductive material.

Abstract: Films with optical transmittance of >80% between 400 and 750 nm and with coefficient of thermal expansion less than 20 ppm/° C. are prepared from aromatic polyamides that are soluble in polar organic solvents yet have glass transition temperatures>300° C. The films are cross-linked in the solid state by heating at elevated temperatures for short periods of time in the presence of multifunctional epoxides. Surprisingly, the optical and thermal properties of the films do not change significantly during the curing process. The temperature required for the crosslinking process to take place can be reduced by the presence of a few free, pendant carboxyl groups along the polyamide backbones. The films are useful as flexible substrates for electronic displays and photovoltaic devices.