Patents by Inventor Frank W. Was

Frank W. Was has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MAIL ROUTING SYSTEM UTILIZING PRINTED INDICIA-CONTAINING MAILING ADDRESSES
    Publication number: 20200171549
    Abstract: In some embodiments, the present invention provides an exemplary system that includes a mechanism configured to create by a digital mailing services provider, DMSP, a recipient-specific handling information indicia and provide said recipient-specific handling information indicia to a recipient; a mechanism configured to allow the recipient to provide said handling information indicia in delivery address C/O line, on a mail item, thereby indicating to said service provider their desired handling route for the mail item so that a paper mail recipient to receive improved transmission of correspondence from said service provider via both paper and electronic channels solely via including said handling information indicia contained in the delivery address C/O line of the recipient's delivery address on the mail item.
    Type: Application
    Filed: February 10, 2020
    Publication date: June 4, 2020
    Inventors: Frank W. Delfer, Navdeep S. Dhillon
  • Variants and compositions comprising variants with high stability in presence of a chelating agent
    Patent number: 10655116
    Abstract: The present invention relates to variants of an alpha-amylase having improved stability to chelating agents relative to its parent enzyme, compositions comprising the variants, nucleic acids encoding the variants, methods of producing the variants, and methods for using the variants.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: May 19, 2020
    Assignee: NOVOZYMES A/S
    Inventors: Allan Svendsen, Annette Helle Johansen, Mads Bjoernvad, Frank W. Rasmussen, Michael Skjoet, Signe Eskildsen Larsen, Jens Oebro, Svend Kaasgaard, Lars Beier
  • Methods of mitigating cobalt diffusion in contact structures and the resulting devices
    Patent number: 10658176
    Abstract: One illustrative method disclosed includes, among other things, forming a first dielectric layer and forming first and second conductive structures comprising cobalt embedded in the first dielectric layer. A second dielectric layer is formed above and contacting the first dielectric layer. The first and second dielectric layers comprise different materials, and a portion of the second dielectric layer comprises carbon or nitrogen. A first cap layer is formed above the first and second conductive structures and the second dielectric layer.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: May 19, 2020
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Frank W. Mont, Han You, Shariq Siddiqui, Brown C. Peethala
  • Skip via structures
    Patent number: 10636698
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to skip via structures and methods of manufacture. The structure includes: a first wiring layer with one or more wiring structures; a second wiring layer with one or more wiring structures, located above the first wiring layer; a skip via with metallization, which passes through upper wiring levels including the second wiring layer and which makes contact with the one or more wiring structures of the first wiring layer; and a via structure which comprises a protective material and contacts at least one of the one or more wiring structures at the upper wiring level.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: April 28, 2020
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Xunyuan Zhang, Frank W. Mont, Errol Todd Ryan
  • Methods of protecting structure of integrated circuit from rework
    Patent number: 10636656
    Abstract: The present disclosure relates to methods of protecting a structure of an integrated circuit (IC) from rework, and more particularly, to methods of protecting a structure of an IC without impacting the critical dimension or the profile of the structure. For example, a method of protecting a structure of an IC from rework may include forming a first layer on a second layer; forming one or more first openings in the first layer, the first openings exposing a top surface of the second layer; selectively growing a Group VIII metal within the one or more first openings, thereby forming one or more first plugs; forming one or more final openings in the first layer; and removing the one or more first plugs.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: April 28, 2020
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Lei Sun, Xunyuan Zhang, Frank W. Mont, Shao Beng Law
  • Passive nasal peep devices
    Patent number: 10610228
    Abstract: Described herein are passive nasal respiratory devices, in particular, passive nasal respiratory devices configured to achieve positive end-expiratory pressure (PEEP) in a subject wearing the device. PEEP devices may have a threshold pressure for opening during expiration. These devices may include a flap valve that opens on inhalation nested with a spring valve that opens when exhalation pressure exceeds a predetermined threshold. The device may be configured to be comfortably worn by a sleeping subject.
    Type: Grant
    Filed: November 4, 2013
    Date of Patent: April 7, 2020
    Assignee: Theravent, Inc.
    Inventors: Benjamin K. Cline, Ronald G. French, Frank W. Wang, Rajiv Doshi, Ryan K. Pierce
  • METHODS OF MITIGATING COBALT DIFFUSION IN CONTACT STRUCTURES AND THE RESULTING DEVICES
    Publication number: 20200083040
    Abstract: One illustrative method disclosed includes, among other things, forming a first dielectric layer and forming first and second conductive structures comprising cobalt embedded in the first dielectric layer. A second dielectric layer is formed above and contacting the first dielectric layer. The first and second dielectric layers comprise different materials, and a portion of the second dielectric layer comprises carbon or nitrogen. A first cap layer is formed above the first and second conductive structures and the second dielectric layer.
    Type: Application
    Filed: September 6, 2018
    Publication date: March 12, 2020
    Inventors: Frank W. Mont, Han You, Shariq Siddiqui, Brown C. Peethala
  • HIGH-ENERGY FEMTOSECOND LIGHT PULSES BASED ON A GAIN-SWITCHED LASER DIODE
    Publication number: 20200052455
    Abstract: This disclosed subject matter allows short pulses with high peak powers to be obtained from seed pulses generated by a gain-switched diode. The gain-switched diode provides a highly stable source for optical systems such as nonlinear microscopy. The disclosed system preserves the ability to generate pulses at arbitrary repetition rates, or even pulses on demand, which can help reduce sample damage in microscopy experiments or control deliberate damage in material processing.
    Type: Application
    Filed: March 11, 2019
    Publication date: February 13, 2020
    Inventors: Walter FU, Frank W. Wise, Logan Wright
  • Mail routing system utilizing printed indicia-containing mailing addresses
    Patent number: 10556254
    Abstract: In some embodiments, the present invention provides an exemplary system that includes a mechanism configured to create by a digital mailing services provider, DMSP, a recipient-specific handling information indicia and provide said recipient-specific handling information indicia to a recipient; a mechanism configured to allow the recipient to provide said handling information indicia in delivery address C/O line, on a mail item, thereby indicating to said service provider their desired handling route for the mail item so that a paper mail recipient to receive improved transmission of correspondence from said service provider via both paper and electronic channels solely via including said handling information indicia contained in the delivery address C/O line of the recipient's delivery address on the mail item.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: February 11, 2020
    Assignee: Broadridge Output Solutions, Inc.
    Inventors: Frank W. Delfer, Navdeep S. Dhillon
  • Magnesium bath salt
    Patent number: 10549130
    Abstract: A bath salt contains granular magnesium chloride material that is uniformly coated with a fragrance enhancing material and/or a colorant. The bath salt can include magnesium sulfate material and mineral salt material. The bath salt can be made by mixing the magnesium chloride material and starch material to form an intermediate mixture. The colorant and the intermediate mixture are mixed together to form a uniformly colored bath salt.
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: February 4, 2020
    Assignee: Nutraceutical Corporation
    Inventors: David E. Bunch, Frank W. Gay, II, Autumn Blum, Antoine Nkameni
  • INFORMATION-PROTECTED WINDOW SEND ENVELOPE WITH ADHERED INSIDE ADDRESS PATCH
    Publication number: 20200009617
    Abstract: Printed transactional documents are enclosed in a document size-inclusive envelope that gives the appearance of being a traditional windowed envelope in which the send address shows through from the address vehicle page inside, but actually has the address printed on an adhered patch that shows through the window, keeping the data inside more protected and allowing production processes to be more efficient, and the patch or envelope has a serialized identifier that ensures the address printed on the patch and seen in the window corresponds with the document on the inside.
    Type: Application
    Filed: September 16, 2019
    Publication date: January 9, 2020
    Inventor: Frank W. Delfer
  • Magnetic drum inlet slide and scraper blade
    Patent number: 10525482
    Abstract: A magnetic separator is provided with one or more components that may enhance separation of magnetic and nonmagnetic materials. The one or more components may comprise at least one of a slide and a scraper blade.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: January 7, 2020
    Assignee: Evoqua Water Technologies LLC
    Inventors: Matthew J. Vareika, Joseph P. Gwarjanski, Frank W. Federico, Simone Klyamkin
  • Prosthetic Intervertebral Discs
    Publication number: 20190388234
    Abstract: A prosthetic intervertebral disc and methods for using the same are provided. The subject prosthetic discs are characterized by including top and bottom endplates separated by a fibrous compressible element that includes an annular region and a nuclear region. The two plates are held together at least one fiber wound around at least one region of the top endplate and at least one region of the bottom endplate. The subject discs may be employed with separate vertebral body fixation elements, or they may include integrated vertebral body fixation elements. Also provided are kits and systems that include the subject prosthetic discs.
    Type: Application
    Filed: September 3, 2019
    Publication date: December 26, 2019
    Applicant: SPINAL KINETICS, INC.
    Inventors: Daniel H. Kim, Sung Kyu Ha, Kungwoo Lee, Frank W. Frank
  • LARGE SCALE PRODUCTION PROCESS FOR CAPPED AND UN-CAPPED ANTIBODY CYSTEINES AND THEIR USE IN THERAPEUTIC PROTEIN CONJUGATION
    Publication number: 20190381182
    Abstract: Optimizing production of selectively capped, and uncapped, cysteines on antibodies by manipulation of cell growth conditions including the deliberate depletion of cysteine and/or cystine in the cell culture process by way of media components, batch duration, or cell density to achieve efficient production of proteins including antibody-drug-conjugates (ADCs); conjugating a TNB-capped cysteine-containing protein by reacting it with a reducing agent capable of detaching the TNB-capping moieties from the protein without significantly reducing antibody inter-chain sulfur bonds, and conjugating reduced sulfur bonds on the protein to a payload through a reactive linking moiety.
    Type: Application
    Filed: February 1, 2018
    Publication date: December 19, 2019
    Applicant: PFIZER INC.
    Inventors: Kaushik DUTTA, Jose Manuel GOMES, Frank W. KOTCH, Vimalkumar B. PATEL, Amarnauth Shastrie PRASHAD, Renee L. PROCOPIO-MELINO, Xiaotian ZHONG
  • VARIANTS AND COMPOSITIONS COMPRISING VARIANTS WITH HIGH STABILITY IN PRESENCE OF A CHELATING AGENT
    Publication number: 20190359961
    Abstract: The present invention relates to variants of an alpha-amylase having improved stability to chelating agents relative to its parent enzyme, compositions comprising the variants, nucleic acids encoding the variants, methods of producing the variants, and methods for using the variants.
    Type: Application
    Filed: March 25, 2019
    Publication date: November 28, 2019
    Applicant: NOVOZYMES A/S
    Inventors: Allan Svendsen, Annette Helle Johansen, Mads Bjoernvad, Frank W. Rasmussen, Michael Skjoet, Signe Eskildsen Larsen, Jens Oebro, Svend Kaasgaard, Lars Beier
  • METHOD FOR DELETING DATA FILES IN AN ELECTRONIC DEVICE
    Publication number: 20190364240
    Abstract: An electronic device, such as a digital camera, includes a deletion mode whereby a camera/electronic device user can delete captured images or data files that have already been transferred in order to make room in the electronic device or digital camera memory for capturing further images. In one embodiment, a digital camera keeps track of which images have already been transferred to an external storage device and presents those to the user as potential images to be deleted. In another embodiment, the user is presented with a “delete all transferred images” which when selected deletes all the captured images that have already been transferred. In still another embodiment, deletion criteria are used to prioritize which images are deleted first.
    Type: Application
    Filed: August 6, 2019
    Publication date: November 28, 2019
    Inventors: Keith Stoll Karn, Thomas A. Napoli, Frank W. Armstrong
  • CHAMFERLESS VIA STRUCTURES
    Publication number: 20190333814
    Abstract: Chamferless via structures and methods of manufacture are provided. The method includes: forming at least one non-self-aligned via within at least dielectric material; plugging the at least one non-self-aligned via with material; forming a protective sacrificial mask over the material which plugs the at least one non-self-aligned via, after a recessing process; forming at least one trench within the dielectric material, with the protective sacrificial mask protecting the material during the trench formation; removing the protective sacrificial mask and the material within the at least one non-self-aligned via to form a wiring via; and filling the wiring via and the at least one trench with conductive material.
    Type: Application
    Filed: July 5, 2019
    Publication date: October 31, 2019
    Applicant: GLOBALFOUNDRIES INC.
    Inventors: Mark L. LENHARDT, Frank W. MONT, Brown C. PEETHALA, Shariq SIDDIQUI, Jessica P. STRISS, Douglas M. TRICKETT
  • CHAMFERLESS VIA STRUCTURES
    Publication number: 20190333813
    Abstract: Chamferless via structures and methods of manufacture are provided. The method includes: forming at least one non-self-aligned via within at least dielectric material; plugging the at least one non-self-aligned via with material; forming a protective sacrificial mask over the material which plugs the at least one non-self-aligned via, after a recessing process; forming at least one trench within the dielectric material, with the protective sacrificial mask protecting the material during the trench formation; removing the protective sacrificial mask and the material within the at least one non-self-aligned via to form a wiring via; and filling the wiring via and the at least one trench with conductive material.
    Type: Application
    Filed: July 5, 2019
    Publication date: October 31, 2019
    Applicant: GLOBALFOUNDRIES INC.
    Inventors: Mark L. LENHARDT, Frank W. MONT, Brown C. PEETHALA, Shariq SIDDIQUI, Jessica P. STRISS, Douglas M. TRICKETT
  • METHODS OF PROTECTING STRUCTURE OF INTEGRATED CIRCUIT FROM REWORK
    Publication number: 20190318927
    Abstract: The present disclosure relates to methods of protecting a structure of an integrated circuit (IC) from rework, and more particularly, to methods of protecting a structure of an IC without impacting the critical dimension or the profile of the structure. For example, a method of protecting a structure of an IC from rework may include forming a first layer on a second layer; forming one or more first openings in the first layer, the first openings exposing a top surface of the second layer; selectively growing a Group VIII metal within the one or more first openings, thereby forming one or more first plugs; forming one or more final openings in the first layer; and removing the one or more first plugs.
    Type: Application
    Filed: April 16, 2018
    Publication date: October 17, 2019
    Inventors: Lei Sun, Xunyuan Zhang, Frank W. Mont, Shao Beng Law
  • Method for deleting data files in an electronic device
    Patent number: 10419714
    Abstract: An electronic device, such as a digital camera, includes a deletion mode whereby a camera/electronic device user can delete captured images or data files that have already been transferred in order to make room in the electronic device or digital camera memory for capturing further images. In one embodiment, a digital camera keeps track of which images have already been transferred to an external storage device and presents those to the user as potential images to be deleted. In another embodiment, the user is presented with a “delete all transferred images” which when selected deletes all the captured images that have already been transferred. In still another embodiment, deletion criteria are used to prioritize which images are deleted first.
    Type: Grant
    Filed: March 21, 2018
    Date of Patent: September 17, 2019
    Assignee: Monument Peak Ventures, LLC
    Inventors: Keith Stoll Karn, Thomas A. Napoli, Frank W. Armstrong