Abstract: An optical assembly includes: an optical element, which is transmissive or reflective to radiation at a used wavelength and has an optically used region; and a thermally conductive component, which is arranged outside the optically used region of the optical element. The thermally conductive component can include a material having a thermal conductivity of more than 500 W m?1 K?1. Additionally or alternatively, the product of the thickness of the thermally conductive component in millimeters and the thermal conductivity of the material of the thermally conductive component is at least 1 W mm m?1 K?1.

Abstract: The disclosure relates to a microlithography projection exposure system having optical corrective elements configured to modify the imaging characteristics, as well as related systems and component.

Abstract: The disclosure relates to a microlithography projection exposure system having optical corrective elements configured to modify the imaging characteristics, as well as related systems and component.

Abstract: The disclosure relates to a microlithography projection exposure system having optical corrective elements configured to modify the imaging characteristics, as well as related systems and component.

Abstract: An optical assembly includes: an optical element, which is transmissive or reflective to radiation at a used wavelength and has an optically used region; and a thermally conductive component, which is arranged outside the optically used region of the optical element. The thermally conductive component can include a material having a thermal conductivity of more than 500 W m?1 K?1. Additionally or alternatively, the product of the thickness of the thermally conductive component in millimeters and the thermal conductivity of the material of the thermally conductive component is at least 1 W mm m?1 K?1.

Abstract: An optical assembly includes: an optical element, which is transmissive or reflective to radiation at a used wavelength and has an optically used region; and a thermally conductive component, which is arranged outside the optically used region of the optical element. The thermally conductive component can include a material having a thermal conductivity of more than 500 W m?1 K?1. Additionally or alternatively, the product of the thickness of the thermally conductive component in millimeters and the thermal conductivity of the material of the thermally conductive component is at least 1 W mm m?1 K?1.

Abstract: The disclosure relates to a microlithography projection exposure system having optical corrective elements configured to modify the imaging characteristics, as well as related systems and component.

Abstract: A microlithographic projection exposure apparatus includes a projection lens that is configured for immersion operation. For this purpose an immersion liquid is introduced into an immersion space that is located between a last lens of the projection lens on the image side and a photosensitive layer to be exposed. To reduce fluctuations of refractive index resulting from temperature gradients occurring within the immersion liquid, the projection exposure apparatus includes heat transfer elements that heat or cool partial volumes of the immersion liquid so as to achieve an at least substantially homogenous or at least substantially rotationally symmetric temperature distribution within the immersion liquid.

Abstract: An optical module includes: a first holding device with a circumference extending in a first circumferential direction; and a plurality of first supporting devices configured to support a first optical element, the first supporting devices being fixed at the circumference of the first holding device. Along the first circumferential direction, at least one of the first supporting devices is located in a non-equidistant manner between two neighboring first supporting devices. The optical module is configured to be used in a microlithography objective.

Abstract: Disclosed is an optical module for a lens, especially a microlithographic apparatus, comprising a first holding device (2) with an inner circumference (2.1) that extends in a first circumferential direction (2.2), and at least one first supporting device (3.1) which is fastened to the inner circumference (2.1) of said first holding device (2) and is used for supporting a first optical element (5.1), an annular circumferential first assembly space (3.18) being defined by displacing the first supporting device (3.1) once in a revolving manner along the first circumferential direction (2.2). At least one second supporting device (3.2) which is fixed to the inner circumference (2.1) of the first holding device (2) is provided for supporting a second optical element (5.2), an annular circumferential second assembly space (3.28) being defined by displacing the second supporting device (3.2) once in a revolving manner along the first circumferential direction (2.2). The first assembly space (3.

Abstract: An optical module is configured to be used in a microlithography objective. The optical module includes a first holding device with a circumference extending in a first circumferential direction and a first supporting device configured to support a first optical element. The first supporting device is fixed at the circumference of the first holding device. The optical module also includes a plurality of second supporting devices configured to support a second optical element, the second supporting devices being fixed at the circumference of the first holding device. The first supporting device does not contact the second supporting devices. The first optical element is separate from the second optical element. Along the first circumferential direction, the first supporting device is located in a non-equidistant manner between two neighboring second supporting devices.

Abstract: An optical assembly includes: an optical element, which is transmissive or reflective to radiation at a used wavelength and has an optically used region; and a thermally conductive component, which is arranged outside the optically used region of the optical element. The thermally conductive component can include a material having a thermal conductivity of more than 500 W m?1 K?1. Additionally or alternatively, the product of the thickness of the thermally conductive component in millimeters and the thermal conductivity of the material of the thermally conductive component is at least 1 W mm m?1 K?1.

Abstract: A microlithographic projection exposure apparatus includes a projection lens that is configured for immersion operation. For this purpose an immersion liquid is introduced into an immersion space that is located between a last lens of the projection lens on the image side and a photosensitive layer to be exposed. To reduce fluctuations of refractive index resulting from temperature gradients occurring within the immersion liquid, the projection exposure apparatus includes heat transfer elements that heat or cool partial volumes of the immersion liquid so as to achieve an at least substantially homogenous or at least substantially rotationally symmetric temperature distribution within the immersion liquid.

Abstract: A microlithographic projection exposure apparatus includes a projection lens that is configured for immersion operation. For this purpose an immersion liquid is introduced into an immersion space that is located between a last lens of the projection lens on the image side and a photosensitive layer to be exposed. To reduce fluctuations of refractive index resulting from temperature gradients occurring within the immersion liquid, the projection exposure apparatus includes heat transfer elements that heat or cool partial volumes of the immersion liquid so as to achieve an at least substantially homogenous or at least substantially rotationally symmetric temperature distribution within the immersion liquid.

Abstract: A replacement apparatus for an optical element mounted between two adjacent optical elements in a lithography objective has a holder for the optical element to be replaced, which holder can be moved into the lithography objective through a lateral opening in a housing of the same.

Abstract: The disclosure relates to a microlithography projection exposure system having optical corrective elements configured to modify the imaging characteristics, as well as related systems and component.

Abstract: A replacement apparatus for an optical element mounted between two adjacent optical elements in a lithography objective has a holder for the optical element to be replaced, which holder can be moved into the lithography objective through a lateral opening in a housing of the same.

Abstract: A replacement apparatus for an optical element mounted between two adjacent optical elements in a lithography objective has a holder for the optical element to be replaced, which holder can be moved into the lithography objective through a lateral opening in a housing of the same.

Abstract: A replacement apparatus for an optical element mounted between two adjacent optical elements in a lithography objective has a holder for the optical element to be replaced, which holder can be moved into the lithography objective through a lateral opening in a housing of the same.

Abstract: Disclosed is an optical module for a lens, especially a microlithographic apparatus, comprising a first holding device with an inner circumference that extends in a first circumferential direction, and at least one first supporting device which is fastened to the inner circumference of said first holding device and is used for supporting a first optical element, an annular circumferential first assembly space being defined by displacing the first supporting device once in a revolving manner along the first circumferential direction. At least one second supporting device which is fixed to the inner circumference of the first holding device is provided for supporting a second optical element, an annular circumferential second assembly space being defined by displacing the second supporting device once in a revolving manner along the first circumferential direction. The first assembly space intersects the second assembly space.