Patents by Inventor Friedrich Paul Lindner
Friedrich Paul Lindner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230294390Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: ApplicationFiled: May 24, 2023Publication date: September 21, 2023Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Patent number: 11697281Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: GrantFiled: June 8, 2021Date of Patent: July 11, 2023Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Publication number: 20230207513Abstract: The invention relates to a device and a method for the alignment of substrates.Type: ApplicationFiled: June 30, 2020Publication date: June 29, 2023Applicant: EV Group E. Thallner GmbHInventors: Dominik Zinner, Friedrich Paul Lindner, Thomas Plach, Peter Starzengruber
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Publication number: 20230150180Abstract: A method and device for injection moulding, in particular for micro-injection moulding, at least comprising a mould with a first mould half and a second mould half, wherein the first mould half and the second mould half define an injection moulding space in the closed state of the mould, and an insert arranged in the injection moulding space.Type: ApplicationFiled: April 1, 2020Publication date: May 18, 2023Applicant: EV Group E. Thallner GmbHInventors: Gerald MITTENDORFER, Markus WIMPLINGER, Friedrich Paul LINDNER
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Publication number: 20230015545Abstract: A method for producing singulated encapsulated components. The method includes the steps of application of a frame structure on a substrate surface of a substrate, wherein the frame structure surrounds components arranged on the substrate surface; bonding of a cover substrate on the frame structure; hardening of the frame structure; and singulation of the encapsulated components, wherein the frame structure is formed from an adhesive.Type: ApplicationFiled: December 19, 2019Publication date: January 19, 2023Applicant: EV Group E. Thallner GmbHInventors: Gerald MITTENDORFER, Friedrich Paul LINDNER
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Publication number: 20230001723Abstract: An apparatus and a method for embossing micro- and/or nanostructures include the embossing of the micro- and/or nanostructures in an embossing material.Type: ApplicationFiled: September 12, 2022Publication date: January 5, 2023Applicant: EV Group E. Thallner GmbHInventors: Friedrich Paul Lindner, Harald Zaglmayr, Christian Schon, Thomas Glinsner, Evelyn Reisinger, Peter Fischer, Othmar Luksch
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Patent number: 11472212Abstract: An apparatus and a method for embossing micro- and/or nanostructures in an embossing material.Type: GrantFiled: September 5, 2016Date of Patent: October 18, 2022Assignee: EV Group E. Thallner GmbHInventors: Friedrich Paul Lindner, Harald Zaglmayr, Christian Schon, Thomas Glinsner, Evelyn Reisinger, Peter Fischer, Othmar Luksch
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Publication number: 20220230849Abstract: A method and a device for prefixing substrates, whereby at least one substrate surface of the substrates is amorphized in at least one surface area, characterized in that the substrates are aligned and then make contact and are prefixed on the amorphized surface areas.Type: ApplicationFiled: April 6, 2022Publication date: July 21, 2022Applicant: EV GROUP E. THALLNER GMBHInventor: Friedrich Paul Lindner
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Patent number: 11328939Abstract: A method and a device for prefixing substrates, whereby at least one substrate surface of the substrates is amorphized in at least one surface area, characterized in that the substrates are aligned and then make contact and are prefixed on the amorphized surface areas.Type: GrantFiled: August 30, 2019Date of Patent: May 10, 2022Assignee: EV GROUP E. THALLNER GMBHInventor: Friedrich Paul Lindner
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Publication number: 20210291504Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: ApplicationFiled: June 8, 2021Publication date: September 23, 2021Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Patent number: 11059280Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: GrantFiled: March 18, 2019Date of Patent: July 13, 2021Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Publication number: 20210183666Abstract: A method and corresponding device for bonding a first contact surface of a first substrate to a second contact surface of a second substrate. The method includes the steps of arranging a substrate stack, formed from the first substrate and the second substrate and aligned on the contact surfaces, between a first heating surface of a first heating system and a second heating surface of a second heating system.Type: ApplicationFiled: March 1, 2021Publication date: June 17, 2021Applicant: EV Group E. Thallner GmbHInventor: Friedrich Paul Lindner
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Patent number: 11020951Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: GrantFiled: March 19, 2019Date of Patent: June 1, 2021Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Patent number: 11020950Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: GrantFiled: March 19, 2019Date of Patent: June 1, 2021Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Patent number: 11020952Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: GrantFiled: March 20, 2019Date of Patent: June 1, 2021Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Patent number: 11020953Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: GrantFiled: March 20, 2019Date of Patent: June 1, 2021Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Patent number: 10971378Abstract: A method and corresponding device for bonding a first contact surface of a first substrate to a second contact surface of a second substrate. The method includes the steps of arranging a substrate stack, formed from the first substrate and the second substrate and aligned on the contact surfaces, between a first heating surface of a first heating system and a second heating surface of a second heating system.Type: GrantFiled: May 30, 2018Date of Patent: April 6, 2021Assignee: EV Group E. Thallner GmbHInventor: Friedrich Paul Lindner
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Publication number: 20190385870Abstract: A method and a device for prefixing substrates, whereby at least one substrate surface of the substrates is amorphized in at least one surface area, characterized in that the substrates are aligned and then make contact and are prefixed on the amorphized surface areas.Type: ApplicationFiled: August 30, 2019Publication date: December 19, 2019Applicant: EV GROUP E. THALLNER GMBHInventor: Friedrich Paul Lindner
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Patent number: 10438822Abstract: A method and a device for prefixing substrates, whereby at least one substrate surface of the substrates is amorphized in at least one surface area, characterized in that the substrates are aligned and then make contact and are prefixed on the amorphized surface areas.Type: GrantFiled: March 6, 2019Date of Patent: October 8, 2019Assignee: EV Group E. Thallner GmbHInventor: Friedrich Paul Lindner
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Publication number: 20190217595Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: ApplicationFiled: March 20, 2019Publication date: July 18, 2019Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz