Patents by Inventor Friedrich Paul Lindner
Friedrich Paul Lindner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190217594Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: ApplicationFiled: March 20, 2019Publication date: July 18, 2019Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Publication number: 20190210349Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: ApplicationFiled: March 19, 2019Publication date: July 11, 2019Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Publication number: 20190210348Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: ApplicationFiled: March 18, 2019Publication date: July 11, 2019Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Publication number: 20190210350Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: ApplicationFiled: March 19, 2019Publication date: July 11, 2019Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Patent number: 10347523Abstract: The invention relates to a retaining system for handling substrate stacks, including a retaining surface for retaining a first substrate, and one or more recesses provided relative to the retaining surface, for retaining first magnetic bodies for securing the first substrate relative to a second substrate that is aligned with the first substrate. Second magnetic bodies are applied on a holding side of the second substrate.Type: GrantFiled: February 28, 2018Date of Patent: July 9, 2019Assignee: EV GROUP E. THALLNER GMBHInventors: Erich Thallner, Friedrich Paul Lindner
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Patent number: 10340161Abstract: A method and a device for prefixing substrates, whereby at least one substrate surface of the substrates is amorphized in at least one surface area, characterized in that the substrates are aligned and then make contact and are prefixed on the amorphized surface areas.Type: GrantFiled: December 23, 2014Date of Patent: July 2, 2019Assignee: EV Group E. Thallner GmbHInventor: Friedrich Paul Lindner
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Publication number: 20190198362Abstract: A method and a device for prefixing substrates, whereby at least one substrate surface of the substrates is amorphized in at least one surface area, characterized in that the substrates are aligned and then make contact and are prefixed on the amorphized surface areas.Type: ApplicationFiled: March 6, 2019Publication date: June 27, 2019Applicant: EV Group E. Thallner GmbHInventor: Friedrich Paul Lindner
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Publication number: 20190176500Abstract: An apparatus and a method for embossing micro- and/or nanostructures in an embossing material.Type: ApplicationFiled: September 5, 2016Publication date: June 13, 2019Applicant: EV Group E. Thallner GmbHInventors: Friedrich Paul Lindner, Harald Zaglmayr, Christian Schon, Thomas Glinsner, Evelyn Reisinger, Peter Fischer, Othmar Luksch
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Patent number: 10279575Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: GrantFiled: May 29, 2013Date of Patent: May 7, 2019Assignee: EV GROUP E. THALLNER GMBHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Patent number: 10239253Abstract: A method for embossing a structure material on a substrate disposed within a device having side walls, a base plate and a cover that define a working space that is isolated from a surrounding environment. The method includes the steps of: a) moving the substrate using a first calibration means and aligning the substrate with an application means, b) applying the structure material to the substrate, c) moving the substrate using a second calibration means that is located at least partially in the working space wherein the substrate is disposed within the working space and is aligned with an embossing means that is located at least partially in the working space, and d) embossing the structure material on the substrate while the substrate is in the working space using the embossing means, wherein the working space has a defined atmosphere, before and during the step of embossing, without interruption.Type: GrantFiled: May 20, 2015Date of Patent: March 26, 2019Assignee: EV Group E. Thallner GmbHInventors: Friedrich Paul Lindner, Thomas Glinsner, Markus Wimplinger
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Publication number: 20180277403Abstract: A method and corresponding device for bonding a first contact surface of a first substrate to a second contact surface of a second substrate. The method includes the steps of arranging a substrate stack, formed from the first substrate and the second substrate and aligned on the contact surfaces, between a first heating surface of a first heating system and a second heating surface of a second heating system.Type: ApplicationFiled: May 30, 2018Publication date: September 27, 2018Applicant: EV Group E. Thallner GmbHInventor: Friedrich Paul Lindner
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Publication number: 20180190536Abstract: The invention relates to a retaining system for handling substrate stacks, including a retaining surface for retaining a first substrate, and one or more recesses provided relative to the retaining surface, for retaining first magnetic bodies for securing the first substrate relative to a second substrate that is aligned with the first substrate. Second magnetic bodies are applied on a holding side of the second substrate.Type: ApplicationFiled: February 28, 2018Publication date: July 5, 2018Applicant: EV GROUP E. THALLNER GMBHInventors: Erich THALLNER, Friedrich Paul LINDNER
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Patent number: 10014193Abstract: A method and corresponding device for bonding a first contact surface of a first substrate to a second contact surface of a second substrate. The method includes the steps of arranging a substrate stack, formed from the first substrate and the second substrate and aligned on the contact surfaces, between a first heating surface of a first heating system and a second heating surface of a second heating system.Type: GrantFiled: February 3, 2014Date of Patent: July 3, 2018Assignee: EV GROUP E. THALLNER GMBHInventor: Friedrich Paul Lindner
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Patent number: 9984942Abstract: A method for equalizing the thickness variation of a substrate stack which is comprised of a product substrate and a carrier substrate and which is connected in particular by means of an interconnect layer, by local application of local thickness peaks by means of an application apparatus which has at least one application unit. Furthermore this invention relates to a corresponding device.Type: GrantFiled: March 31, 2015Date of Patent: May 29, 2018Assignee: EV Group E. Thallner GmbHInventors: Jurgen Burggraf, Friedrich Paul Lindner
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Patent number: 9941149Abstract: The invention relates to a retaining system for handling substrate stacks, including a retaining surface for retaining a first substrate, and one or more recesses provided relative to the retaining surface, for retaining first magnetic bodies for securing the first substrate relative to a second substrate that is aligned with the first substrate. Second magnetic bodies are applied on a holding side of the second substrate.Type: GrantFiled: April 25, 2017Date of Patent: April 10, 2018Assignee: EV GROUP E. THALLNER GMBHInventors: Erich Thallner, Friedrich Paul Lindner
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Publication number: 20170345690Abstract: A method and a device for prefixing substrates, whereby at least one substrate surface of the substrates is amorphized in at least one surface area, characterized in that the substrates are aligned and then make contact and are prefixed on the amorphized surface areas.Type: ApplicationFiled: December 23, 2014Publication date: November 30, 2017Applicant: EV Group E. Thallner GmbHInventor: Friedrich Paul Lindner
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Patent number: 9771223Abstract: The invention relates to a device for processing of substrates, especially wafers, with at least one pretreatment module, at least one aftertreatment module and at least one primary treatment module, and the pretreatment module and the aftertreatment module can be switched as a lock for the primary treatment module, and a corresponding method for processing of substrates, especially wafers.Type: GrantFiled: July 23, 2013Date of Patent: September 26, 2017Assignee: EV Group GmbHInventors: Friedrich Paul Lindner, Peter Oliver Hangweier
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Patent number: 9751698Abstract: The invention relates to a device for processing of substrates, especially wafers, with at least one pretreatment module, at least one aftertreatment module and at least one primary treatment module, and the pretreatment module and the aftertreatment module can be switched as a lock for the primary treatment module, and a corresponding method for processing of substrates, especially wafers.Type: GrantFiled: October 5, 2011Date of Patent: September 5, 2017Assignee: EV GROUP GMBHInventors: Friedrich Paul Lindner, Peter-Oliver Hangweier
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Publication number: 20170229336Abstract: The invention relates to a retaining system for handling substrate stacks, including a retaining surface for retaining a first substrate, and one or more recesses provided relative to the retaining surface, for retaining first magnetic bodies for securing the first substrate relative to a second substrate that is aligned with the first substrate. Second magnetic bodies are applied on a holding side of the second substrate.Type: ApplicationFiled: April 25, 2017Publication date: August 10, 2017Applicant: EV GROUP E. THALLNER GMBHInventors: Erich THALLNER, Friedrich Paul LINDNER
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Patent number: 9666470Abstract: The invention relates to a retaining system for handling substrate stacks, including a retaining surface for retaining a first substrate, and one or more recesses provided relative to the retaining surface, for retaining first magnetic bodies for securing the first substrate relative to a second substrate that is aligned with the first substrate. Second magnetic bodies are applied on a holding side of the second substrate.Type: GrantFiled: March 27, 2013Date of Patent: May 30, 2017Assignee: EV GROUP E. THALLNER GMBHInventors: Erich Thallner, Friedrich Paul Lindner