Abstract: A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.

Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.

Abstract: The invention relates to a device for loosening a polymer layer from a surface of a substrate.

Abstract: A system for transferring a nanostructure from a die to a flat side of a large-area substrate. The system has a substrate holder that receives the substrate on a substrate receiving surface. A structural surface of the die is oriented parallel to and opposite the substrate receiving surface. An adjusting means receives the substrate holder and adjusts the position of the substrate relative to the die in an x-direction, y-direction and a rotational direction. An actuator device includes at least two separately controllable actuators that each independently imposes a force in a direction orthogonal to the substrate receiving surface. A force measuring cell is in each actuator for measuring the force applied on the die or substrate. The forces, in combination, produce a single, controllable resultant force at a predetermined location. The single, resultant force is orientated in a direction orthogonal to the substrate receiving surface of the substrate holder.

Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.

Abstract: The invention relates to a device for processing of substrates, especially wafers, with at least one pretreatment module, at least one aftertreatment module and at least one primary treatment module, and the pretreatment module and the aftertreatment module can be switched as a lock for the primary treatment module, and a corresponding method for processing of substrates, especially wafers.

Abstract: Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate.

Abstract: The invention relates to a device for processing of substrates, especially wafers, with at least one pretreatment module, at least one aftertreatment module and at least one primary treatment module, and the pretreatment module and the aftertreatment module can be switched as a lock for the primary treatment module, and a corresponding method for processing of substrates, especially wafers.

Abstract: Device for separating a substrate from a carrier substrate which is connected to the substrate by an interconnect layer. The device includes a carrier substrate holder with a holding surface for holding the carrier substrate, and a substrate holder which is located opposite the carrier substrate holder with a substrate holding surface which can be located parallel to the holding surface for accommodating the substrate. There are separating means for parallel displacement of the substrate relative to the carrier substrate in the interconnected state of the substrate and carrier substrate.

Abstract: Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate.

Abstract: Device for separating a substrate from a carrier substrate which is connected to the substrate by an interconnect layer. The device includes a carrier substrate holder with a holding surface for holding the carrier substrate, and a substrate holder which is located opposite the carrier substrate holder with a substrate holding surface which can be located parallel to the holding surface for accommodating the substrate. There are separating means for parallel displacement of the substrate relative to the carrier substrate in the interconnected state of the substrate and carrier substrate.

Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.

Abstract: A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate, the device having: aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by action on the substrate's outside contour, whereby the orientation along a substrate plane E that is formed with the carrier substrate is carried out by a contact surface of the substrate, and attaching means for at least partial prefixing of the oriented substrate on the carrier substrate.

Abstract: The invention relates to a device for embossing of substrates, especially semiconductor substrates or wafers, comprised of: at least one receiving means for holding the substrate in a working space, a calibration means located at least partially in the working space for calibration of the substrate, an embossing means which is located at least partially in the working space for embossing of the structure material onto the substrate in an embossing process, the working space being exposed to a defined atmosphere before and during the embossing process without interruption, and a method for embossing of substrates.

Abstract: The invention relates to a system for transferring a nanostructure from a die to a flat side of a large-area substrate with a substrate holder that receives the substrate on a substrate receiving surface, and an actuator device that can be oriented parallel to the substrate receiving surface and opposite to this movable structural surface of the die and that acts orthogonally to the substrate receiving surface. To be able to use reasonably priced dies and in this case to achieve the highest possible throughput, a good edge yield, and a homogeneous structure with the substrate as much as possible without scrapping, a system is proposed with which the resultant force that acts through the die on the substrate surface can be shifted along the die surface.