Abstract: A method of manufacturing a suspension structure including providing a substrate, forming a first photoresist pattern on the substrate, heating the first photoresist pattern to harden it as a sacrificial layer, forming a second photoresist pattern on the substrate and the sacrificial layer, the second photoresist pattern exposing a part of the substrate and the sacrificial layer, forming a structure layer on the substrate, the second photoresist pattern, and the sacrificial layer, performing a lift off process to remove the second photoresist pattern and the structure layer above the second photoresist pattern, and performing a dry etching process to remove the sacrificial layer in order to make the structure layer become the suspension structure.

Abstract: A micro sample heating apparatus has a substrate, a micro heating device disposed on a first surface of the substrate, a cavity having an inclined sidewall and corresponding to the micro heating device positioned in a second surface of the substrate, and an isolation structure positioned on the second surface of the substrate. The isolation structure has an opening corresponding to the cavity, and the cavity and the opening form a sample room.

Abstract: A method of manufacturing a suspension structure including providing a substrate, forming a hole and a sacrificial layer filling the hole on the substrate, forming a patterned photoresist layer on the substrate and the sacrificial layer, the patterned photoresist layer exposing a part of the substrate and the sacrificial layer, forming a structure layer on the substrate, the patterned photoresist layer, and the sacrificial layer, performing a lift off process to remove the patterned photoresist layer and the structure layer above the photoresist pattern, and performing a dry etch process to remove the sacrificial layer in order to make the structure layer and the hole become the suspension structure and the chamber.

Abstract: A method of forming a suspended structure is disclosed. Initially, a substrate is provided. A patterned first sacrificial layer and a patterned second sacrificial layer are formed on a front surface of the substrate. The second sacrificial layer has an opening exposing a part of the substrate and a part of the first sacrificial layer. A structural layer is formed covering the abovementioned sacrificial layers. Thereafter, a lift-off process is performed to remove the second sacrificial layer and define the pattern of the structural layer. A first etching process is performed on a back surface of the substrate utilizing the first sacrificial layer as an etching barrier and a through hole is formed under the first sacrificial layer. A second etching layer is performed to remove the first sacrificial layer and a suspended structure is thereby formed.

Abstract: A superalloy micro-heating apparatus includes a substrate, an isolation layer on a front surface of the substrate, a patterned heating resistor, and a contact electrode on the heating resistor. The material of the heating resistor includes superalloy material that has the advantages of corrosion-resistance, high-resistance, rapid-thermal increase, and high-temperature resistance. For these reasons, the superalloy micro-heating resistor has an improved reliability and yield.

Abstract: A micro sample heating apparatus has a substrate, a micro heating device disposed on a first surface of the substrate, a cavity having a vertical sidewall and corresponding to the micro heating device positioned in a second surface of the substrate, and an isolation structure positioned on the second surface of the substrate. The isolation structure has an opening corresponding to the cavity, and the cavity and the opening form a sample room.

Abstract: A method of manufacturing a suspension structure including providing a substrate, forming a first photoresist pattern on the substrate, heating the first photoresist pattern to harden it as a sacrificial layer, forming a second photoresist pattern on the substrate and the sacrificial layer, the second photoresist pattern exposing a part of the substrate and the sacrificial layer, forming a structure layer on the substrate, the second photoresist pattern, and the sacrificial layer, performing a lift off process to remove the second photoresist pattern and the structure layer above the second photoresist pattern, and performing a dry etching process to remove the sacrificial layer in order to make the structure layer become the suspension structure.

Abstract: A method of manufacturing a suspension structure including providing a substrate, forming a hole and a sacrificial layer filling the hole on the substrate, forming a patterned photoresist layer on the substrate and the sacrificial layer, the patterned photoresist layer exposing a part of the substrate and the sacrificial layer, forming a structure layer on the substrate, the patterned photoresist layer, and the sacrificial layer, performing a lift off process to remove the patterned photoresist layer and the structure layer above the photoresist pattern, and performing a dry etch process to remove the sacrificial layer in order to make the structure layer and the hole become the suspension structure and the chamber.

Abstract: A method of fabricating a suspended structure. First, a substrate including a photoresist layer hardened by heat is provided. Subsequently, the hardened photoresist layer is etched so as to turn the photoresist layer into a predetermined edge profile. Thereafter, a structure layer is formed on parts of the substrate and parts of the photoresist layer. Next, a dry etching process is performed so as to remove the photoresist layer, and to turn the structure layer into a suspended structure.

Abstract: An active array color filter structure and a fabricating method therefor are provided, wherein the difference between the surface properties of lipophilicity and lipophobicity is utilized. When inks are coated on the active array substrate, ink at the lipophobic areas on the active array substrate will be naturally repelled, so that the color filter pixels formed on the active array substrate naturally have contact vias, which facilitates the electrical coupling of pixel electrodes and switch elements. Since there is no aligning or laminating process required for the color filter substrate and the active array substrate during fabrication, no aligning errors will occur. Also, as the pixel electrode can extend to cover above the corresponding switch element, the aggravation of the switch element is reduced.

Abstract: A flash lamp annealing device comprises a heater plate, a loader, a lamp set and a control circuit. The heater plate heats a wafer to a predetermined temperature. The wafer is loaded on the loader disposed on the heater plate. The lamp set has one or a plurality of lamps to provide the wafer with a power. The control circuit is coupled to the lamp set to control the flash time of the lamp set.

Abstract: A micro sample heating apparatus has a substrate, a micro heating device disposed on a first surface of the substrate, a cavity having an inclined sidewall and corresponding to the micro heating device positioned in a second surface of the substrate, and an isolation structure positioned on the second surface of the substrate. The isolation structure has an opening corresponding to the cavity, and the cavity and the opening form a sample room.

Abstract: The present invention is directed to novel 7-oxa-estra-4,9-diene-3,17-dione derivatives, pharmaceutical compositions containing them and their use in the treatment of disorders and conditions modulated by at least one progesterone or glucocorticoid receptor.

Abstract: An apparatus for metal plating on a substrate with through-holes includes a chamber that the substrate is disposed inside the chamber to be divided into two sections. A pressure generator and a pressure controller are connected to this and correspond to two sides of the substrate respectively. The pressure generator is used for pumping a electrolyte flowed parallel to the surface of the substrate into the chamber. The pressure controller is used for channeling the electrolyte off the chamber and controlling the pressure differences between the two sides of the substrate. So that the electrolyte flowed parallel to the surface of the substrate is pumped by the pressure generator and it passes several through-holes to control the thickness of metal plating on the.substrate and inner walls of the through-holes.

Abstract: A rapid cooling system for a rapid thermal processing chamber is disclosed. In one embodiment, the rapid cooling system includes a rapid thermal processing chamber having a wafer support for supporting a wafer. A tank having a supply of cooling liquid is provided in fluid communication with the chamber. A pump is provided in fluid communication with the rapid thermal processing chamber and the tank for pumping the cooling liquid from the tank to the chamber and cooling the wafer during the cooling phase of rapid thermal processing.

Abstract: A method of fabricating a color organic electroluminescent display involves forming cathode electrodes on a substrate, and forming a first organic semiconductor layer having an electron-injection transporting property on the cathode electrodes. Solutions containing organic light-emitting material that can dissolve portions of the first organic semiconductor layer are patterned on the first organic semiconductor layer. Then, a solvent in the solutions is removed to form regions having second organic semiconductor layers and mixed organic semiconductor layers, wherein the second organic semiconductor layers are formed on the first organic semiconductor layer and are mostly composed of the organic light-emitting material, and the mixed organic semiconductor layers, composed of the organic light-emitting material and material constituting the first organic semiconductor layer, are embedded in the first organic semiconductor layer. Anode electrodes are formed over the first and second organic semiconductor layers.

Abstract: In prior arts, additional pulse-width modulators and more costs are needed for increasing the current output. The invention provides a synchronized parallel running power converter. The power converter includes multiple power converters controlled by single-phase or double-phase pulse-width modulators. Each power converter includes a first pulse input port, a second pulse input port and a current output port. Each first pulse input ports are coupled, and each second pulse input ports are coupled also, so that each power converter is controlled by the same pulse signal and provide a same output current to be added as several times of current output.

Abstract: In accordance with the present invention, compounds that inhibit Type III protein section have been identified, and methods for their use provided. In one aspect of the invention, compounds useful in the inhibition of Type III protein section and/or in the treatment and prevention of bacterial infections, particularly Gram-negative bacterial infections, are provided. In another aspect of the invention, methods are provided for the inhibition of Type III protein secretion and/or the treatment and prevention of bacterial infections, particularly Gram-negative bacterial infections using the compounds of the invention.

Abstract: A method and system for flexible, comprehensive, on-line, real-time dynamic lot dispatching in a semiconductor test foundry based on a two-phased, event-driven dispatching system structure. An adjustable priority formula and tuned algorithms integrated with PROMIS' constraint function give a nearly optimum dispatching list on any tester at any time with reduced mistake operations. Exception rules take care of special events to improve daily dispatching manual effort. This invention can automatically dispatch engineering lots according to engineering lots' capacity of Testing, solve conflict between wafer and package lots, efficiently reduce tester setup times, replace daily manual-dispatching sheet and keep a high CLIP rate while fully following MPS.

Abstract: A method for patching element defects by ink-jet printing includes steps of identifying all defects of the element by image analysis and obtaining an optimal ink-jet printing path of the ink-jet head. The ink-jet head repairs all defects of the element with the shortest distance along the optimal patching path. Moreover, the ink-jet head repairs all defects of the element in a stable manner so as to increase the yield rate.