Patents by Inventor Fu An Wu

Fu An Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240150709
    Abstract: Parasympathetic neurons (parasymN) are important for unconscious body responses, including rest-and-digest and calming the body. Disclosed herein is a chemically defined differentiation protocol that generates parasympathetic neurons from stem cells. The protocol yields high efficiency and purity cultures that are electrically active and respond to specific stimuli. Their molecular characteristics and maturation stage are described and evidence for their use as a model for studying parasymN function and dysfunction. Cell populations and compositions formed from the resulting cells, as well as methods of their use for disease treatment, drug screening, and modeling of human disorders affecting parasymN are also provided.
    Type: Application
    Filed: November 6, 2023
    Publication date: May 9, 2024
    Inventors: Nadja Zeltner, Hsueh Fu Wu
  • Patent number: 11978740
    Abstract: A layer stack including a first bonding dielectric material layer, a dielectric metal oxide layer, and a second bonding dielectric material layer is formed over a top surface of a substrate including a substrate semiconductor layer. A conductive material layer is formed by depositing a conductive material over the second bonding dielectric material layer. The substrate semiconductor layer is thinned by removing portions of the substrate semiconductor layer that are distal from the layer stack, whereby a remaining portion of the substrate semiconductor layer includes a top semiconductor layer. A semiconductor device may be formed on the top semiconductor layer.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: May 7, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Harry-Hak-Lay Chuang, Kuo-Ching Huang, Wei-Cheng Wu, Hsin Fu Lin, Henry Wang, Chien Hung Liu, Tsung-Hao Yeh, Hsien Jung Chen
  • Patent number: 11977756
    Abstract: A computer device, a setting method for a memory module, and a mainboard are provided. The computer device includes a memory module, a processor, and the mainboard. A basic input output system (BIOS) of the mainboard stores a custom extreme memory profile (XMP). When the processor executes the BIOS, so that the computer device displays a user interface (UI), the BIOS displays multiple default XMPs stored in the memory module and the custom XMP through the UI. The BIOS stores one of the default XMPs and the custom XMP to the memory module according to a selecting result of the one of the default XMPs and the custom XMP displayed on the UI.
    Type: Grant
    Filed: March 16, 2022
    Date of Patent: May 7, 2024
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Chia-Chih Chien, Sheng-Liang Kao, Chen-Shun Chen, Chieh-Fu Chung, Hua-Yi Wu
  • Patent number: 11980076
    Abstract: A tiled display device includes two panels and two cover layers respectively disposed on the two panels. The two cover layers include a contact region. A top portion and a bottom portion of the contact region have a height H. One of the two cover layers has a thickness Tn. One of the two panels has a distance Xn between an upper surface of the one of the two panels and the bottom portion of the contact region. The one of the two panels is corresponding to the one of the two cover layers. The height H, the thickness Tn and the distance Xn satisfy the equation: 0<H/(Xn+Tn)<0.8.
    Type: Grant
    Filed: December 24, 2020
    Date of Patent: May 7, 2024
    Assignee: InnoLux Corporation
    Inventors: Ping-Hsun Tsai, Shih-Fu Liao, I-An Yao, Yu-Chun Hsu, Yung-Hsun Wu, Sheng-Nan Fan
  • Patent number: 11971482
    Abstract: A system for providing six-dimensional position data of an object in a three-dimensional (3D) space, the system including a light source configured to emit a light beam in an x-direction, a mirror including a mirror plane disposed in an x-y plane and a beam splitter configured for reflecting the light beam from the light source onto the mirror before being directed to the object, the light beam reflected by the object onto the beam splitter before being directed through a lens to an image plane to form an image.
    Type: Grant
    Filed: August 18, 2023
    Date of Patent: April 30, 2024
    Assignee: MLOptic Corp.
    Inventors: Sophia Shiaoyi Wu, Gary Fu, Sean Huentelman, Wei Zhou
  • Patent number: 11967563
    Abstract: A Fan-Out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yan-Fu Lin, Chen-Hua Yu, Meng-Tsan Lee, Wei-Cheng Wu, Hsien-Wei Chen
  • Patent number: 11956563
    Abstract: A method for identifying video signal source is provided. The method includes the following steps. A first identification code is assigned to a first transmitter device by a receiver control unit of a receiver device. A first video data is transmitted by the first transmitter device. The first video data and a first identification image corresponding to the first identification code are combined as a first combined video data by the receiver control unit. The first combined video data is outputted to a display device by the receiver control unit.
    Type: Grant
    Filed: January 7, 2021
    Date of Patent: April 9, 2024
    Assignee: BenQ Corporation
    Inventors: Chia-Nan Shih, Chen-Chi Wu, Lin-Yuan You, Chin-Fu Chiang, Ron-Kun Tseng, Chuang-Wei Wu
  • Publication number: 20240113173
    Abstract: In one example aspect, the present disclosure is directed to a device. The device includes an active region on a semiconductor substrate. The active region extends along a first direction. The device also includes a gate structure on the active region. The gate structure extends along a second direction that is perpendicular to the first direction. Moreover, the gate structure engages with a channel on the active region. The device further includes a source/drain feature on the active region and connected to the channel. A projection of the source/drain feature onto the semiconductor substrate resembles a hexagon.
    Type: Application
    Filed: November 27, 2023
    Publication date: April 4, 2024
    Inventors: Wei Ju Lee, Chun-Fu Cheng, Chung-Wei Wu, Zhiqiang Wu
  • Patent number: 11942087
    Abstract: A device performs a method for using image data to aid voice recognition. The method includes the device capturing image data of a vicinity of the device and adjusting, based on the image data, a set of parameters for voice recognition performed by the device. The set of parameters for the device performing voice recognition include, but are not limited to: a trigger threshold of a trigger for voice recognition; a set of beamforming parameters; a database for voice recognition; and/or an algorithm for voice recognition. The algorithm may include using noise suppression or using acoustic beamforming.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: March 26, 2024
    Assignee: Google Technology Holdings LLC
    Inventors: Robert A. Zurek, Adrian M. Schuster, Fu-Lin Shau, Jincheng Wu
  • Publication number: 20240094104
    Abstract: An embodiment interfacial bonding test structure may include a first substrate having a first planar surface, a second substrate having a second planar surface that is parallel to the first planar surface, a first semiconductor die, and a second semiconductor die, each semiconductor die bonded between the first substrate and the second substrate thereby forming a sandwich structure. The first semiconductor die and the second semiconductor die may be bonded to the first surface with a first adhesive and may be bonded to the second surface with a second adhesive. The first semiconductor die and the second semiconductor die may be displaced from one another by a first separation along a direction parallel to the first planar surface and the second planar surface. The second substrate may include a notch having an area that overlaps with an area of the first separation in a plan view.
    Type: Application
    Filed: April 20, 2023
    Publication date: March 21, 2024
    Inventors: Yu-Sheng Lin, Jyun-Lin Wu, Yao-Chun Chuang, Chin-Fu Kao
  • Patent number: 11937388
    Abstract: Embodiments of the present application provide a screen body support device, including: a fixing bracket; a movable bracket being rotatably connected with the fixing bracket, in which the movable bracket and the fixing bracket are provided in a non-display area of a flexible display screen; and a driving component being fixedly connected with the movable bracket, in which the driving component is configured to drive the movable bracket to swing in two opposite directions with respect to the fixing bracket, so that the flexible display screen is bent in two opposite directions respectively.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: March 19, 2024
    Assignee: Yungu (Gu'an) Technology Co., Ltd.wq
    Inventors: Hongqi Hou, Fu Liao, Yuhua Wu, Liwei Ding, Zhaoji Zhu, Liuyang Wang
  • Patent number: 11935728
    Abstract: In order to reduce the occurrence of current alarms in a semiconductor etching or deposition process, a controller determines an offset in relative positions of a cover ring and a shield over a wafer within a vacuum chamber. The controller provides a position alarm and/or adjusts the position of the cover ring or shield when the offset is greater than a predetermined value or outside a range of acceptable values.
    Type: Grant
    Filed: January 5, 2021
    Date of Patent: March 19, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tsung-Cheng Wu, Sheng-Ying Wu, Ming-Hsien Lin, Chun Fu Chen
  • Publication number: 20240089000
    Abstract: An optical fiber network device includes a fiber and a photonic integrated circuit. Fiber receives a first optical signal and transmits a second optical signal. A first wavelength of first optical signal is different from a second wavelength of second optical signal. Photonic integrated circuit includes a laser chip, a photodetector, a wavelength division multiplexing coupler, a first optical modulation element and a second optical modulation element. Laser chip is disposed on photonic integrated circuit, and is configured to generate first optical signal. Photodetector detects second optical signal. Wavelength division multiplexing coupler is configured to couple first optical signal to fiber, and receives second optical signal. First optical modulation element is coupled to wavelength division multiplexing coupler and laser chip, and is configured to modulate first optical signal.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 14, 2024
    Applicant: AuthenX Inc.
    Inventors: Sheng-Fu LIN, Po-Kuan SHEN, Chun-Chiang YEN, Yi-Ting LU, Jun-Rong CHEN, Jenq-Yang CHANG, Mao-Jen WU
  • Publication number: 20240085634
    Abstract: An optical fiber transmission device includes a substrate, a photonic integrated circuit, and an optical fiber assembly. The photonic integrated circuit is disposed on an area of the substrate. The substrate has a protruding structure at an interface with an edge of the photonic integrated circuit. The optical fiber assembly includes an optical fiber and a ferrule that sleeves the optical fiber. The protruding structure of the substrate is configured to abut against the ferrule to limit the position of the optical fiber assembly in a vertical direction of the substrate, such that the protruding structure is a stopper for the optical fiber assembly in the vertical direction.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 14, 2024
    Applicant: AuthenX Inc.
    Inventors: Chun-Chiang YEN, Po-Kuan SHEN, Sheng-Fu LIN, Yi-Ting LU, Jun-Rong CHEN, Jenq-Yang CHANG, Mao-Jen WU
  • Patent number: 11929547
    Abstract: A mobile device includes a system circuit board, a metal frame, one or more other antenna elements, a display device, a first feeding element, and an RF (Radio Frequency) module. The system circuit board includes a system ground plane. The metal frame at least includes a first portion and a second portion. The metal frame at least has a first cut point positioned between the first portion and the second portion. The metal frame further has a second cut point for separating the other antenna elements from the first portion. The first cut point is arranged to be close to a middle region of the display device. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion.
    Type: Grant
    Filed: April 7, 2023
    Date of Patent: March 12, 2024
    Assignee: HTC Corporation
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Li-Yuan Fang, Shen-Fu Tzeng, Yi-Hsiang Kung
  • Patent number: 11929409
    Abstract: Semiconductor device includes a substrate having multiple fins formed from a substrate, a first source/drain feature comprising a first epitaxial layer in contact with a first fin, a second epitaxial layer formed on the first epitaxial layer, and a third epitaxial layer formed on the second epitaxial layer, the third epitaxial layer comprising a center portion and an edge portion that is at a different height than the center portion; a fourth epitaxial layer formed on the third epitaxial layer, a second source/drain feature adjacent the first source/drain feature, comprising a first epitaxial layer in contact with a second fin, a second epitaxial layer formed on the first epitaxial layer of the second source/drain feature, a third epitaxial layer formed on the second epitaxial layer of the second source/drain feature, the third epitaxial layer comprising a center portion and an edge portion that is at a different height than the center portion of the third epitaxial layer of the second source/drain feature; a
    Type: Grant
    Filed: October 14, 2022
    Date of Patent: March 12, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wei Ju Lee, Chun-Fu Cheng, Chung-Wei Wu, Zhiqiang Wu
  • Publication number: 20240072115
    Abstract: A device includes: a complementary transistor including: a first transistor having a first source/drain region and a second source/drain region; and a second transistor stacked on the first transistor, and having a third source/drain region and a fourth source/drain region, the third source/drain region overlapping the first source/drain region, the fourth source/drain region overlapping the second source/drain region. The device further includes: a first source/drain contact electrically coupled to the third source/drain region; a second source/drain contact electrically coupled to the second source/drain region; a gate isolation structure adjacent the first and second transistors; and an interconnect structure electrically coupled to the first source/drain contact and the second source/drain contact.
    Type: Application
    Filed: February 13, 2023
    Publication date: February 29, 2024
    Inventors: Wei-Xiang You, Wei-De Ho, Hsin Yang Hung, Meng-Yu Lin, Hsiang-Hung Huang, Chun-Fu Cheng, Kuan-Kan Hu, Szu-Hua Chen, Ting-Yun Wu, Wei-Cheng Tzeng, Wei-Cheng Lin, Cheng-Yin Wang, Jui-Chien Huang, Szuya Liao
  • Publication number: 20240067816
    Abstract: A thermoplastic vulcanizate is provided. The thermoplastic vulcanizate includes: (A) about 100 parts by weight of a styrene copolymer rubber; (B) about 40-90 parts by weight of a thermoplastic elastomer; (C) about 5-15 parts by weight of an interfacial compatible resin; and (D) about 0.2-3 parts by weight of a cross-linking formulation, wherein the content of component (A) is greater than the content of component (B). Component (A) is dispersed in component (B) in the form of particles with a particle size of about 0.5-10 ?m.
    Type: Application
    Filed: May 16, 2023
    Publication date: February 29, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jin-An WU, Fu-Ming CHIEN, Yun-Chen CHANG
  • Patent number: 11912664
    Abstract: Provided herein are methods, systems, kits, and compositions useful for determining small molecule-protein interactions and protein-protein interactions. The photo-click tags provided herein can be conjugated to a small molecule or amino acid analog to provide compounds that can be integrated into a protein through photo-conjugation, allowing for identification of a small molecule-protein interaction or protein-protein interaction to elucidate the small molecules mechanism of action or the protein targeted by the small molecule. In some embodiments, the photo-click tags comprise a photo-conjugation moiety and a click chemistry handle, allowing for the attachment of various functional groups (e.g., affinity tags) to the small molecule or amino acid analog.
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: February 27, 2024
    Assignee: President and Fellows of Harvard College
    Inventors: Christina M. Woo, Jinxu Gao, Yuka Amako, Chia Fu Chang, Zhi Lin, Hung-Yi Wu
  • Publication number: 20240021760
    Abstract: A display module includes a driving substrate, a plurality of light-emitting diode (LED) lamp boards, a transparent cover and a blocking structure. The LED lamp boards are separately disposed on the driving substrate separately. The transparent cover is disposed on the driving substrate and has a plurality of accommodating grooves. The LED lamp boards correspond to the accommodating grooves respectively and are disposed at intervals. The blocking structure is disposed on the transparent cover and located between the transparent cover and the driving substrate. The LED lamp boards and the blocking structure are disposed at intervals.
    Type: Application
    Filed: March 15, 2023
    Publication date: January 18, 2024
    Applicant: Qisda Corporation
    Inventor: Po-Fu Wu