Patents by Inventor Fu Chang

Fu Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12293918
    Abstract: A method includes providing a substrate of a first conductivity type, the substrate including a first circuit region and a second circuit region; forming a first well region of a second conductivity type in the first circuit region of the substrate; forming a first doped region of the second conductivity type in the first well region; forming a diode in the second circuit region of the substrate; forming a first transistor and a second transistor over the substrate in the first circuit region and the second circuit region, respectively; forming a discharge structure over the substrate to electrically couple the first doped region to the diode; and forming a metallization layer over the discharge structure to electrically couple the first transistor to the second transistor subsequent to the forming of the diode, wherein charges accumulated in the first well region are drained to the substrate through the discharge structure.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: May 6, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yao-Jen Tsai, Keng-Hui Liao, Chih-Kai Yang, Chih-Fu Chang, Chia-Jen Leu, Chin-Yuan Ko
  • Patent number: 12282615
    Abstract: A passive capacitive stylus, comprising: a body, made of non-conductive material, comprises an internal space; a conductor, disposed inside the internal space, comprises conductive foam; a first head made of conductive material and disposed inside the first open and being protruded outside the body in a first direction of the central axis, the first head is in contact with the conductor; and a second head made of conductive material and disposed inside the second open and being protruded outside the body in a second direction of the central axis, the second head is in contact with the conductor.
    Type: Grant
    Filed: December 15, 2023
    Date of Patent: April 22, 2025
    Assignee: EGALAX_EMPIA TECHNOLOGY INC.
    Inventors: Chin-Fu Chang, Shang-Tai Yeh, Hsueh-Fen Lin, Yu-Cing Lien
  • Patent number: 12277289
    Abstract: The present invention relates to a touch module and a touch screen. The touch module includes a touch panel located on the display module, a main circuit board located outside the casing of the touch screen, a plurality of signal cables connecting the touch panel and the main circuit board, and an equal potential wiring. By setting an equal potential wiring in the touch module to electrically bridge any two signal cables, a short circuit is formed between the shielding layers of the signal cables so that the potentials of different signal cables can be equalized to make the signal cables roughly the same degree of electrostatic or electromagnetic interference from the environment. By making the signals obtained by the signal cables be disturbed to approximately the same degree, the touch module can accurately determine the touch position.
    Type: Grant
    Filed: June 16, 2023
    Date of Patent: April 15, 2025
    Assignee: EGALAX_EMPIA TECHNOLOGY INC.
    Inventors: Chin-Fu Chang, Shang-Tai Yeh, Cheng-Han Lee
  • Patent number: 12272741
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a first semiconductor layer overlying a substrate. A first barrier layer is disposed on the first semiconductor layer. A second semiconductor layer overlies and directly contacts the first barrier layer. A second barrier layer directly contacts the first barrier layer. A third semiconductor layer overlies the second barrier layer. A fourth semiconductor layer overlies the third semiconductor layer. Outer sidewalls of the third semiconductor layer, outer sidewalls of the fourth semiconductor layer, and outer sidewalls of the second barrier layer are respectively aligned.
    Type: Grant
    Filed: August 3, 2023
    Date of Patent: April 8, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Man-Ho Kwan, Fu-Wei Yao, Chun Lin Tsai, Jiun-Lei Jerry Yu, Ting-Fu Chang
  • Patent number: 12260318
    Abstract: A multiply accumulate circuit receives m one-bit neuron values from a first layer of a neural network system. The multiply accumulate circuit includes m non-volatile memory cells and m current sources. In addition, m current paths are defined by the m non-volatile memory cells and the m current sources collaboratively. A first current path is defined by a first non-volatile memory cell and a first current source. A first terminal of the first current source receives a first supply voltage. A second terminal of the first current source is connected with a first terminal of the first non-volatile memory cell. A second terminal of the first non-volatile memory cell is connected with an output terminal of the multiply accumulate circuit. A control terminal of the first current source receives a first one-bit neuron value.
    Type: Grant
    Filed: January 5, 2021
    Date of Patent: March 25, 2025
    Assignee: EMEMORY TECHNOLOGY INC.
    Inventors: Chia-Fu Chang, Cheng-Heng Chung, Ching-Yuan Lin
  • Patent number: 12261074
    Abstract: A method includes forming a first polymer layer to cover a metal pad of a wafer, and patterning the first polymer layer to form a first opening. A first sidewall of the first polymer layer exposed to the first opening has a first tilt angle where the first sidewall is in contact with the metal pad. The method further includes forming a metal pillar in the first opening, sawing the wafer to generate a device die, encapsulating the device die in an encapsulating material, performing a planarization to reveal the metal pillar, forming a second polymer layer over the encapsulating material and the device die, and patterning the second polymer layer to form a second opening. The metal pillar is exposed through the second opening. A second sidewall of the second polymer layer exposed to the second opening has a second tilt angle greater than the first tilt angle.
    Type: Grant
    Filed: June 16, 2023
    Date of Patent: March 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsi-Kuei Cheng, Ching Fu Chang, Chih-Kang Han, Hsin-Chieh Huang
  • Publication number: 20250087888
    Abstract: An antenna assembly includes a patch antenna, a metal layer, and a feed-in signal layer. The metal layer is disposed on a side of the patch antenna and includes a first slot and a second slot. The feed-in signal layer is disposed on a side of the metal layer opposite the second antenna and includes a transmitting port, a receiving port, a hybrid coupler, and two microstrips. The transmitting port and the receiving port are connected to the hybrid coupler, and the two microstrips are extended in the direction away from the hybrid coupler. Projections of two ends of the two microstrips onto the metal layer are overlapped with the first slot and the second slot. An antenna array is also mentioned.
    Type: Application
    Filed: May 30, 2024
    Publication date: March 13, 2025
    Applicant: PEGATRON CORPORATION
    Inventors: Chien-Yi Wu, Tse-Hsuan Wang, Chih-Fu Chang, Hsin-Feng Hsieh, Wu-Hua Chen, Chih-Wei Liao, Chao-Hsu Wu
  • Patent number: 12248191
    Abstract: An optical connector has a connector housing assembly for holding one or more ferrules, the connector housing assembly having a height align a vertical alignment axis and a width perpendicular to the height. The connector housing assembly includes an inner front body and an outer release component, the outer release component being movable in relation to the inner front body between a front position and a back position. The optical fiber connector is configured to mate with a receptacle having an upper receptacle hook such that the upper receptacle hook is received in the upper receptacle hook recess and latches with the upper hook retainer surface when the outer release component is in the front position and such that the upper ramp lifts the upper receptacle hook out of the upper receptacle hook recess when the outer release component moves to the back position.
    Type: Grant
    Filed: October 10, 2023
    Date of Patent: March 11, 2025
    Assignee: Senko Advanced Components, Inc.
    Inventors: Kazuyoshi Takano, Jimmy Jun-Fu Chang
  • Patent number: 12235493
    Abstract: An optical connector holding two or more LC-type optical ferrules is provided. The optical connector includes an outer body, an inner front body accommodating the two or more LC-type optical ferrules, ferrule springs for urging the optical ferrules towards a mating connection, and a back body for supporting the ferrule springs. A removable inner front body for polarity change is disclosed. A multi-purpose rotatable boot assembly for polarity change is disclosed. The multi-purpose boot assembly can be pushed and pulled to insert and remove the micro connector from an adapter receptacle.
    Type: Grant
    Filed: April 29, 2024
    Date of Patent: February 25, 2025
    Assignee: Senko Advanced Components, Inc.
    Inventors: Kazuyoshi Takano, Jimmy Jun-Fu Chang
  • Patent number: 12229553
    Abstract: A software developer proxy tool accesses microservice applications for a software development project by connecting the developer proxy tool to a common port on a computer network. The tool implements software and hardware to register a plurality of the microservice applications on connection ports that connect to the developer proxy tool at an address for the common port. Data requests among the microservices are handled by the developer proxy tool via the common port. The tool sequentially queries selected microservice applications on the respective connection ports to determine availability for completing a request. The tool receives responses back from microservices and directs the responses back to the requesting program. Failed requests trigger use of remote or third party microservice applications that may be available over an internet connection.
    Type: Grant
    Filed: October 28, 2022
    Date of Patent: February 18, 2025
    Assignee: Change Healthcare Holdings, LLC
    Inventors: Henry Spivey, Chun-Fu Chang, Wei-Yuan Lo
  • Patent number: 12228774
    Abstract: An optical connector holding two or more LC-type optical ferrules is provided. The optical connector includes an outer body, an inner front body accommodating the two or more LC-type optical ferrules, ferrule springs for urging the optical ferrules towards a mating receptacle, and a back body for supporting the ferrule springs. The outer body and the inner front body are configured such that four LC-type optical ferrules are accommodated in a small form-factor pluggable (SFP) transceiver footprint or eight LC-type optical ferrules are accommodated in a quad small form-factor pluggable (QSFP) transceiver footprint. A mating receptacle (transceiver or adapter) includes internal alignment slots configured to accept a corresponding alignment key on connector outer housing to ensure alignment and orientation for maximum signal transfer between opposing ferrule end faces.
    Type: Grant
    Filed: August 22, 2023
    Date of Patent: February 18, 2025
    Assignee: Senko Advanced Components, Inc.
    Inventors: Jimmy Jun-Fu Chang, Kazuyoshi Takano
  • Publication number: 20250046991
    Abstract: An electronic device includes a circuit structure, an electronic component electrically connected to the circuit structure, an antenna unit disposed on the circuit structure, and a shielding layer surrounding the electronic component. The circuit structure has a first surface and a second surface opposite to the first surface. The first surface has a first portion, a second portion, and a third portion, wherein the third portion connects the first portion and the second portion. In the normal direction of the electronic device, the third portion is closer to the second surface than the first portion or the second portion, thereby forming a recess. The electronic component is disposed in the recess. The antenna unit is disposed on the first surface of the circuit structure and is electrically connected to the electronic component through the circuit structure.
    Type: Application
    Filed: July 3, 2024
    Publication date: February 6, 2025
    Inventors: Zi-Zhong WANG, Kuan-Hsueh LIN, Yung-Fu CHANG, Lung-Shu HUANG
  • Publication number: 20250048018
    Abstract: A head-mounted device and a retractable headband are provided. The head-mounted device includes a host, a retractable headband, and an earphone. The host has a first connection part and a second connection part located on two opposite sides. The retractable headband has an earphone connection part and a first connection end and a second connection end located on two opposite sides. The first connection end is connected to the first connection part. The second connection end is connected to the second connection part. When the retractable headband is elongated by an elongation amount, a change in a distance between the earphone connection part and the first connection end is less than half of the elongation amount. The earphone is connected to the earphone connection part.
    Type: Application
    Filed: July 3, 2024
    Publication date: February 6, 2025
    Applicant: HTC Corporation
    Inventors: Li-Hsun Chang, Kuan-Ying Ou, Chen-Fu Chang, Chih-Hsiang Hsieh
  • Patent number: 12217808
    Abstract: Methods and apparatus for NAND flash memory are disclosed. In an embodiment, a method is provided for programming a memory device having a plurality of memory chips that comprise multiple-level-cells. The method includes loading first data in a first chip, programming the first data into selected cells of the first chip using a single-level-cell (SLC) programming mode, and reprogramming the first data stored in the selected cells of the first chip to other cells of the first chip using a multiple-level-cell programming mode. The method also includes repeating the operations of loading, programming, and reprogramming for the remaining chips. The loading operations for the remaining chips begin at the completion of the loading operation for the first chip and occur in a non-overlapping sequential manner, and the loading operations for the remaining chips are performed in parallel with the programming and reprogramming operations of the first chip.
    Type: Grant
    Filed: August 1, 2022
    Date of Patent: February 4, 2025
    Assignee: NEO Semiconductor, Inc.
    Inventor: Fu-Chang Hsu
  • Publication number: 20250013321
    Abstract: A passive capacitive stylus, comprising: a body, made of non-conductive material, comprises an internal space; a conductor, disposed inside the internal space, comprises conductive foam; a first head made of conductive material and disposed inside the first open and being protruded outside the body in a first direction of the central axis, the first head is in contact with the conductor; and a second head made of conductive material and disposed inside the second open and being protruded outside the body in a second direction of the central axis, the second head is in contact with the conductor.
    Type: Application
    Filed: December 15, 2023
    Publication date: January 9, 2025
    Inventors: Chin-Fu Chang, Shang-Tai Yeh, Hsueh-Fen Lin, Yu-Cing Lien
  • Patent number: 12191557
    Abstract: An electronic device includes a metal back cover and an antenna module. The metal back cover includes a slot. The antenna module is located in the metal back cover. The antenna module includes a first radiator, second radiator, third radiator, fourth radiator, and fifth radiator. The first radiator has a feeding end. The second radiator connected to the first radiator has a contact portion which is connected to the metal back cover. The third radiator is connected to the second radiator and is located beside the first radiator. The third radiator has a first grounding terminal. The fourth radiator is connected to the second radiator and has a second grounding terminal. The fifth radiator is connected to the third radiator and the fourth radiator. Distances between the feeding end and the slot, the first grounding terminal and the slot, and the second grounding terminal and the slot all range from 3.5 mm to 10 mm.
    Type: Grant
    Filed: August 12, 2022
    Date of Patent: January 7, 2025
    Assignee: PEGATRON CORPORATION
    Inventors: Chien-Yi Wu, Hau Yuen Tan, Chao-Hsu Wu, Chen-Kuang Wang, Chih-Fu Chang, Tsung-Chi Tsai, Shih-Keng Huang, Tse-Hsuan Wang, Sheng-Chin Hsu
  • Patent number: 12165717
    Abstract: Methods and apparatus for a novel memory array are disclosed. In an embodiment, a method is provided for reading a dynamic random-access memory (DRAM) array. The method includes activating the bit line select gates to equalize voltage levels on a plurality of bit lines, deactivating the bit line select gates to maintain the equalized voltage levels on the plurality of bit lines using a bit line capacitance associated with each bit line, and activating a selected word line to access selected memory cells connected to the selected word line. The method also includes activating bit line select gates to pass first data from a first bit line and second data from a second bit line to the sense amplifier. The first data is from a selected memory cell and the second data is reference data. The method also includes determining sensed data from the first and second data.
    Type: Grant
    Filed: July 15, 2022
    Date of Patent: December 10, 2024
    Assignee: NEO Semiconductor, Inc.
    Inventor: Fu-Chang Hsu
  • Publication number: 20240404598
    Abstract: Various 3D cells, array structures, and processes are disclosed. In an embodiment, a memory cell array structure is provided that includes memory cells organized into rows and columns, input lines where each input line is connected to memory cells in a selected row, and the input lines form input line groups, and output lines where each output line is connected to memory cells in a selected column, and the output lines form output line groups. The array structure also includes a multiplexer having multiplexer inputs and multiplexer outputs such that the multiplexer inputs are connected to the output line groups, neuron circuits connected to the multiplexer outputs, and the memory cell array simulates a neural network in which the input lines simulate input layer neurons of the neural network, and the output lines simulate output layer neurons of the neural network.
    Type: Application
    Filed: June 5, 2024
    Publication date: December 5, 2024
    Inventor: Fu-Chang Hsu
  • Patent number: 12146354
    Abstract: A hinge device includes a pivot seat, a rotating shaft, a first friction block, and a locking assembly. By being structurally provided with a sleeve, a first cam ring, a first elastic ring, a second friction block, a second cam ring, a second elastic ring, an elastic element, a locking portion, and a cover of the locking assembly, the hinge device has a locking function and a long service life.
    Type: Grant
    Filed: July 10, 2023
    Date of Patent: November 19, 2024
    Assignee: PEGATRON CORPORATION
    Inventors: Chun-Fu Chang, Hui-Chen Wang, Yi-Chun Tang
  • Patent number: 12144595
    Abstract: The present invention provides a wearable device for monitoring blood-pressure.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: November 19, 2024
    Assignee: Cardio Ring Technologies, Inc.
    Inventors: Kuang-Fu Chang, Yu-Chi Wang, Leng-Chun Chen, Jun-Ming Chen, Wen-Pin Shih