Abstract: A semiconductor memory device includes a stack of alternating insulating layers and first conductive layers disposed over a substrate; a plurality of memory cell strings penetrating the stack over the substrate, each memory cell string comprising a central portion extending through the stack, a semiconductor layer surrounding the central portion, and a ferroelectric layer surrounding the semiconductor layer, and the central portion comprising a channel isolation structure and a second conductive layer and a third conductive layer at two sides of the channel isolation structure; and a plurality of cell isolation structures penetrating the conductive layers and the insulating layers over the substrate and disposed between two memory cell strings, each cell isolation structure comprising a top portion and a bottom portion adjoined to the top portion and different from the top portion.

Abstract: A method includes adding a first additive to an electroplating solution, wherein the first additive is a relatively weak suppressing agent; adding a second additive to the electroplating solution, wherein the second additive is a relatively strong suppressing agent; adding a third additive to the electroplating solution, wherein the third additive is a leveling agent; and depositing copper using the electroplating solution, wherein most of the copper is nanotwinned grains having a (111)-orientation.

Abstract: A semiconductor device includes anti-fuse cells. The anti-fuse cells include a first active area, a first gate, a second gate, at least one first gate via, and at least one second gate via. The first gate and the second gate are separate from each other. The first gate and the second gate extend to cross over the first active area. The at least one first gate via is coupled to the first gate and disposed directly above the first active area. The at least one second gate via is coupled to the second gate. The first gate is coupled through the at least one first gate via to a first word line for receiving a first programming voltage, and the second gate is coupled through the at least one second gate via to a second word line for receiving a first reading voltage.

Abstract: In an indoor environment on fire, automatic deployment of sensors disposed on, beneath or over the floor to look upward the ceiling to observe a body of smoke and flame risen near the ceiling allows important information regarding states and dynamics of the body of smoke and flame to be gathered at an early stage of fire (e.g. before arrival of firefighters). By distributing the sensors over the indoor environment, the states and dynamics of the body of smoke and flame are monitored holistically (i.e. as a whole) even at the early stage of fire. Such information is useful to predict development of the fire. In one implementation, a sensor is held in an infrastructure sensor holder mounted on the ceiling during normal time. Upon detecting occurrence of fire, the sensor drops from the holder to land on the floor and orients a sensing direction vertically upward to perform monitoring.

Abstract: An integrated circuit package and a method of forming the same are provided. The method includes attaching an integrated circuit die to a first substrate. A dummy die is formed. The dummy die is attached to the first substrate adjacent the integrated circuit die. An encapsulant is formed over the first substrate and surrounding the dummy die and the integrated circuit die. The encapsulant, the dummy die and the integrated circuit die are planarized, a topmost surface of the encapsulant being substantially level with a topmost surface of the dummy die and a topmost surface of the integrated circuit die. An interior portion of the dummy die is removed. A remaining portion of the dummy die forms an annular structure.

Abstract: An unmanned aerial vehicle (UAV) having a dismantling status determination system is provided. The UAV includes a casing, having at least one casing assembly, and a dismantling status determination system. The dismantling status determination system includes a dismantling detection unit, a position detection unit, a storage unit, and a processing unit. The dismantling detection unit is disposed on the at least one casing assembly to provide a body status information according to whether the at least one casing assembly is detached. The position detection unit detects a current position of the UAV. The storage unit stores a safe position list. When the processing unit determines that the at least one casing assembly is in the dismantling status, the processing unit determines whether the current position is included in the safe position list. If not, the processing unit determines that the dismantling status corresponds to an illegal dismantling action.

Abstract: A method includes generating light pulses by an illumination source toward an object; collecting the light pulses reflected from the object by an image sensor; generating a first signal-time plot of a sensor signal by the image sensor; generating a second signal-time plot of an index signal, wherein the second signal-time plot of the index signal comprises pulsed signals corresponding to the light pulses, respectively; collecting data from selected time periods of the first signal-time plot of the sensor signal, wherein the selected time periods of the first signal-time plot of the sensor signal are the same as time periods of the light pulses in the second signal-time plot of the index signal; and generating a third signal-time plot of an output signal based on the collected data.

Abstract: An optical structure is provided. The optical structure includes a substrate, a light-emitting element, a glue layer, and a light-adjusting element. The light-emitting element is disposed on the substrate. The glue layer covers the light-emitting element. The light-adjusting element is disposed on the glue layer. Moreover, the refractive index of the glue layer is different from the refractive index of the light-adjusting element.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.

Abstract: This disclosure is directed to an adsorption unit, having a frame, multiple spacer tubes and multiple adsorption granules. The frame has an inlet side and an exhaust side. The spacer tubes are arranged in the frame, and a plurality of through holes are provided on each of the spacer tubes. The adsorbed granules are arranged in the frame, and the adsorbed granules are restricted by the spacers and fixed in the frame so as to locate between the inlet side and the exhaust side. Air enters the adsorption unit from the environment through the inlet side, passes through the adsorption unit, and leaves the adsorption unit through the exhaust side. The air passes through the adsorption unit and returns to the environment so as to contact the adsorption granules to remove carbon dioxide and water.

Abstract: This disclosure is directed to an adsorption unit having spring structure, which has a frame, multiple limiting springs and multiple adsorption granules. The frame has an inlet side and an exhaust side. The limiting springs are arranged in the frame, and a slot is provided on each limiting spring. The adsorbed granules are arranged in the frame and restricted by the spacers and fixed in the frame so as to locate between the inlet side and the exhaust side. Air enters the adsorption unit from the environment through the inlet side, passes through the adsorption unit, and leaves the adsorption unit through the exhaust side. The air passes through the adsorption unit and returns to the environment so as to contact the adsorption granules to remove carbon dioxide and water.

Abstract: This disclosure is directed to an adsorption unit, having a frame, multiple spacer pieces and multiple adsorption structures. The frame has an inlet side and an exhaust side. The spacer pieces are arranged in the frame. The adsorbed structures are arranged in the frame, and are restricted by the spacers and fixed in the frame so as to locate between the inlet side and the exhaust side. Air enters the adsorption unit from the environment through the inlet side, passes through the adsorption unit, and leaves the adsorption unit through the exhaust side. The air passes through the adsorption unit and returns to the environment so as to contact the adsorption structures to remove carbon dioxide and water.

Abstract: This disclosure is directed to a carbon capture system having an adsorption module, a fan module, a desorption chamber and a desorption line. The adsorption module has a plurality of adsorption units arranged in a coplanar array. Each of the adsorption units has a frame and a plurality of adsorption structures. The frame has an inlet end and an exhaust end. The adsorption structures are arranged in the frame, and the adsorption module is defined with a flow direction from the inlet ends toward the exhaust ends. The fan module is defined with an air outlet direction, and the air outlet direction is arranged along the flow direction. The desorption chamber is used for accommodating the adsorption module. One end of the desorption pipeline is connected to the desorption chamber, and the desorption pipeline is connected with a gas storage tank and a negative pressure pump arranged in series.

Abstract: A cleaning system includes a cleaning device, a tray, a charging assembly, a body and a floor brush assembly. The floor brush assembly has rollers which rotate around an X-axis, and can rotate at least in the X-axis direction relative to the body. The charging assembly has a male charging end and a female charging end, wherein one of the male charging end and the female charging end is provided on the body, and the other is provided on the tray. Opposite sides of the male charging end have first electrode sheets and the female charging end has corresponding second electrode sheets. The body of the cleaning system, the body rotates such that the location of the first electrode sheets of the male charging end avoid a problem of poor contact with second electrode sheets of the female charging end.

Abstract: An optoelectronic device includes a first substrate, a second substrate, a photonic integrated circuit, and a laser diode. The second substrate is over the first substrate. The photonic integrated circuit is disposed on the first substrate and includes a first waveguide channel, a second waveguide channel, and a patterned structure. The first waveguide channel and the second waveguide channel are coupled to the patterned structure. The laser diode is disposed on the second substrate and configured to emit a light beam toward the patterned structure.

Abstract: A stacked via structure disposed on a conductive pillar of a semiconductor die is provided. The stacked via structure includes a first dielectric layer, a first conductive via, a first redistribution wiring, a second dielectric layer, a second conductive via, and a second redistribution wiring. The first dielectric layer covers the semiconductor die. The first conductive via is embedded in the first dielectric layer and electrically connected to the conductive pillar. The first redistribution wiring covers the first conductive via and the first dielectric layer. The second dielectric layer covers the first dielectric layer and the first redistribution wiring. The second conductive via is embedded in the second dielectric layer and landed on the first redistribution wiring. The second redistribution wiring covers the second conductive via and the second dielectric layer. A lateral dimension of the first conductive via is greater than a lateral dimension of the second conductive via.

Abstract: A method for operating an emergency charging device includes when a mutual charging switch of the emergency charging device is triggered, setting a plurality of batteries whose power is lower than a predetermined threshold as a target battery group, selecting a battery with a highest capacity from the target battery group as a battery to be recharged, selecting a battery with a capacity lower than the battery to be recharged from the target battery group as a discharge battery, and charging the battery to be recharged from the discharge battery.

Abstract: An antenna assembly includes a patch antenna, a metal layer, and a feed-in signal layer. The metal layer is disposed on a side of the patch antenna and includes a first slot and a second slot. The feed-in signal layer is disposed on a side of the metal layer opposite the second antenna and includes a transmitting port, a receiving port, a hybrid coupler, and two microstrips. The transmitting port and the receiving port are connected to the hybrid coupler, and the two microstrips are extended in the direction away from the hybrid coupler. Projections of two ends of the two microstrips onto the metal layer are overlapped with the first slot and the second slot. An antenna array is also mentioned.

Abstract: A minimum IC operating voltage searching method includes acquiring a corner type of an IC, acquiring ring oscillator data of the IC, generating a first prediction voltage according to the corner type and the ring oscillator data by using a training model, generating a second prediction voltage according to the ring oscillator data by using a non-linear regression approach under an N-ordered polynomial, and generating a predicted minimum IC operating voltage according to the first prediction voltage and the second prediction voltage. N is a positive integer.

Abstract: This disclosure provides systems, methods, and devices for image signal processing that support high dynamic range (HDR) image processing on image frames with temporally-aligned centers to reduce artifacts resulting from fusing image frames with different temporal centers. In some aspects, a method of image processing includes capturing three or more image frames having at least two different exposure lengths. The three or more image frames are processed to obtain two image frames with temporally-aligned centers, and those two image frames are processed in HDR fusion logic to obtain an output HDR image frame. Other aspects and features are also claimed and described.