Patents by Inventor Fu Yang

Fu Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200273948
    Abstract: A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure.
    Type: Application
    Filed: May 15, 2020
    Publication date: August 27, 2020
    Applicant: Unimicron Technology Corp.
    Inventors: Yu-Hua Chen, Fu-Yang Chen, Chun-Hsien Chien, Chien-Chou Chen, Wei-Ti Lin
  • Publication number: 20200266181
    Abstract: A manufacturing method of the light-emitting diode package structure is provided. A carrier is formed. The carrier comprises a first build-up circuit. At least one self-assembled material layer is formed on the first build-up circuit. A first solder mask layer is formed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the at least one self-assembled material layer. At least one light-emitting diode is disposed on the first build-up circuit. The at least one light-emitting diode has a self-assembled pattern, and the at least one light-emitting diode is self-assembled into the at least one opening of the first solder mask layer through a force between the self-assembled pattern and the at least one self-assembled material layer.
    Type: Application
    Filed: May 8, 2020
    Publication date: August 20, 2020
    Applicant: Unimicron Technology Corp.
    Inventors: Wei-Ti Lin, Chun-Hsien Chien, Fu-Yang Chen
  • Publication number: 20200224674
    Abstract: A fan frame is provided and includes a body and a first cover plate. The body includes a main surface and a first side which is substantially perpendicular to the main surface. A first channel and a second channel, which are adjacent to each other, are formed in the body, and a first space is formed among the main surface, the first side, a sidewall of the first channel, and a sidewall of the second channel. The cover plate is disposed on the body, and covers the first space, wherein a first hole is formed in the first cover plate, and the first space communicates with the external environment via the first hole.
    Type: Application
    Filed: January 3, 2020
    Publication date: July 16, 2020
    Inventors: Chao-Fu YANG, Pei-Han CHIU
  • Patent number: 10700049
    Abstract: A light-emitting diode package structure includes a carrier, at least one self-assembled material layer, a first solder mask layer, and at least one light-emitting diode. The carrier includes a first build-up circuit. The self-assembled material layer is disposed on the first build-up circuit. The first solder mask layer is disposed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the self-assembled material layer. The light-emitting diode is disposed on the first build-up circuit. The light-emitting diode has a self-assembled pattern. The light-emitting diode is self-assembled into the opening of the first solder mask layer through a force between the self-assembled pattern and the self-assembled material layer. A manufacturing method of the light-emitting diode package structure is also provided.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: June 30, 2020
    Assignee: Unimicron Technology Corp.
    Inventors: Wei-Ti Lin, Chun-Hsien Chien, Fu-Yang Chen
  • Patent number: 10700161
    Abstract: A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure. A substrate structure obtained by the manufacturing method of the substrate structure is provided.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: June 30, 2020
    Assignee: Unimicron Technology Corp.
    Inventors: Yu-Hua Chen, Fu-Yang Chen, Chun-Hsien Chien, Chien-Chou Chen, Wei-Ti Lin
  • Publication number: 20200185188
    Abstract: A mechanical feedthrough apparatus is provided to be mounted on a pivot base of a vacuum apparatus. A first axial tube of the mechanical feedthrough apparatus is pivotally connected to the pivot base and a second axial tube of the mechanical feedthrough apparatus is inserted into the first axial tube. An external cone surface of the second axial tube contacts with an internal cone surface of a first axial tube such that the second axial tube is close-fitted to the first axial tube.
    Type: Application
    Filed: December 6, 2018
    Publication date: June 11, 2020
    Inventors: Jyh-Nan Shieh, Kuny-Ming Hsu, Ching-Fu Yang, Mei-Jung Ho, Ting-Pin Cho
  • Patent number: 10678295
    Abstract: A data capture method and a data capture device are provided. The data capture method includes: receiving a data signal and a clock signal corresponding to the data signal; generating an auxiliary clock signal according to the clock signal, wherein phases of the clock signal and the auxiliary clock signal are different; sampling the data signal respectively according to the clock signal and the auxiliary clock signal to respectively obtain a plurality of data states and a plurality of edge sampling results; generating a plurality of pieces of edge information according to the data states and the corresponding edge sampling results, and performing an accumulation operation according to the edge information to generate a temporary value; and adjusting the clock signal according to the temporary value to generate an adjusted clock signal, and sampling the data signal according to the adjusted clock signal to obtain a plurality of transmission data.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: June 9, 2020
    Assignee: Au Optronics Corporation
    Inventors: Jhih-Syuan Fu, Chun-Fan Chung, Chih-Fu Yang
  • Publication number: 20200166047
    Abstract: A fan impeller includes a hub, a shaft, a metal housing, a magnetic ring and a plurality of blades. The outer periphery of the hub has a curved surface. The shaft is disposed in the hub and connected to the hub. The metal housing has an annular shape and is disposed in the hub. The magnetic ring is disposed at the inner side of the metal housing. The blades are disposed around the outer periphery of the hub.
    Type: Application
    Filed: October 3, 2019
    Publication date: May 28, 2020
    Inventors: Shun-Chen CHANG, Chao-Fu YANG
  • Publication number: 20200157075
    Abstract: Disclosed are small molecule inhibitors of ?v?6 integrin, and methods of using them to treat a number of diseases and conditions.
    Type: Application
    Filed: June 26, 2019
    Publication date: May 21, 2020
    Inventors: Bryce A. Harrison, Matthew G. Bursavich, Mark Brewer, Aleksey I. Gerasyuto, Kristopher N. Hahn, Kyle D. Konze, Fu-Yang Lin, Blaise S. Lippa, Alexey A. Lugovskoy, Bruce N. Rogers, Mats A. Svensson, Dawn M. Troast
  • FAN
    Publication number: 20200124051
    Abstract: A fan includes a frame, an impeller and a motor. The frame includes a base, a frame housing and a plurality of static blades. The frame housing includes an outlet. The static blades are disposed around the outer periphery of the base and connect between the base and the frame housing. A distance is provided between the outlet and the ends of the static blades located adjacent to the outlet, and the static blades are not protruding from the outlet. The impeller includes a hub and a plurality of rotor blades. The hub has a curved surface. The slopes of the straight lines connecting any two points on the curved surface are not equal. The rotor blades are disposed around the outer periphery of the hub. The motor is disposed on the base, and connects with and drives the impeller to rotate.
    Type: Application
    Filed: June 10, 2019
    Publication date: April 23, 2020
    Inventors: Shun-Chen CHANG, Chao-Fu YANG
  • Publication number: 20200116159
    Abstract: An impeller includes a hub and blades. In radial direction, an upper surface of the blade near the outer edge includes a groove structure, a lower surface of the blade relating to the groove structure includes a peak structure, the lower surface of the blade includes a recess structure aside the trailing edge or the leading edge. The recess structure is connected to the peak structure. The blade has at least five airfoils from the inner edge to the outer edge. The blade is defined by continuously connecting the at least five airfoils at different sections in sequence so as to form the groove structure and the peak structure respectively on the upper surface and the lower surface. The groove structure and the peak structure are aside the outer edge of the blade.
    Type: Application
    Filed: December 11, 2019
    Publication date: April 16, 2020
    Inventors: Chao-Fu YANG, Li-Han HUNG, Jen-Bo HUANG, Shun-Chen CHANG, Kuo-Tung HSU
  • Publication number: 20200105485
    Abstract: A magnetic keyboard has a plurality of magnetic keyswitches, and each magnetic keyswitch include a base, a keycap, a supporting device, a magnetic component and a metal thin sheet. The base has at least one engaging structure and a hole. The supporting device has a first support, an end of the first support is movably connected to the engaging structure, and the other end of the first support is movably connected to the keycap. The first support has a magnet portion. The magnetic component is disposed on the base and functioned with the magnet portion to provide a recovering force to the keycap. The metal thin sheet is disposed under the base and has a bendable cantilever portion covering the hole. While the cantilever portion is bent by an external force, the magnetic component can be removed through the hole.
    Type: Application
    Filed: December 1, 2019
    Publication date: April 2, 2020
    Inventors: Sung-Fu Yang, Po-Chun Hou
  • Publication number: 20200103745
    Abstract: A method includes placing a photomask having a contamination on a surface thereof in a plasma processing chamber. The contaminated photomask is plasma processed in the plasma processing chamber to remove the contamination from the surface. The plasma includes oxygen plasma or hydrogen plasma.
    Type: Application
    Filed: September 11, 2019
    Publication date: April 2, 2020
    Inventors: Chun-Fu YANG, Pei-Cheng HSU, Ta-Cheng LIEN, Hsin-Chang LEE
  • Publication number: 20200087299
    Abstract: Disclosed are small molecule inhibitors of av136 integrin, and methods of using them to treat a number of diseases and conditions.
    Type: Application
    Filed: February 27, 2018
    Publication date: March 19, 2020
    Inventors: Mark Brewer, Matthew G. Bursavich, Aleksey I. Gerasyuto, Kristopher N. Hahn, Bryce A. Harrison, Kyle D. Konze, Fu-Yang Lin, Blaise S. Lippa, Alexey A. Lugovskoy, Bruce N. Rogers, Mats A. Svensson, Dawn M. Troast
  • Publication number: 20200075711
    Abstract: A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure. A substrate structure obtained by the manufacturing method of the substrate structure is provided.
    Type: Application
    Filed: October 15, 2018
    Publication date: March 5, 2020
    Applicant: Unimicron Technology Corp.
    Inventors: Yu-Hua Chen, Fu-Yang Chen, Chun-Hsien Chien, Chien-Chou Chen, Wei-Ti Lin
  • Publication number: 20200071322
    Abstract: Disclosed are small molecule inhibitors of ?v?6 integrin, and methods of using them to treat a number of diseases and conditions.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 5, 2020
    Inventors: Bryce A. Harrison, James E. Dowling, Matthew G. Bursavich, Dawn M. Troast, Blaise S. Lippa, Bruce N. Rogers, Kristopher N. Hahn, Cheng Zhong, Qi Qiao, Fu-Yang Lin, Brian Sosa, Aleksey I. Gerasyuto, Andrea Bortolato, Mats A. Svensson, Eugene Hickey, Kyle D. Konze, Tyler Day, Byungchan Kim
  • Publication number: 20200075564
    Abstract: A light-emitting diode package structure includes a carrier, at least one self-assembled material layer, a first solder mask layer, and at least one light-emitting diode. The carrier includes a first build-up circuit. The self-assembled material layer is disposed on the first build-up circuit. The first solder mask layer is disposed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the self-assembled material layer. The light-emitting diode is disposed on the first build-up circuit. The light-emitting diode has a self-assembled pattern. The light-emitting diode is self-assembled into the opening of the first solder mask layer through a force between the self-assembled pattern and the self-assembled material layer. A manufacturing method of the light-emitting diode package structure is also provided.
    Type: Application
    Filed: October 16, 2018
    Publication date: March 5, 2020
    Applicant: Unimicron Technology Corp.
    Inventors: Wei-Ti Lin, Chun-Hsien Chien, Fu-Yang Chen
  • Patent number: 10573898
    Abstract: The disclosure provides a high permeable porous substrate. The high permeable porous substrate includes a porous substrate body and a plurality of channels. The plurality of channels penetrate the first surface of the porous substrate body and do not penetrate the second surface of the porous substrate body. In addition, a solid oxide fuel cell supported by the high permeable porous substrate is also provided.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: February 25, 2020
    Assignee: INSTITUTE OF NUCLEAR ENERGY RESEARCH ATOMIC ENERGY COUNCIL, EXECUTIVE YUAN
    Inventors: Chang-Sing Hwang, Chun-Huang Tsai, Chun-Liang Chang, Zong-Yang Chuang Shie, Sheng-Fu Yang, Te-Jung Huang, Shih-Wei Cheng
  • Patent number: 10570065
    Abstract: A method is provided to fabricate a green desiccant wheel. A green recycled adsorbent material of aluminum hydroxide and alumina is extracted and used as a base material to be added to a 3-dimensional (3D) network skeleton of a foam support. Through sintering, surface is hardened with the material adsorbed to megapores uniformly distributed. Thus, an adsorbent material of porous ceramic having pores on surface is made. The area contacting with moist air is increased. The moisture-adsorbing capacity is improved. At last, the whole procedure is integrated to develop a high-efficiency green desiccant wheel. Thus, the reusable materials are kept at innate grade or upgraded for recycling and regenerating. New materials and products can be further fabricated. The present invention helps solving environmental problem of wastes. Life cycle of resource is lengthened. A sample of recycling economy is innovated. Industrial efficiency is effectively enhanced.
    Type: Grant
    Filed: October 8, 2018
    Date of Patent: February 25, 2020
    Assignee: INSTITUTE OF NUCLEAR ENERGY RESEARCH, ATOMIC ENERGY COUNCIL, EXECUTIVE YUAN, R.O.C.
    Inventors: Sheng-Fu Yang, To-Mei Wang, Chi-Tzeng Hsu, Heng-Yi Li
  • Patent number: 10547079
    Abstract: A portable flame electric generation device having metal-supported solid oxide fuel cells includes a furnace, a heat shield structure, a plurality of metal-supported solid oxide fuel cells and a housing structure. Each of the metal-supported solid oxide fuel cells includes a porous metal substrate, a first anode layer, a second anode layer, an anode isolation layer, an electrolyte layer, a cathode isolation layer, a cathode interface layer and a cathode current-collecting layer. The metal-supported solid oxide fuel cell is capable of quickly starting up and withstanding thermal shocks, and also liquefied fuel cartridges are applied as heating and fuel sources for transforming the CO and H2 fuels into electricity via electrochemical reactions.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: January 28, 2020
    Assignee: INSTITUTE OF NUCLEAR ENERGY RESEARCH, ATOMIC ENERGY COUNCIL, EXECUTIVE YUAN, R.O.C.
    Inventors: Chang-Sing Hwang, Chun-Huang Tsai, Chun-Liang Chang, Ming-Hsiu Wu, Te-Jung Huang, Sheng-Fu Yang, Cheng-Yun Fu