Abstract: A desiccant wheel is provided to be rotatable. Through the body of the wheel or a surface adsorbent, water vapor in humid air flow is adsorbed. By passing a high-temperature air flow through the wheel, the body or surface coating is regenerated with moisture removed. Along a cross-section radial, the wheel is divided into different areas. The body has three-dimensionally inter-connected pores. The pores can be of different types. The wheel is a complete concentric cylinder or a concentric cylinder comprising equal or unequal sectors. The equal or unequal sectors are separated with each other. The wheel can rotate at a fixed speed for continually repeating a process of adsorbing, transiting, and regenerating. Thereby, drying can be carried out without causing physical or chemical change to heat-sensitive material, which also improves drying efficiency, reduces size, lowers power consumption, and helps in carbon reduction for industry.

Abstract: A method of preparing a package structure is provided, which includes providing a carrier plate including a supporting layer, a first release layer, and a first metal layer; forming a first dielectric layer over the first metal layer, the first dielectric layer having a plurality of holes, each of the holes having an end portion substantially coplanar with each other at a same plane; forming a plurality of conductive protrusions filling the holes, each of the conductive protrusions having a first end and a second end opposite thereto; forming a circuit layer structure including at least one circuit layer and at least one second dielectric layer, the circuit layer being connected to the second end, the second dielectric layer being disposed over the circuit layer; removing the carrier plate; and removing a portion of the first dielectric layer to expose the conductive protrusions. A package structure is also provided.

Abstract: A circuit carrier board includes a first substrate and a second substrate bonding to the first substrate. The first substrate includes a first circuit layer connecting to a plurality of conductive structure. The conductive structures connect to electronic elements. The second substrate contacts the first circuit layer. The second substrate includes a plurality of stacked dielectric layers, and a plurality of second circuit layers are disposed in the dielectric layers. The bottommost layer of the second circuit layers is exposed outside of the dielectric layers, and the topmost layer of the second circuit layers is electrically connected to the first circuit layer. The conductive structure includes a pad and a conductive via. The pad electrically connects to the first circuit layer. A linewidth of the first circuit layer is smaller than a linewidth of the second circuit layer. A manufacturing method of the circuit carrier board is also provided.

Abstract: Disclosed are small molecule inhibitors of ?v?6 integrin, and methods of using them to treat a number of diseases and conditions.

Abstract: A multiplexer circuit includes a first switch unit and a second switch unit. The first switch unit is electrically connected to a first data line and a first pixel circuit, and configured to turn on according to a first signal in a first time duration. The second switch unit is electrically connected to the first data line and a second pixel circuit, and configured to turn on according to a second signal in a second time duration. The first time duration and the second time duration substantially start or end at a same time, so that the first time duration and the second time duration have overlap.

Abstract: A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure.

Abstract: A circuit carrier board structure includes a first substrate, a second substrate, an adhesive layer, and a plurality of contact pads. The first substrate includes a first surface and a second surface, and also includes a plurality of first build-up layers sequentially stacked. The first build-up layers include a first dielectric layer and a first circuit layer. The second substrate includes a third surface and a fourth surface, and also includes a plurality of second build-up layers sequentially stacked. The second build-up layers include a second dielectric layer and a second circuit layer. The second surface is combined to the third surface. The connection pads are on the first surface and electrically connected to the first circuit layer. The first substrate is electrically connected to the second substrate. A manufacturing method of the circuit carrier board structure is also provided.

Abstract: A centrifugal fan is provided and includes an impeller, a motor, a first case and a second case. The motor is connected with the impeller to drive the impeller to rotate. The first case and the second case are assembled to form an accommodation space for accommodating the impeller and the motor. The first case includes a first side, a first guiding wall, a flow inlet and a flow outlet. The flow inlet is disposed on the first side, the first guiding wall is connected with the first side, and the flow outlet and the flow inlet are located at a same side of the centrifugal fan. The second case includes a second side and a second guiding wall connected with the second side. The first guiding wall and the second guiding wall are assembled to form a flow guiding channel, which has cross-sectional areas with different sizes.

Abstract: An impeller and a fan are provided. The impeller includes a hub, a plurality of first blades, a plurality of second blades and a connecting member. The plurality of first blades are disposed around the hub separately. Each first blade is connected with a periphery of the hub. The plurality of second blades are disposed around the hub separately. Each second blade is disposed away from the periphery of the hub and located between two adjacent first blades of the plurality of first blades. The connecting member is disposed around the hub and penetrated through the plurality of first blades and the plurality of second blades. The connecting member is not in contact with a first edge of any side of each first blade. The connecting member is not in contact with a second edge of any side of each second blade.

Abstract: A method of preparing a package structure is provided, which includes providing a carrier plate including a supporting layer, a first release layer, and a first metal layer; forming a first dielectric layer over the first metal layer, the first dielectric layer having a plurality of holes, each of the holes having an end portion substantially coplanar with each other at a same plane; forming a plurality of conductive protrusions filling the holes, each of the conductive protrusions having a first end and a second end opposite thereto; forming a circuit layer structure including at least one circuit layer and at least one second dielectric layer, the circuit layer being connected to the second end, the second dielectric layer being disposed over the circuit layer; removing the carrier plate; and removing a portion of the first dielectric layer to expose the conductive protrusions. A package structure is also provided.

Abstract: The present disclosure describes a method of patterning a semiconductor wafer using extreme ultraviolet lithography (EUVL). The method includes receiving an EUVL mask that includes a substrate having a low temperature expansion material, a reflective multilayer over the substrate, a capping layer over the reflective multilayer, and an absorber layer over the capping layer. The method further includes patterning the absorber layer to form a trench on the EUVL mask, wherein the trench has a first width above a target width. The method further includes treating the EUVL mask with oxygen plasma to reduce the trench to a second width, wherein the second width is below the target width. The method may also include treating the EUVL mask with nitrogen plasma to protect the capping layer, wherein the treating of the EUVL mask with the nitrogen plasma expands the trench to a third width at the target width.

Abstract: A circuit carrier board structure includes a first substrate, a second substrate, an adhesive layer, and a plurality of contact pads. The first substrate includes a first surface and a second surface, and also includes a plurality of first build-up layers sequentially stacked. The first build-up layers include a first dielectric layer and a first circuit layer. The second substrate includes a third surface and a fourth surface, and also includes a plurality of second build-up layers sequentially stacked. The second build-up layers include a second dielectric layer and a second circuit layer. The second surface is combined to the third surface. The connection pads are on the first surface and electrically connected to the first circuit layer. The first substrate is electrically connected to the second substrate. A manufacturing method of the circuit carrier board structure is also provided.

Abstract: A manufacturing method of the light-emitting diode package structure is provided. A carrier is formed. The carrier comprises a first build-up circuit. At least one self-assembled material layer is formed on the first build-up circuit. A first solder mask layer is formed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the at least one self-assembled material layer. At least one light-emitting diode is disposed on the first build-up circuit. The at least one light-emitting diode has a self-assembled pattern, and the at least one light-emitting diode is self-assembled into the at least one opening of the first solder mask layer through a force between the self-assembled pattern and the at least one self-assembled material layer.

Abstract: Disclosed are small molecule antagonists of ?4?7 integrin, and methods of using them to treat a number of specific diseases or conditions.

Abstract: Disclosed are small molecule inhibitors of ?v?6 integrin, and methods of using them to treat a number of diseases and conditions.

Abstract: A contra-rotating fan structure includes a first base, a first fan, a second base, and a second fan. The first fan is rotatably disposed on the first base and includes a first hub. The first hub has a first largest width. The second fan is rotatably disposed on the second base and includes a second hub. The second hub has a second largest width. The first base and the second base are located between the first fan and the second fan. The second largest width is greater than the first largest width.

Abstract: Disclosed are small molecule inhibitors of ?v?6 integrin, and methods of using them to treat a number of diseases and conditions.

Abstract: A keyswitch structure includes a keycap, a baseplate having a buffer space, a support movably disposed between the baseplate and the keycap, a magnetic member having a front section coupling the support, a middle section and a tail end, a magnetic unit disposed below the magnetic member, a switch film having a flexible portion extending over the buffer space. When the keycap is pressed, the support enables the magnetic member to move away from the magnetic unit, so the tail end is away from the flexible portion. When the keycap is released, a magnetic attraction force between the magnetic member and the magnetic unit enables the magnetic member to move toward the magnetic unit, so the tail end firstly contacts and pushes the flexible portion to deform toward the buffer space, and then the middle section contacts the magnetic unit to drive the support to support the keycap upward.

Abstract: A multiplexer circuit includes a first switch unit and a second switch unit. The first switch unit is electrically connected to a first data line and a first pixel circuit, and configured to turn on according to a first signal in a first time duration. The second switch unit is electrically connected to the first data line and a second pixel circuit, and configured to turn on according to a second signal in a second time duration. The first time duration and the second time duration substantially start or end at a same time, so that the first time duration and the second time duration have overlap.

Abstract: The present disclosure provides a photocurable coating composition, including: (a) a (meth)acrylate monomer or oligomer with at least four functional groups; (b) a difunctional (meth)acrylate monomer, (c) a monofunctional (meth)acrylate monomer, and (d) an initiator. The difunctional (meth)acrylate monomer is present in an amount of 30 to 70 wt % based on the total weight of the photocurable coating composition. The present disclosure also provides an optical film having a microstructure layer made from the photocurable coating composition. The optical film can be as a light guide film in a back light module of a display.