Patents by Inventor Fu YAO

Fu YAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing housing structure and housing structure
    Patent number: 10166705
    Abstract: A mold for insert molding, which houses an electronic unit including a first circuit portion and a second circuit portion protruding from the first circuit portion, is prepared. The mold includes an upper wall surface facing an upper surface of the second circuit portion and side wall surfaces facing side surfaces of the second circuit portion. The flow resistance of a resin flowing through a space between each side surface of the second circuit portion and the corresponding side wall surface is lower than that of the resin flowing through a space between the upper surface of the second circuit portion and the upper wall surface. Then, the electronic unit is placed in the mold. Then, the resin is injected into the mold in which the electronic unit has been placed. Thus, the electronic unit and the housing in which the electronic unit is housed are integrated with each other.
    Type: Grant
    Filed: April 20, 2017
    Date of Patent: January 1, 2019
    Assignee: JTEKT CORPORATION
    Inventors: Takahiro Yukimura, Noriaki Matsui, Akihiro Takeuchi, Hiroshi Kutsumi, Shoichi Koyama, Fu Yao, Toshihiro Moriuchi, Kensaku Hotta, Satoshi Haraguchi, Yuki Kosumi, Masafumi Kajitani
  • METHOD OF MANUFACTURING HOUSING STRUCTURE AND HOUSING STRUCTURE
    Publication number: 20170312955
    Abstract: A mold for insert molding, which houses an electronic unit including a first circuit portion and a second circuit portion protruding from the first circuit portion, is prepared. The mold includes an upper wall surface facing an upper surface of the second circuit portion and side wall surfaces facing side surfaces of the second circuit portion. The flow resistance of a resin flowing through a space between each side surface of the second circuit portion and the corresponding side wall surface is lower than that of the resin flowing through a space between the upper surface of the second circuit portion and the upper wall surface. Then, the electronic unit is placed in the mold. Then, the resin is injected into the mold in which the electronic unit has been placed. Thus, the electronic unit and the housing in which the electronic unit is housed are integrated with each other.
    Type: Application
    Filed: April 20, 2017
    Publication date: November 2, 2017
    Applicant: JTEKT CORPORATION
    Inventors: Takahiro YUKIMURA, Noriaki MATSUI, Akihiro TAKEUCHI, Hiroshi KUTSUMI, Shoichi KOYAMA, Fu YAO, Toshihiro MORIUCHI, Kensaku HOTTA, Satoshi HARAGUCHI, Yuki KOSUMI, Masafumi KAJITANI