Patents by Inventor Fufa Chen

Fufa Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11103898
    Abstract: The present invention discloses a method for effectively cleaning vias, trenches or recessed areas on a substrate using an ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; after the ratio of total bubbles volume to volume inside vias, trenches or recessed areas on the substrate increasing to a first set value, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after the ratio of total bubbles volume to volume inside the vias, trenches or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: August 31, 2021
    Assignee: ACM Research, Inc.
    Inventors: Hui Wang, Xi Wang, Fuping Chen, Fufa Chen, Jian Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Jun Wang, Xuejun Li
  • Patent number: 11037804
    Abstract: The present invention discloses a method for cleaning substrate without damaging patterned structure on the substrate using ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; after micro jet generated by bubble implosion and before said micro jet generated by bubble implosion damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: June 15, 2021
    Assignee: ACM Research, Inc.
    Inventors: Hui Wang, Xi Wang, Fuping Chen, Fufa Chen, Jian Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Jun Wang, Xuejun Li
  • Publication number: 20210125848
    Abstract: A method for cleaning semiconductor substrate without damaging patterned structure on the substrate using ultra/mega sonic device comprising applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; before bubble cavitation in said liquid damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned. Normally, if f1=f2, then P2 is equal to zero or much less than P1; if P1=P2, then f2 is higher than f1; if the f1<f2, then, P2 can be either equal or less than P1.
    Type: Application
    Filed: January 4, 2021
    Publication date: April 29, 2021
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Liangzhi Xie, Jun Wang, Xuejun Li
  • Publication number: 20210072645
    Abstract: A coater with automatic cleaning function and a coater automatic cleaning method. The coater (100,200,300,400,500,600,700,800) includes a coater chamber (101,201,301,401,501,601,701,801) capable of being filled up with cleaning solution, a substrate chuck (102,202,302,402,502,602,702,802) holding and positioning a substrate (103,203,303,403,503,603,703,803), and at least one shroud (108,208,308,408,508) capable of moving up for preventing photoresist from splashing out of the coater chamber (101,201,301,401,501,601,701,801), or moving down and immersing into the cleaning solution for cleaning.
    Type: Application
    Filed: October 26, 2020
    Publication date: March 11, 2021
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Hui Wang, Fuping Chen, Wenjun Wang, Hongchao Yang, Voha Nuch, Fufa Chen, Jian Wang, Xiaoyan Zhang, Shu Yang
  • Publication number: 20210035821
    Abstract: A method and an apparatus for cleaning a substrate are provided. The substrate (1010) comprises features (4034) of patterned structures. The method comprises placing the substrate on a substrate holder (1014) configured to rotate the substrate; applying cleaning liquid (1032) on the substrate; rotating the substrate by the substrate holder at a first rate when acoustic energy is being applied to the cleaning liquid by a transducer (1004); and rotating the substrate by the substrate holder at a second rate higher than the first rate when acoustic energy is not being applied to the cleaning liquid by the transducer.
    Type: Application
    Filed: January 23, 2018
    Publication date: February 4, 2021
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Hui Wang, Xi Wang, Xiaoyan Zhang, Fufa Chen, Fuping Chen
  • Publication number: 20210031243
    Abstract: A substrate (2010, 3010, 4010, 5010, 6010, 7010, 8010) cleaning method is provided, it comprises the steps of: placing a substrate (2010, 3010, 4010, 5010, 6010, 7010, 8010) on a substrate holder (1314); delivering cleaning liquid onto the surface of the substrate (2010, 3010, 4010, 5010, 6010, 7010, 8010); implementing a pre-treatment process to detach bubbles (2050, 2052, 3050, 4050, 5050, 6050, 7052, 70584, 7056, 8052, 8054, 8056) from the surface of the substrate (2010, 3010, 4010, 5010, 6010, 7010, 8010); and then implementing an ultra or mega sonic cleaning process for cleaning the substrate (2010, 3010, 4010, 5010, 6010, 7010, 8010).
    Type: Application
    Filed: January 23, 2018
    Publication date: February 4, 2021
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Hui Wang, Xi Wang, Xiaoyan Zhang, Fufa Chen
  • Patent number: 10910244
    Abstract: A method for cleaning semiconductor substrate without damaging patterned structure on the substrate using ultra/mega sonic device comprising applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; before bubble cavitation in said liquid damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned. Normally, if f1=f2, then P2 is equal to zero or much less than P1; if P1=P2, then f2 is higher than f1; if the f1<f2, then, P2 can be either equal or less than P1.
    Type: Grant
    Filed: May 20, 2015
    Date of Patent: February 2, 2021
    Assignee: ACM Research, Inc.
    Inventors: Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Liangzhi Xie, Jun Wang, Xuejun Li
  • Patent number: 10816901
    Abstract: A coater with automatic cleaning function and a coater automatic cleaning method. The coater (100,200,300,400,500,600,700,800) includes a coater chamber (101,201,301,401,501,601,701,801) capable of being filled up with cleaning solution, a substrate chuck (102,202,302,402,502,602,702,802) holding and positioning a substrate (103,203,303,403,503,603,703,803), and at least one shroud (108,208,308,408,508) capable of moving up for preventing photoresist from splashing out of the coater chamber (101,201,301,401,501,601,701,801), or moving down and immersing into the cleaning solution for cleaning.
    Type: Grant
    Filed: September 16, 2014
    Date of Patent: October 27, 2020
    Assignee: ACM Research (Shanghai) Inc.
    Inventors: Hui Wang, Fuping Chen, Wenjun Wang, Hongchao Yang, Voha Nuch, Fufa Chen, Jian Wang, Xiaoyan Zhang, Shu Yang
  • Publication number: 20200335325
    Abstract: A method for cleaning semiconductor substrate (1010,2010) without damaging patterned structure on the semiconductor substrate (1010,2010) using ultra/mega sonic device (1003,2003) comprises applying liquid into a space between a substrate (1010,2010) and an ultra/mega sonic device (1003,2003); setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive the ultra/mega sonic device (1003,2003); before bubble cavitation in the liquid damaging patterned structure on the substrate (1010,2010), setting the ultra/mega sonic power supply at zero output;after temperature inside bubble cooling down to a set temperature, setting the ultra/mega sonic power supply at frequency f1 and power P1 again; detecting power on time at power P1 and frequency f1 and power off time separately or detecting amplitude of each waveform output by the ultra/mega sonic power supply; comparing the detected power on time with a preset time ?1, or comparing the detected power off time with a preset time ?2, or comparing dete
    Type: Application
    Filed: April 6, 2016
    Publication date: October 22, 2020
    Inventors: Jun Wang, Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Liangzhi Xie, Xuejun Li
  • Patent number: 10770335
    Abstract: A substrate supporting apparatus (300) for cleaning a back side of a substrate (107) is provided. The substrate supporting apparatus (300) has a hollow shaft (319) and a rotary spindle (303). The rotary spindle (303) is set in the hollow shaft (319) and a spacing is formed between an outer wall of the rotary spindle (303) and an inner wall of the hollow shaft (319). The outer wall of the rotary spindle (303) defines a blocking wall (322) and a recess (324) to prevent particles in the spacing from entering a gas groove (325) which is formed on the hollow shaft (319) and supplies gas to a front side of the substrate (107), avoiding the particles contaminating the front side of the substrate (107), which improves the quality of semiconductor devices.
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: September 8, 2020
    Assignee: ACM Research (Shanghai) Inc.
    Inventors: Fufa Chen, Zhiyou Fang, Jun Wu, Hui Wang, Fuping Chen, Wenjun Wang
  • Publication number: 20190311938
    Abstract: A substrate supporting apparatus (300) for cleaning a back side of a substrate (107) is provided. The substrate supporting apparatus (300) has a hollow shaft (319) and a rotary spindle (303). The rotary spindle (303) is set in the hollow shaft (319) and a spacing is formed between an outer wall of the rotary spindle (303) and an inner wall of the hollow shaft (319). The outer wall of the rotary spindle (303) defines a blocking wall (322) and a recess (324) to prevent particles in the spacing from entering a gas groove (325) which is formed on the hollow shaft (319) and supplies gas to a front side of the substrate (107), avoiding the particles contaminating the front side of the substrate (107), which improves the quality of semiconductor devices.
    Type: Application
    Filed: July 6, 2016
    Publication date: October 10, 2019
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Fufa Chen, Zhiyou Fang, Jun Wu, Hui Wang, Fuping Chen, Wenjun Wang
  • Publication number: 20190287824
    Abstract: The present invention discloses a method for cleaning substrate without damaging patterned structure on the substrate using ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; after micro jet generated by bubble implosion and before said micro jet generated by bubble implosion damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned.
    Type: Application
    Filed: September 20, 2016
    Publication date: September 19, 2019
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Hui Wang, Xi Wang, Fuping Chen, Fufa Chen, Jian Wang, Xiao Zhang, YInuo Jin, Zhaowei Jia, Jun Wang, XueJun Li
  • Publication number: 20190283090
    Abstract: The present invention discloses a method for effectively cleaning vias, trenches or recessed areas on a substrate using an ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; after the ratio of total bubbles volume to volume inside vias, trenches or recessed areas on the substrate increasing to a first set value, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after the ratio of total bubbles volume to volume inside the vias, trenches or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned.
    Type: Application
    Filed: September 19, 2016
    Publication date: September 19, 2019
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Hui Wang, Xi Wang, Fuping Chen, Fufa Chen, Jian Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Jun Wang, Xuejun Li
  • Publication number: 20180151398
    Abstract: A method for cleaning semiconductor substrate without damaging patterned structure on the substrate using ultra/mega sonic device comprising applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; before bubble cavitation in said liquid damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned. Normally, if f1=f2, then P2 is equal to zero or much less than P1; if P1=P2, then f2 is higher than f1; if the f1<f2, then, P2 can be either equal or less than P1.
    Type: Application
    Filed: May 20, 2015
    Publication date: May 31, 2018
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Liangzhi Xie, Jun Wang, Xuejun Li
  • Publication number: 20180071795
    Abstract: A method for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the method comprising: delivering a cleaning liquid over a surface of a semiconductor wafer during a cleaning process; and imparting sonic energy to the cleaning liquid from a sonic transducer during the cleaning process, wherein power is alternately supplied to the sonic transducer at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, the first predetermined period of time and the second predetermined period of time consecutively following one another, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.
    Type: Application
    Filed: November 15, 2017
    Publication date: March 15, 2018
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Liangzhi Xie, Jun Wang, Xuejun Li, Xi Wang
  • Publication number: 20180071794
    Abstract: A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.
    Type: Application
    Filed: November 15, 2017
    Publication date: March 15, 2018
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xi Wang, Xiaoyan Zhang, Yinuo Jin, Zhaowei Jia, Liangzhi Xie, Jun Wang, Xuejun Li, Xi Wang
  • Publication number: 20170248848
    Abstract: A coater with automatic cleaning function and a coater automatic cleaning method. The coater (100,200,300,400,500,600,700,800) includes a coater chamber (101,201,301,401,501,601,701,801) capable of being filled up with cleaning solution, a substrate chuck (102,202,302,402,502,602,702,802) holding and positioning a substrate (103,203,303,403,503,603,703,803), and at least one shroud (108,208,308,408,508) capable of moving up for preventing photoresist from splashing out of the coater chamber (101,201,301,401,501,601,701,801), or moving down and immersing into the cleaning solution for cleaning.
    Type: Application
    Filed: September 16, 2014
    Publication date: August 31, 2017
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Hui Wang, Fuping Chen, Wenjun Wang, Hongchao Yang, Voha Nuch, Fufa Chen, Jian Wang, Xiaoyan Zhang, Shu Yang
  • Patent number: 8671961
    Abstract: An apparatus for cleaning and conditioning the surface of a semiconductor substrate such as wafer includes a rotatable chuck, a chamber, a rotatable tray for collecting cleaning solution with one or more drain outlets, multiple receptors for collecting multiple cleaning solutions, a first motor to drive chuck, and a second motor to drive the tray. The drain outlet in the tray can be positioned directly above its designated receptor located under the drain outlet. The cleaning solution collected by the tray can be guided into designated receptor. One characteristic of the apparatus is having a robust and precisely controlled cleaning solution recycle with minimum cross contamination.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: March 18, 2014
    Assignee: ACM Research (Shanghai) Inc.
    Inventors: Voha Nuch, David Wang, Yue Ma, Fufa Chen, Jian Wang, Yunwen Huang, Liangzhi Xie, Chuan He
  • Publication number: 20140034094
    Abstract: An apparatus for cleaning and conditioning the surface of a semiconductor substrate such as wafer includes a rotatable chuck, a chamber, a rotatable tray for collecting cleaning solution with one or more drain outlets, multiple receptors for collecting multiple cleaning solutions, a first motor to drive chuck, and a second motor to drive the tray. The drain outlet in the tray can be positioned directly above its designated receptor located under the drain outlet. The cleaning solution collected by the tray can be guided into designated receptor. One characteristic of the apparatus is having a robust and precisely controlled cleaning solution recycle with minimum cross contamination.
    Type: Application
    Filed: October 11, 2013
    Publication date: February 6, 2014
    Applicant: ACM Research (Shanghai) Inc.
    Inventors: Voha Nuch, David Wang, Yue Ma, Fufa Chen, Jian Wang, Yunwen Huang, Liangzhi Xie, Chuan He
  • Patent number: 8580042
    Abstract: An apparatus for cleaning and conditioning the surface of a semiconductor substrate such as wafer includes a rotatable chuck, a chamber, a rotatable tray for collecting cleaning solution with one or more drain outlets, multiple receptors for collecting multiple cleaning solutions, a first motor to drive chuck, and a second motor to drive the tray. The drain outlet in the tray can be positioned directly above its designated receptor located under the drain outlet. The cleaning solution collected by the tray can be guided into designated receptor. One characteristic of the apparatus is having a robust and precisely controlled cleaning solution recycle with minimum cross contamination.
    Type: Grant
    Filed: December 10, 2007
    Date of Patent: November 12, 2013
    Assignee: ACM Research (Shanghai) Inc.
    Inventors: Voha Nuch, David Wang, Yue Ma, Fufa Chen, Jian Wang, Yunwen Huang, Liangzhi Xie, Chuan He