Abstract: A package includes an insulating member, first electrically conductive members, and a second electrically conductive member. Each of the first electrically conductive members includes a first terminal portion that forms a part of a first surface, and a second terminal portion that is positioned on a side of a side surface with respect to the first terminal portion and forms a part of the side surface. The second electrically conductive member includes an embedded portion embedded in the insulating member, third terminal portions each of which forms a part of the first surface and is connected to the embedded portion, and a fourth terminal portion that forms a part of a second surface and is connected to the embedded portion.

Abstract: A package includes an insulating member, first electrically conductive members, and a second electrically conductive member. Each of the first electrically conductive members includes a first terminal portion that forms a part of a first surface, and a second terminal portion that is positioned on a side of a side surface with respect to the first terminal portion and forms a part of the side surface. The second electrically conductive member includes an embedded portion embedded in the insulating member, third terminal portions each of which forms a part of the first surface and is connected to the embedded portion, and a fourth terminal portion that forms a part of a second surface and is connected to the embedded portion.

Abstract: An electronic component includes an electronic device and a container containing the electronic device. The container includes a base having a first region to which the electronic device is secured and a second region around the first region, a cover facing the electronic device across a space, and a frame secured to the second region to surround the space. The frame includes a first member and a second member having a thermal conductivity lower than those of the first member and the base. The first member has first and second portions on inner and outer edge sides of the frame, respectively, on both sides of an outer edge of the base. The second member is located between the cover and the first member. A shortest distance between the first member and the base is smaller than that between the first member and the cover.

Abstract: An electronic component including an electronic device and a container accommodating the electronic device. The container includes a base portion including a first surface on which the electronic device is mounted and a second surface on an opposite side of the first surface, an opposing portion opposing the electronic device with a space in between, a frame portion surrounding the space between the base portion and the opposing portion, and a plurality of connecting portions that are positioned on the second surface and positioned in at least an orthographic projection area of the electronic device, the plurality of connecting portions being soldered to a wiring member. In the orthographic projection area of the electronic device, a thickness of the base portion in a central area is smaller than a thickness of the base portion in a peripheral area such that the second surface forms a concave surface.

Abstract: A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body.

Abstract: A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition ?L, ?F, ?B<?C is satisfied, where ?L is a thermal expansion coefficient of the lid body, ?F is a thermal expansion coefficient of the frame body, ?B is a thermal expansion coefficient of the base body, and ?C is a thermal expansion coefficient of the wiring member.

Abstract: A solid-state imaging device includes an imaging element having a light receiving surface, and a cover member disposed over and opposite to the light receiving surface of the imaging element with a space therebetween. The cover member has a quartz plate, and the optical axis of the crystal of the quartz plate is parallel to the light receiving surface.

Abstract: A base body includes a fiducial stage part provided with an inner terminal group, and an upper stage part located at a side of an outer edge of a package with respect to the fiducial stage part and protruding with respect to the fiducial stage part through a step part. A frame body is bonded to the upper stage part, and an inner edge of the frame body is located at the side of the outer edge of the package with respect to the step part.

Abstract: An electronic component includes an electronic device and a container containing the electronic device. The container includes a base having a first region to which the electronic device is secured and a second region around the first region, a cover facing the electronic device across a space, and a frame secured to the second region to surround the space. The frame includes a first member and a second member having a thermal conductivity lower than those of the first member and the base. The first member has first and second portions on inner and outer edge sides of the frame, respectively, on both sides of an outer edge of the base. The second member is located between the cover and the first member. A shortest distance between the first member and the base is smaller than that between the first member and the cover.

Abstract: A solid-state image pickup device including: a resin package which includes a recessed section; a solid-state image pickup element disposed in the recessed section; and a cover fixed to the recessed section via a fixing member so as to cover the solid-state image pickup element, wherein: the resin package includes a substrate integrated therewith; the substrate includes a first protruding section, a second protruding section and a branched section, the first and second protruding sections protruding from a first side of the resin package, and the branched section being disposed inside the resin package and disposed between the first and second protruding sections; and an outer peripheral section of the fixing member is disposed inside an end of the branched section when seen from the direction in which light is incident.

Abstract: A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition ?L, ?F, ?B<?C is satisfied, where ?L is a thermal expansion coefficient of the lid body, ?F is a thermal expansion coefficient of the frame body, ?B is a thermal expansion coefficient of the base body, and ?C is a thermal expansion coefficient of the wiring member.

Abstract: A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body.

Abstract: A base body includes a fiducial stage part provided with an inner terminal group, and an upper stage part located at a side of an outer edge of a package with respect to the fiducial stage part and protruding with respect to the fiducial stage part through a step part. A frame body is bonded to the upper stage part, and an inner edge of the frame body is located at the side of the outer edge of the package with respect to the step part.

Abstract: A solid-state imaging device includes an imaging element having a light receiving surface, and a cover member disposed over and opposite to the light receiving surface of the imaging element with a space therebetween. The cover member has a quartz plate, and the optical axis of the crystal of the quartz plate is parallel to the light receiving surface.

Abstract: A solid-state image pickup device including: a resin package which includes a recessed section; a solid-state image pickup element disposed in the recessed section; and a cover fixed to the recessed section via a fixing member so as to cover the solid-state image pickup element, wherein: the resin package includes a substrate integrated therewith; the substrate includes a first protruding section, a second protruding section and a branched section, the first and second protruding sections protruding from a first side of the resin package, and the branched section being disposed inside the resin package and disposed between the first and second protruding sections; and an outer peripheral section of the fixing member is disposed inside an end of the branched section when seen from the direction in which light is incident.

Abstract: A method for manufacturing a semiconductor device includes mounting a first chip over a first area of a chip mounting section of a lead frame and mounting a second chip over a second area of the chip mounting section, wherein the second area is adjacent to the first area via the slit. The chip mounting section is disposed on a flat heating jig. First pads of the first chip are connected with second pads of the second chip via first wires, respectively, and the first pads are connected with leads of the lead frame via second wires, respectively. the first chip, the second chip, the first wires and the second wires are sealed with a resin such that a part of each of the leads is exposed from the resin, and each of the leads is then separated from the lead frame.

Abstract: Improvement in the reliability of a semiconductor device is aimed at. By heating a lead frame, after preparing a lead frame with a tape, until a resin molding is performed, at the temperature 160 to 300° C. (preferably 180 to 300° C.) for a total of more than 2 minutes in the atmosphere which has oxygen, crosslinkage density becoming high in resin of adhesives, a low molecular compound volatilizes and jumps out outside, therefore as a result, since a low molecular compound does not remain in resin of adhesives, the generation of copper migration can be prevented.

Abstract: A method for manufacturing a semiconductor device includes mounting a first chip over a first area of a chip mounting section of a lead frame and mounting a second chip over a second area of the chip mounting section, wherein the second area is adjacent to the first area via the slit. The chip mounting section is disposed on a flat heating jig. First pads of the first chip are connected with second pads of the second chip via first wires, respectively, and the first pads are connected with leads of the lead frame via second wires, respectively, the first chip, the second chip, the first wires and the second wires are sealed with a resin such that a part of each of the leads is exposed from the resin, and each of the leads is then separated from the lead frame.

Abstract: A method for manufacturing a semiconductor device includes mounting a first chip over a first area of a chip mounting section of a lead frame and mounting a second chip over a second area of the chip mounting section, wherein the second area is adjacent to the first area via the slit. The chip mounting section is disposed on a flat heating jig. First pads of the first chip are connected with second pads of the second chip via first wires, respectively, and the first pads are connected with leads of the lead frame via second wires, respectively. the first chip, the second chip, the first wires and the second wires are sealed with a resin such that a part of each of the leads is exposed from the resin, and each of the leads is then separated from the lead frame.

Abstract: A method for analysis of solvent evaporation patterns includes: continuously evacuating the gas of a single-component or multicomponent solvent evaporated under desired evaporation conditions from an object containing the single-component or multicomponent solvent housed in an airtight container, with evacuation means from the airtight container to an exhaust path connected to an exhaust port of the evacuation means; sampling a gas at predetermined time intervals from a desired point between the airtight container and the outlet of the exhaust path with the continuous evacuation maintained; measuring the solvent gas contained in the sampled gas; and determining an evaporation pattern of the solvent from the object under the desired evaporation conditions, from results of the measurement.