Patents by Inventor Fujio Ito

Fujio Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9978675
    Abstract: A package includes an insulating member, first electrically conductive members, and a second electrically conductive member. Each of the first electrically conductive members includes a first terminal portion that forms a part of a first surface, and a second terminal portion that is positioned on a side of a side surface with respect to the first terminal portion and forms a part of the side surface. The second electrically conductive member includes an embedded portion embedded in the insulating member, third terminal portions each of which forms a part of the first surface and is connected to the embedded portion, and a fourth terminal portion that forms a part of a second surface and is connected to the embedded portion.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: May 22, 2018
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Takanori Suzuki, Fujio Ito, Tadashi Kosaka, Takao Toyooka, Koji Tsuduki, Yasushi Kurihara, Ikuto Kimura
  • Publication number: 20170150601
    Abstract: A package includes an insulating member, first electrically conductive members, and a second electrically conductive member. Each of the first electrically conductive members includes a first terminal portion that forms a part of a first surface, and a second terminal portion that is positioned on a side of a side surface with respect to the first terminal portion and forms a part of the side surface. The second electrically conductive member includes an embedded portion embedded in the insulating member, third terminal portions each of which forms a part of the first surface and is connected to the embedded portion, and a fourth terminal portion that forms a part of a second surface and is connected to the embedded portion.
    Type: Application
    Filed: November 14, 2016
    Publication date: May 25, 2017
    Inventors: Takanori Suzuki, Fujio Ito, Tadashi Kosaka, Takao Toyooka, Koji Tsuduki, Yasushi Kurihara, Ikuto Kimura
  • Patent number: 9585287
    Abstract: An electronic component includes an electronic device and a container containing the electronic device. The container includes a base having a first region to which the electronic device is secured and a second region around the first region, a cover facing the electronic device across a space, and a frame secured to the second region to surround the space. The frame includes a first member and a second member having a thermal conductivity lower than those of the first member and the base. The first member has first and second portions on inner and outer edge sides of the frame, respectively, on both sides of an outer edge of the base. The second member is located between the cover and the first member. A shortest distance between the first member and the base is smaller than that between the first member and the cover.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: February 28, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yu Katase, Fujio Ito, Tadashi Kosaka, Koji Tsuduki, Ichiro Kataoka
  • Publication number: 20160366774
    Abstract: An electronic component including an electronic device and a container accommodating the electronic device. The container includes a base portion including a first surface on which the electronic device is mounted and a second surface on an opposite side of the first surface, an opposing portion opposing the electronic device with a space in between, a frame portion surrounding the space between the base portion and the opposing portion, and a plurality of connecting portions that are positioned on the second surface and positioned in at least an orthographic projection area of the electronic device, the plurality of connecting portions being soldered to a wiring member. In the orthographic projection area of the electronic device, a thickness of the base portion in a central area is smaller than a thickness of the base portion in a peripheral area such that the second surface forms a concave surface.
    Type: Application
    Filed: June 8, 2016
    Publication date: December 15, 2016
    Inventors: Shin Hasegawa, Fujio Ito, Takanori Suzuki, Takao Toyoka, Tadashi Kosaka, Yasushi Kurihara, Koji Tsuduki
  • Patent number: 9253922
    Abstract: A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: February 2, 2016
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Hisatane Komori, Yasushi Kurihara, Fujio Ito, Kazuya Notsu
  • Patent number: 9220172
    Abstract: A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition ?L, ?F, ?B<?C is satisfied, where ?L is a thermal expansion coefficient of the lid body, ?F is a thermal expansion coefficient of the frame body, ?B is a thermal expansion coefficient of the base body, and ?C is a thermal expansion coefficient of the wiring member.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: December 22, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
  • Patent number: 9171874
    Abstract: A solid-state imaging device includes an imaging element having a light receiving surface, and a cover member disposed over and opposite to the light receiving surface of the imaging element with a space therebetween. The cover member has a quartz plate, and the optical axis of the crystal of the quartz plate is parallel to the light receiving surface.
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: October 27, 2015
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Takanori Suzuki, Fujio Ito
  • Patent number: 9155212
    Abstract: A base body includes a fiducial stage part provided with an inner terminal group, and an upper stage part located at a side of an outer edge of a package with respect to the fiducial stage part and protruding with respect to the fiducial stage part through a step part. A frame body is bonded to the upper stage part, and an inner edge of the frame body is located at the side of the outer edge of the package with respect to the step part.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: October 6, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
  • Publication number: 20150116946
    Abstract: An electronic component includes an electronic device and a container containing the electronic device. The container includes a base having a first region to which the electronic device is secured and a second region around the first region, a cover facing the electronic device across a space, and a frame secured to the second region to surround the space. The frame includes a first member and a second member having a thermal conductivity lower than those of the first member and the base. The first member has first and second portions on inner and outer edge sides of the frame, respectively, on both sides of an outer edge of the base. The second member is located between the cover and the first member. A shortest distance between the first member and the base is smaller than that between the first member and the cover.
    Type: Application
    Filed: October 21, 2014
    Publication date: April 30, 2015
    Inventors: Yu Katase, Fujio Ito, Tadashi Kosaka, Koji Tsuduki, Ichiro Kataoka
  • Patent number: 8792031
    Abstract: A solid-state image pickup device including: a resin package which includes a recessed section; a solid-state image pickup element disposed in the recessed section; and a cover fixed to the recessed section via a fixing member so as to cover the solid-state image pickup element, wherein: the resin package includes a substrate integrated therewith; the substrate includes a first protruding section, a second protruding section and a branched section, the first and second protruding sections protruding from a first side of the resin package, and the branched section being disposed inside the resin package and disposed between the first and second protruding sections; and an outer peripheral section of the fixing member is disposed inside an end of the branched section when seen from the direction in which light is incident.
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: July 29, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventors: Katsuhisa Mochiduki, Takanori Suzuki, Fujio Ito
  • Publication number: 20130286592
    Abstract: A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body.
    Type: Application
    Filed: April 24, 2013
    Publication date: October 31, 2013
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Hisatane Komori, Yasushi Kurihara, Fujio Ito, Kazuya Notsu
  • Publication number: 20130286565
    Abstract: A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition ?L, ?F, ?B<?C is satisfied, where ?L is a thermal expansion coefficient of the lid body, ?F is a thermal expansion coefficient of the frame body, ?B is a thermal expansion coefficient of the base body, and ?C is a thermal expansion coefficient of the wiring member.
    Type: Application
    Filed: April 24, 2013
    Publication date: October 31, 2013
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
  • Publication number: 20130286566
    Abstract: A base body includes a fiducial stage part provided with an inner terminal group, and an upper stage part located at a side of an outer edge of a package with respect to the fiducial stage part and protruding with respect to the fiducial stage part through a step part. A frame body is bonded to the upper stage part, and an inner edge of the frame body is located at the side of the outer edge of the package with respect to the step part.
    Type: Application
    Filed: April 24, 2013
    Publication date: October 31, 2013
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
  • Publication number: 20110205414
    Abstract: A solid-state image pickup device including: a resin package which includes a recessed section; a solid-state image pickup element disposed in the recessed section; and a cover fixed to the recessed section via a fixing member so as to cover the solid-state image pickup element, wherein: the resin package includes a substrate integrated therewith; the substrate includes a first protruding section, a second protruding section and a branched section, the first and second protruding sections protruding from a first side of the resin package, and the branched section being disposed inside the resin package and disposed between the first and second protruding sections; and an outer peripheral section of the fixing member is disposed inside an end of the branched section when seen from the direction in which light is incident.
    Type: Application
    Filed: February 23, 2011
    Publication date: August 25, 2011
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Katsuhisa Mochiduki, Takanori Suzuki, Fujio Ito
  • Publication number: 20110205413
    Abstract: A solid-state imaging device includes an imaging element having a light receiving surface, and a cover member disposed over and opposite to the light receiving surface of the imaging element with a space therebetween. The cover member has a quartz plate, and the optical axis of the crystal of the quartz plate is parallel to the light receiving surface.
    Type: Application
    Filed: February 23, 2011
    Publication date: August 25, 2011
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Takanori Suzuki, Fujio Ito
  • Patent number: 7998795
    Abstract: A method for manufacturing a semiconductor device includes mounting a first chip over a first area of a chip mounting section of a lead frame and mounting a second chip over a second area of the chip mounting section, wherein the second area is adjacent to the first area via the slit. The chip mounting section is disposed on a flat heating jig. First pads of the first chip are connected with second pads of the second chip via first wires, respectively, and the first pads are connected with leads of the lead frame via second wires, respectively. the first chip, the second chip, the first wires and the second wires are sealed with a resin such that a part of each of the leads is exposed from the resin, and each of the leads is then separated from the lead frame.
    Type: Grant
    Filed: June 17, 2010
    Date of Patent: August 16, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Fujio Ito, Hiromichi Suzuki, Akihiko Kameoka, Noriaki Sakamoto
  • Patent number: 7989267
    Abstract: Improvement in the reliability of a semiconductor device is aimed at. By heating a lead frame, after preparing a lead frame with a tape, until a resin molding is performed, at the temperature 160 to 300° C. (preferably 180 to 300° C.) for a total of more than 2 minutes in the atmosphere which has oxygen, crosslinkage density becoming high in resin of adhesives, a low molecular compound volatilizes and jumps out outside, therefore as a result, since a low molecular compound does not remain in resin of adhesives, the generation of copper migration can be prevented.
    Type: Grant
    Filed: April 16, 2008
    Date of Patent: August 2, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Fujio Ito, Hiromichi Suzuki, Akihiko Kameoka, Junpei Kusukawa, Yoshitaka Takezawa
  • Publication number: 20100255639
    Abstract: A method for manufacturing a semiconductor device includes mounting a first chip over a first area of a chip mounting section of a lead frame and mounting a second chip over a second area of the chip mounting section, wherein the second area is adjacent to the first area via the slit. The chip mounting section is disposed on a flat heating jig. First pads of the first chip are connected with second pads of the second chip via first wires, respectively, and the first pads are connected with leads of the lead frame via second wires, respectively, the first chip, the second chip, the first wires and the second wires are sealed with a resin such that a part of each of the leads is exposed from the resin, and each of the leads is then separated from the lead frame.
    Type: Application
    Filed: June 17, 2010
    Publication date: October 7, 2010
    Inventors: Fujio Ito, Hiromichi Suzuki, Akihiko Kameoka, Noriaki Sakamoto
  • Patent number: 7772044
    Abstract: A method for manufacturing a semiconductor device includes mounting a first chip over a first area of a chip mounting section of a lead frame and mounting a second chip over a second area of the chip mounting section, wherein the second area is adjacent to the first area via the slit. The chip mounting section is disposed on a flat heating jig. First pads of the first chip are connected with second pads of the second chip via first wires, respectively, and the first pads are connected with leads of the lead frame via second wires, respectively. the first chip, the second chip, the first wires and the second wires are sealed with a resin such that a part of each of the leads is exposed from the resin, and each of the leads is then separated from the lead frame.
    Type: Grant
    Filed: November 3, 2008
    Date of Patent: August 10, 2010
    Assignee: Renesas Technology Corp.
    Inventors: Fujio Ito, Hiromichi Suzuki, Akihiko Kameoka, Noriaki Sakamoto
  • Patent number: 7758317
    Abstract: A method for analysis of solvent evaporation patterns includes: continuously evacuating the gas of a single-component or multicomponent solvent evaporated under desired evaporation conditions from an object containing the single-component or multicomponent solvent housed in an airtight container, with evacuation means from the airtight container to an exhaust path connected to an exhaust port of the evacuation means; sampling a gas at predetermined time intervals from a desired point between the airtight container and the outlet of the exhaust path with the continuous evacuation maintained; measuring the solvent gas contained in the sampled gas; and determining an evaporation pattern of the solvent from the object under the desired evaporation conditions, from results of the measurement.
    Type: Grant
    Filed: September 8, 2004
    Date of Patent: July 20, 2010
    Assignee: Astellas Pharma Inc.
    Inventors: Koji Mukai, Fujio Ito, Satoru Takahashi