Abstract: The present disclosure relates to a thermal management apparatus used to manage temperature of components mounted to a circuit substrate, such as electronic or optical components. The apparatus includes a heat dissipation structure that includes at least one protrusion extending from a surface of the heat dissipation structure. A carrier structure is also included and engages with the heat dissipation structure. The carrier structure includes an aperture that receives the at least one protrusion. Additionally, the apparatus includes at least one biasing structure that is configured to allow movement of the heat dissipation structure relative to the carrier structure and provides a biasing force tending to move the heat dissipation structure and carrier structure together.

Abstract: A thermal management device for a circuit substrate having at least a first heat generating component and at least a second heat generating component, the thermal management device includes a first thermal spreader and a second thermal spreader. The second thermal spreader is mountable to the circuit substrate to thermally couple with the second heat generating component. Additionally, the second thermal spreader is adapted to couple to the first thermal spreader to thermally couple the first thermal spreader to the first heat generating component when the second thermal spreader is mounted to the circuit substrate. The thermal management device also includes a bias device that is coupled to the first thermal spreader and the second thermal spreader and is adapted to maintain the thermal coupling between the first thermal spreader and the first heat generating component when the second thermal spreader is mounted to the circuit substrate.

Abstract: A semiconductor device includes a die, a substrate, a heat spreader and a plurality of signal interconnects extending from the die. The heat spreader has a base and a plurality of fins. The heat spreader is mounted on the substrate in such a way that the base of the head spreader is in thermal communication with the die. The fins protrude downwardly into the substrate conducting heat away from the die and into the substrate.

Abstract: A localized refrigerator apparatus for a thermal management device includes a chamber having an evaporation portion and a condensation portion. The evaporation portion is adapted to thermally couple to a heat generating device. A fluid housed in the chamber and is adapted to facilitate heat transfer between the evaporation portion and the condensation portion by an evaporation and condensation cycle. The thermal management device also includes a thermoelectric cooler thermally coupled to the condensation portion.

Abstract: A device to thermally couple a thermal management apparatus to at least one heat generating component of a circuit substrate includes at least a first portion that is adapted to couple to the thermal management apparatus, and at least a second portion that is adapted to couple to the thermal management apparatus. The first portion and the second portion may be symmetrically arranged relative to each other. The first portion and the second portion are adapted to thermally couple the thermal management apparatus to the heat generating component with a first spring bias. The first portion and the second portion are further adapted to maintain the thermal management apparatus thermally coupled to the heat generating component with a second spring bias.

Abstract: The present disclosure relates to thermal management apparatus for a circuit substrate having heat generating components mounted on one or both sides thereof. The apparatus and method includes a circuit assembly having a first thermally conductive layer disposed on each side of the circuit substrate and being thermally coupled to one or more heat generating components of the circuit substrate. The apparatus and method includes a second thermally conductive layer disposed on each side of the circuit substrate and being thermally coupled to the first thermally conductive layer. The first thermally conductive layer and the thermally conductive layer can be shaped, sized, and/or configured to provide cooling of the one or more heat generating components disposed on each side of the circuit substrate by transferring and spreading the heat to the outside of the circuit assembly.

Abstract: The present disclosure relates to a thermal management apparatus used to manage temperature of components mounted to a circuit substrate, such as electronic or optical components. The apparatus includes a heat dissipation structure that includes at least one protrusion extending from a surface of the heat dissipation structure. A carrier structure is also included and engages with the heat dissipation structure. The carrier structure includes an aperture that receives the at least one protrusion. Additionally, the apparatus includes at least one biasing structure that is configured to allow movement of the heat dissipation structure relative to the carrier structure and provides a biasing force tending to move the heat dissipation structure and carrier structure together.

Abstract: A field reconfigurable muxponder for use in an optical transport system. The muxponder includes one or more tributary cards, where each tributary card is adapted to receive an optical data signal and conditions the optical data signal into an intermediate data signal constituted in accordance with a tributary interface format. In this way, the muxponder is able to aggregate optical data signals having different protocols and/or different data rates. The muxponder further includes a chassis that is adapted to receive a predefined number of tributary cards and outputs an optical system signal independently from the availability of the optical data signals from the tributary cards. The tributary cards and the chassis integrally form one line card.

Abstract: A field reconfigurable muxponder for use in an optical transport system. The muxponder includes one or more tributary cards, where each tributary card is adapted to receive an optical data signal and conditions the optical data signal into an intermediate data signal constituted in accordance with a tributary interface format. In this way, the muxponder is able to aggregate optical data signals having different protocols and/or different data rates. The muxponder further includes a chassis that is adapted to receive a predefined number of tributary cards and outputs an optical system signal independently from the availability of the optical data signals from the tributary cards. The tributary cards and the chassis integrally form one line card.

Abstract: A field reconfigurable muxponder for use in an optical transport system. The muxponder includes one or more tributary cards, where each tributary card is adapted to receive an optical data signal and conditions the optical data signal into an intermediate data signal constituted in accordance with a tributary interface format. In this way, the muxponder is able to aggregate optical data signals having different protocols and/or different data rates. The muxponder further includes a chassis that is adapted to receive a predefined number of tributary cards and outputs an optical system signal independently from the availability of the optical data signals from the tributary cards. The tributary cards and the chassis integrally form one line card.