Patents by Inventor Gang Mao

Gang Mao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11958870
    Abstract: An asymmetric tetradentate metal complex of a N{circumflex over (?)}C{circumflex over (?)}C{circumflex over (?)}N comprising tetradentate ligand has a metal connected to binding sites which are connected to each other via three or four covalent bonds that can be either single or double bonds with bridging linkers reside between C{circumflex over (?)}C and C{circumflex over (?)}N moieties. These linkers result in three-dimension metal complexes with distorted square planar geometries. The four donor atoms coordinate to a metal center. Upon metal binding a 5-6-6 membered metallocycle is formed upon chelation including a first nitrogen donor bond, a first metal-carbon bond, a second metal-carbon bond, and a second nitrogen donor bond. The light emission from these metal complexes can be tuned by the ligand structure over the entire visible spectrum.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: April 16, 2024
    Assignee: The University of Hong Kong
    Inventors: Chi Ming Che, Wai Hung Ang, Mao Mao, Gang Cheng
  • Publication number: 20230125020
    Abstract: An antenna device includes a differential-line, a first metal and a second metal. The differential-line includes a first line and a second line. The first metal and second metal are coupled to the first line and second line respectively. The first metal and second metal have different shapes and/or different sizes. The first metal and second metal form symmetric or asymmetric dipole. The first metal and second metal can be disposed on the same plane or different planes, can be electrically insulated and can have a first slot and a second slot respectively. The antenna device can further include a base coupled to the first line and second line. The base can be a daughter board having a front-end module or not. The IC package in daughter board can have different sizes. The daughter board can be offset by different distances and can be coupled to a mother board.
    Type: Application
    Filed: September 27, 2022
    Publication date: April 20, 2023
    Applicant: iWave Technologies Co., Ltd.
    Inventors: Chong-Yi LIOU, Wei-Ting TSAI, Jin-Feng NEO, Zheng-An PENG, Tsu-Yu LO, Zhi-Yao HONG, Tso-An SHANG, Je-Yao CHANG, Chien-Bang CHEN, Shih-Ping HUANG, Shau-Gang MAO
  • Patent number: 11438992
    Abstract: A non-common-ground bandpass filter circuit with electrostatic discharge (ESD) protection is disclosed. The non-common-ground bandpass filter circuit with ESD protection includes a non-common-ground plane, a dielectric substrate and a conductor. The conductor is disposed above the non-common-ground plane. The dielectric substrate is disposed between the conductor and the non-common-ground plane. The non-common-ground plane at least has a first ground region and a second ground region separated and insulated from each other. The first ground region corresponds to a first terminal of the conductor and the second ground region corresponds to a second terminal of the conductor. When an ESD event occurs on one of the first ground region and the second ground region, the other of the first ground region and the second ground region will not be damaged by the ESD event. The non-common-ground bandpass filter circuit also provides surge protection.
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: September 6, 2022
    Assignee: iWave Technologies Co., Ltd.
    Inventors: Shau-Gang Mao, Chong-Yi Liou, Wei-Ting Tsai, Ting-Wei Wu, Yu-Yao Chen, Jin-Feng Neo, Zheng-An Peng, Tsu-Yu Lo, Je-Yao Chang, Chien-Bang Chen, Shih-Ping Huang
  • Patent number: 11246010
    Abstract: A positioning and tracking system is disclosed. The positioning and tracking system includes positioning sensors disposed in a space, wherein the positioning sensors are all movable and all have functions of sensing distance, angle and time, and the positioning sensors communicate with each other to sense relative distances, relative angles and relative times between every two positioning sensors of the positioning sensors. when at least one of the positioning sensors moves in the space, the positioning sensors re-communicate with each other to instantly update the relative distances, the relative angles and the relative times between every two positioning sensors of the positioning sensors.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: February 8, 2022
    Assignee: IWAVE TECHNOLOGIES CO., LTD.
    Inventors: Shau-Gang Mao, Chong-Yi Liou, Wei-Ting Tsai, Ting-Wei Wu, Yu-Yao Chen, Jin-Feng Neo, Zheng-An Peng, Tsu-Yu Lo, Je-Yao Chang, Chien-Bang Chen, Shih-Ping Huang
  • Patent number: 11018632
    Abstract: An envelope tracking power amplifier module and an envelope tracking method are provided. The envelope tracking power amplifier module includes a power amplifier and a linear amplifier coupled to the power amplifier and configured to receive and amplify an envelope signal and provide the amplified envelope signal to the power amplifier. The power amplifier is configured to receive and amplify a signal according to the amplified envelope signal. The envelope tracking method includes: providing a signal to the power amplifier; deriving an envelope phase of the signal, the envelope phase corresponding to an output power of the power amplifier; providing an envelope signal including the envelope phase to the envelope tracking module; the envelope tracking module providing the amplified envelope signal to the power amplifier; and the power amplifier amplifying the signal according to the amplified envelope signal and outputting the amplified signal at the output power.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: May 25, 2021
    Assignee: IWAVE TECHNOLOGIES CO., LTD.
    Inventors: Shau-Gang Mao, Chong-Yi Liou, Wei-Ting Tsai, Yu-Yao Chen, Zheng-An Peng, Shih-Ping Huang, Chien-Bang Chen
  • Publication number: 20210067915
    Abstract: A positioning and tracking system is disclosed. The positioning and tracking system includes positioning sensors disposed in a space, wherein the positioning sensors are all movable and all have functions of sensing distance, angle and time, and the positioning sensors communicate with each other to sense relative distances, relative angles and relative times between every two positioning sensors of the positioning sensors. when at least one of the positioning sensors moves in the space, the positioning sensors re-communicate with each other to instantly update the relative distances, the relative angles and the relative times between every two positioning sensors of the positioning sensors.
    Type: Application
    Filed: September 2, 2020
    Publication date: March 4, 2021
    Applicant: iWave Technologies Co., Ltd.
    Inventors: Shau-Gang MAO, Chong-Yi LIOU, Wei-Ting TSAI, Ting-Wei WU, Yu-Yao CHEN, Jin-Feng NEO, Zheng-An PENG, Tsu-Yu LO, Je-Yao CHANG, Chien-Bang CHEN, Shih-Ping HUANG
  • Publication number: 20210068239
    Abstract: A non-common-ground bandpass filter circuit with electrostatic discharge (ESD) protection is disclosed. The non-common-ground bandpass filter circuit with ESD protection includes a non-common-ground plane, a dielectric substrate and a conductor. The conductor is disposed above the non-common-ground plane. The dielectric substrate is disposed between the conductor and the non-common-ground plane. The non-common-ground plane at least has a first ground region and a second ground region separated and insulated from each other. The first ground region corresponds to a first terminal of the conductor and the second ground region corresponds to a second terminal of the conductor. When an ESD event occurs on one of the first ground region and the second ground region, the other of the first ground region and the second ground region will not be damaged by the ESD event. The non-common-ground bandpass filter circuit also provides surge protection.
    Type: Application
    Filed: August 24, 2020
    Publication date: March 4, 2021
    Applicant: iWave Technologies Co., Ltd.
    Inventors: Shau-Gang MAO, Chong-Yi LIOU, Wei-Ting TSAI, Ting-Wei WU, Yu-Yao CHEN, Jin-Feng NEO, Zheng-An PENG, Tsu-Yu LO, Je-Yao CHANG, Chien-Bang CHEN, Shih-Ping HUANG
  • Publication number: 20210036664
    Abstract: An envelope tracking power amplifier module and an envelope tracking method are provided. The envelope tracking power amplifier module includes a power amplifier and a linear amplifier coupled to the power amplifier and configured to receive and amplify an envelope signal and provide the amplified envelope signal to the power amplifier. The power amplifier is configured to receive and amplify a signal according to the amplified envelope signal. The envelope tracking method includes: providing a signal to the power amplifier; deriving an envelope phase of the signal, the envelope phase corresponding to an output power of the power amplifier; providing an envelope signal including the envelope phase to the envelope tracking module; the envelope tracking module providing the amplified envelope signal to the power amplifier; and the power amplifier amplifying the signal according to the amplified envelope signal and outputting the amplified signal at the output power.
    Type: Application
    Filed: August 1, 2019
    Publication date: February 4, 2021
    Applicant: iWave Technologies Co., Ltd.
    Inventors: Shau-Gang Mao, Chong-Yi Liou, Wei-Ting Tsai, Yu-Yao Chen, Zheng-An Peng, Shih-Ping Huang, Chien-Bang Chen
  • Patent number: 10904779
    Abstract: The present invention provides an antenna structure, an antenna device and a wireless localization method. The antenna structure includes a first radiation unit including a plurality of first connecting portions and a plurality of first annular radiation portions, a second radiation unit including a plurality of second connecting portions and a plurality of second annular radiation portions, a first conductive wire and a plurality of second conductive wires. A first end of each first annular radiation portion is connected to the first connecting portion, and the second end thereof extends towards the first end of the adjacent first annular radiation portion. A first end of each second annular radiation portion is connected to the second connecting portion, and the second end thereof extends towards the first end of the adjacent second annular radiation portion.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: January 26, 2021
    Assignee: iWAVE TECHNOLOGIES CO., LTD.
    Inventors: Shau-Gang Mao, Chong-Yi Liou, Yu-Yao Chen, Wei-Ting Tsai, Shih-Ping Huang, Ming-Chih Kuan, Chien-Bang Chen, Zheng-An Peng
  • Publication number: 20200307784
    Abstract: The present invention provides an unmanned aerial vehicle and an unmanned aerial vehicle controlling system. The unmanned aerial vehicle controlling system includes the unmanned aerial vehicle and a controller. The unmanned aerial vehicle has a body, a first localization module and a second localization module. The first localization module and the second localization module are disposed on the body respectively facing a first direction and a second direction. The controller is used for sending a localization signal to the first localization module and a second localization module. The unmanned aerial vehicle controls the direction that the body faces and the distance between the unmanned aerial vehicle and the controller.
    Type: Application
    Filed: March 25, 2019
    Publication date: October 1, 2020
    Inventors: Ruey-Beei Wu, Shau-Gang Mao
  • Patent number: 10763580
    Abstract: A real-time data transmission system includes an aerial device and a base station. The aerial device has a first antenna module transmitting data in a frequency band with wide-bandwidth and high-speed transmission characteristics. The base station includes a second antenna module configured to receive data from the first antenna module of the aerial device in the frequency band. The radiation direction of the second antenna is adjustable in accordance with the position of the aerial device.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: September 1, 2020
    Assignee: PSJ INTERNATIONAL LTD.
    Inventors: Ruey-Beei Wu, Shau-Gang Mao
  • Publication number: 20200162947
    Abstract: The present invention provides an antenna structure, an antenna device and a wireless localization method. The antenna structure includes a first radiation unit including a plurality of first connecting portions and a plurality of first annular radiation portions, a second radiation unit including a plurality of second connecting portions and a plurality of second annular radiation portions, a first conductive wire and a plurality of second conductive wires. A first end of each first annular radiation portion is connected to the first connecting portion, and the second end thereof extends towards the first end of the adjacent first annular radiation portion. A first end of each second annular radiation portion is connected to the second connecting portion, and the second end thereof extends towards the first end of the adjacent second annular radiation portion.
    Type: Application
    Filed: November 14, 2019
    Publication date: May 21, 2020
    Applicant: iWave Technologies Co., Ltd.
    Inventors: Shau-Gang Mao, Chong-Yi Liou, Yu-Yao Chen, Wei-Ting Tsai, Shih-Ping Huang, Ming-Chih Kuan, Chien-Bang Chen, Zheng-An Peng
  • Patent number: 10389308
    Abstract: An envelope tracking frontend device and a switch thereof are provided. The envelope tracking frontend device includes a power amplifier coupled, a switch and an envelope tracking module including an envelope tracking bias supply coupled between the signal generator and the switch. The switch includes a transmit-receive port, a transmit port coupled to the power amplifier, a receive port, a first terminal and a second terminal in series connection, and a third transistor and a fourth transistor as shunt transistors. The envelope tracking bias supply is configured to provide an envelope forward bias signal to the gate of the second transistor and the gate of the fourth transistor, and provide an envelope reverse bias signal to the gate of the first transistor and the gate of the third transistor such that an amplified signal is modulated before being provided by the switch.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: August 20, 2019
    Assignee: PSJ INTERNATIONAL LTD.
    Inventor: Shau-Gang Mao
  • Publication number: 20190164845
    Abstract: The present disclosure relates to the technical field of semiconductor processes, and discloses a semiconductor device and a manufacturing method therefor.
    Type: Application
    Filed: January 31, 2019
    Publication date: May 30, 2019
    Applicants: Semiconductor Manufacturing International (Shangha i) Corporation, SMIC Advanced Technology Research & Development (S hanghai) Corporation, IMEC International
    Inventors: Hai Zhao, Yang Liu, Gang Mao, Cheng-Jui Yang, Yongmeng Lee, Shaofeng Yu
  • Patent number: 10236216
    Abstract: The present disclosure relates to the technical field of semiconductor processes, and discloses a semiconductor device and a manufacturing method therefor. The semiconductor device includes a substrate; two fins located on the substrate and extending along a first direction; an isolation material layer surrounding the fins, comprising a first isolation regions located at an end region between the two fins along the first direction, and a second isolation region located at sides of the fins along a second direction that is different from the first direction, wherein an upper surface of the first isolation region substantially align with an upper surfaces of the fins, and an upper surface of the second isolation region is lower than the upper surface of the fins; and a first insulating layer on the first isolation region.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: March 19, 2019
    Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORP., SMIC ADVANCED TECHNOLOGY RESEARCH & DEVELOPMENT (SHANGHAI) Corp., IMEC INTERNATIONAL
    Inventors: Hai Zhao, Yang Liu, Gang Mao, Cheng-Jui Yang, Yongmeng Lee, Shaofeng Yu
  • Publication number: 20190006996
    Abstract: An envelope tracking frontend device and a switch thereof are provided. The envelope tracking frontend device includes a power amplifier coupled, a switch and an envelope tracking module including an envelope tracking bias supply coupled between the signal generator and the switch. The switch includes a transmit-receive port, a transmit port coupled to the power amplifier, a receive port, a first terminal and a second terminal in series connection, and a third transistor and a fourth transistor as shunt transistors. The envelope tracking bias supply is configured to provide an envelope forward bias signal to the gate of the second transistor and the gate of the fourth transistor, and provide an envelope reverse bias signal to the gate of the first transistor and the gate of the third transistor such that an amplified signal is modulated before being provided by the switch.
    Type: Application
    Filed: February 15, 2018
    Publication date: January 3, 2019
    Inventor: SHAU-GANG MAO
  • Patent number: 10121880
    Abstract: The present disclosure provides fin field-effect transistors and fabrication methods thereof. An exemplary fabrication process includes providing a substrate having a first region and a second region; forming first fins in the first region and second fins in the second region; forming a liner oxide layer on side surfaces of the first fins, the second fins and a surface of the substrate; forming an insulating barrier layer on the liner oxide layer in the first region; forming a precursor material layer on the insulating barrier layer in the first region and on the liner oxide layer in the second region; performing a curing annealing process to convert the precursor material into an insulation layer; and removing a top portion of the insulation layer to form an isolating layer and removing portions of the liner oxide layer, the insulating barrier layer, the first oxide layer and the second oxide layer.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: November 6, 2018
    Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
    Inventor: Gang Mao
  • Publication number: 20180294563
    Abstract: A real-time data transmission system includes an aerial device and a base station. The aerial device has a first antenna module transmitting data in a frequency band with wide-bandwidth and high-speed transmission characteristics. The base station includes a second antenna module configured to receive data from the first antenna module of the aerial device in the frequency band. The radiation direction of the second antenna is adjustable in accordance with the position of the aerial device.
    Type: Application
    Filed: March 27, 2018
    Publication date: October 11, 2018
    Inventors: RUEY-BEEI WU, SHAU-GANG MAO
  • Patent number: 10091627
    Abstract: Message handshaking and integration may be provided. A message may be created by a client in a first format. The client may determine whether a server in communication with the client is operable to deliver the message in a second format. If so, the client may provide the message, in the first format, to the server for delivering to at least one recipient in the second format.
    Type: Grant
    Filed: March 23, 2010
    Date of Patent: October 2, 2018
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Yong Gang Mao, Shang Tao Zhou, Dong Dong Guo, Gleb Kholodov, Giok Hong Khoo, Yu Xiang Li, Ning Wang, Dong Hui Zhang, Yi Zhang
  • Publication number: 20180108572
    Abstract: The present disclosure relates to the technical field of semiconductor processes, and discloses a semiconductor device and a manufacturing method therefor.
    Type: Application
    Filed: October 3, 2017
    Publication date: April 19, 2018
    Applicants: Semiconductor Manufacturing International (Shanghai) Corporation, SMIC Advanced Technology Research & Development (Shanghai) Corporation, IMEC International
    Inventors: Hai Zhao, Yang Liu, Gang Mao, Cheng-Jui Yang, Yongmeng Lee, Shaofeng Yu