Abstract: Embodiments in accordance with the present invention provide methods of forming a metal interconnect structure which avoid defects arising from copper migration. In accordance with particular embodiments, an electroplated copper feature is subjected to a brief thermal anneal prior to chemical mechanical polishing and subsequent formation of an overlying barrier layer. This thermal anneal intentionally provokes migration of the copper and resulting formation of hillocks or voids, which are then removed by a CMP step. The barrier layer may thus subsequently be formed over a defect-free surface, which has already experienced stress release along grain boundaries as a result of the thermal treatment.

Abstract: A micro-strip antenna includes an L-shaped coupler, a set of micro-strip antennas, and an L-shaped band-stop filter. The set of micro-strip antennas includes at least one rectangular micro-strip antenna unit and a micro-strip line. The rectangular micro-strip antenna unit is coupled to the micro-strip line. The micro-strip line is coupled to the first end of the coupler. The band-stop filter is disposed along a corner of the rectangular micro-strip antenna unit, and is disposed between the antenna unit and the coupler without being physically connected to the antenna unit and the coupler. The width, length, and position of the L-shaped band-stop filter can be determined for the specific band-stop frequency and to optimize its coupling extent with the L-shaped coupler.

Abstract: A multi-band microstrip meander-line antenna includes a substrate, two meander-shaped conductors, and two feed lines. The first meander-shaped conductor is disposed on the substrate in a first reciprocating bend manner for providing a resonant frequency band corresponding to a first operating frequency. The second meander-shaped conductor is disposed on the substrate in a second reciprocating bend manner for providing a resonant frequency band corresponding to a second operating frequency. The first feed line includes the first end electrically connected to a first feed point of the antenna and the second end electrically connected to the end of the first meander-shaped conductor. The second feed line includes the first end electrically connected to the second feed point of the antenna and the second end electrically connected to the end of the second meander-shaped conductor.

Abstract: To meet the requirements including dual-band, a high gain, and a broadside radiation formation, a dual band planar micro-strip antenna utilizing antenna array is provided. One array element includes a rectangle-shaped micro-strip antenna and an arrow-shaped micro-strip antenna. A first resonant frequency is determined by a length of the rectangle-shaped micro-strip antenna. Slots are dug for satisfying a second resonance frequency. Curved surfaces of the arrow-shaped micro-strip antenna designed according to an ellipse equation so that a frequency resonance is reached under both the first resonant frequency and a second resonant frequency, and a broadside radiation formation is thus generated. A T-shaped jointer distributes power between antenna elements according to the output impedances of the antenna elements. An L-shaped band-stop filter located on the T-shaped jointer is utilized to suppress frequency resonance resulted from multiples of the first resonant frequency.

Abstract: A wireless power transmitting apparatus for remotely transmitting energy is implemented with a closed metal housing and a plurality of conductive plates disposed within the closed metal housing. With the aid of a high impedance between the closed metal housing and the conductive plates, a surface having the high impedance is formed on both the closed metal housing and the conductive plates for constraining electromagnetic power within the closed metal housing from dissipating and being consumed. The wireless power transmitting apparatus is not merely able to effectively and uniformly restrict electromagnetic field energy to the closed metal housing with the aid of the high impedance, but is also be able to raise a power transmitting efficiency between a power emitting device and a power receiving device.

Abstract: A micro-strip antenna includes an L-shaped coupler, a set of micro-strip antennas, and an L-shaped band-stop filter. The set of micro-strip antennas includes at least one rectangular micro-strip antenna unit and a micro-strip line. The rectangular micro-strip antenna unit is coupled to the micro-strip line. The micro-strip line is coupled to the first end of the coupler. The band-stop filter is disposed along a corner of the rectangular micro-strip antenna unit, and is disposed between the antenna unit and the coupler without being physically connected to the antenna unit and the coupler. The width, length, and position of the L-shaped band-stop filter can be determined for the specific band-stop frequency and to optimize its coupling extent with the L-shaped coupler.

Abstract: Embodiments in accordance with the present invention provide methods of forming a metal interconnect structure which avoid defects arising from copper migration. In accordance with particular embodiments, an electroplated copper feature is subjected to a brief thermal anneal prior to chemical mechanical polishing and subsequent formation of an overlying barrier layer. This thermal anneal intentionally provokes migration of the copper and resulting formation of hillocks or voids, which are then removed by a CMP step. The barrier layer may thus subsequently be formed over a defect-free surface, which has already experienced stress release along grain boundaries as a result of the thermal treatment.