Abstract: A resistive RAM device includes a bit line, a word line, an RRAM cell coupled to the word line and to the bit line, a write driver and a disable circuit. The write driver is coupled to the bit line. The disable circuit stops a write operation performed by the write driver on a respective RRAM cell when a predefined condition on the bit line is achieved. The predefined condition depends on a mode of operation of the RRAM cell.

Abstract: A memory module includes multiple memory devices mounted to a substrate and one or more discrete heating elements disposed in thermal contact with the memory devices. Each of the memory devices includes charge-storing memory cells subject to operation-induced defects that degrade ability of the memory cells to store data. The discrete heating elements, or single discrete heating element, heats the memory devices to a temperature that anneals the defects.

Abstract: In a system having a memory device, an event is detected during system operation. The memory device is heated to reverse use-incurred degradation of the memory device in response to detecting the event. In another system, the memory device is heated to reverse use-incurred degradation concurrently with execution of a data access operation within another memory device of the system. In another system having a memory controller coupled to first and second memory devices, data is evacuated from the first memory device to the second memory device in response to determining that a maintenance operation is needed within the first memory device.

Abstract: A NAND flash memory device having a bit line and a plurality of storage cells coupled thereto. Programming circuitry is coupled to the plurality of storage cells concurrently to program two or more of the storage cells in different NAND strings associated with the same bit line.

Abstract: Embodiments of a circuit are described. This circuit includes control logic that generates multiple piecewise-erase commands to erase information stored in a storage cell of a memory device formed within another circuit. Note that execution of a single one of the multiple piecewise-erase commands within the memory device may be insufficient to erase the information stored in the storage cell. Moreover, the first circuit includes an interface that receives the multiple piecewise-erase commands from the control logic and that transmits the multiple piecewise-erase commands to the memory device.

Abstract: A memory module includes multiple memory devices mounted to a substrate and one or more discrete heating elements disposed in thermal contact with the memory devices. Each of the memory devices includes charge-storing memory cells subject to operation-induced defects that degrade ability of the memory cells to store data. The discrete heating elements, or single discrete heating element, heats the memory devices to a temperature that anneals the defects.

Abstract: The disclosed embodiments provide a sense amplifier for a dynamic random-access memory (DRAM). This sense amplifier includes a bit line to be coupled to a cell to be sensed in the DRAM, and a complement bit line which carries a complement of a signal on the bit line. The sense amplifier also includes a p-type field-effect transistor (PFET) pair comprising cross-coupled PFETs that selectively couple either the bit line or the complement bit line to a high bit-line voltage. The sense amplifier additionally includes an n-type field effect transistor (NFET) pair comprising cross-coupled NFETs that selectively couple either the bit line or the complement bit line to ground. This NFET pair is lightly doped to provide a low threshold-voltage mismatch between NFETs in the NFET pair. In one variation, the gate material for the NFETs is selected to have a work function that compensates for a negative threshold voltage in the NFETs which results from the light substrate doping.

Abstract: A memory device includes a planar substrate, a plurality of horizontal conductive planes above the planar substrate, and a plurality of horizontal insulating layers interleaved with the plurality of horizontal conductive planes. An array of vertical conductive columns, perpendicular to the pluralities of conductive planes and insulating layers, passes through apertures in the pluralities of conductive planes and insulating layers. The memory device includes a plurality of programmable memory elements, each of which couples one of the horizontal conductive planes to a respective vertical conductive column.

Abstract: A method of repairing a nonvolatile semiconductor memory device to eliminate defects includes monitoring a memory endurance indicator for a nonvolatile semiconductor memory device contained in a semiconductor package. It is determined whether that the memory endurance indicator exceeds a predefined limit. Finally, in response to determining that the memory endurance indicator exceeds the predefined limit, the device is annealed.

Abstract: In a system having a memory device, an event is detected during system operation. The memory device is heated to reverse use-incurred degradation of the memory device in response to detecting the event. In another system, the memory device is heated to reverse use-incurred degradation concurrently with execution of a data access operation within another memory device of the system. In another system having a memory controller coupled to first and second memory devices, data is evacuated from the first memory device to the second memory device in response to determining that a maintenance operation is needed within the first memory device.

Abstract: This disclosure provides a nonvolatile memory device that uses pulsed control and rest periods to mitigate the formation of defect precursors. A first embodiment uses pulsed bitline control, where the coupling between a memory cell channel and a reference voltage (selected in response to the bitline) is pulsed when it is desired to change state in the associated memory cell. Each pulse may be chosen to be less than about (20) nanoseconds, while a “rest period” between pulses typically is chosen to be on the order of about a hundred nanoseconds or greater (e.g., one microsecond). Because bitline control is used, very short rise times can be enabled, enabling generation of pulse durations of (50) nanoseconds or less. In other embodiments, these methods may also be more generally applied to other conductors (e.g.

Abstract: A memory system (100B) includes an array of non-volatile memory cells (140) and a memory controller (110) having a first port (port connected to line 101) to receive a program command that addresses a number of the memory cells for a programming operation, having a second port (port connected to lines 102 and 103) coupled to the memory array via a command pipeline, and configured to create a plurality of fractional program commands in response to the program command. Execution of each fractional program command applies a single program pulse to the addressed memory cells to incrementally program the addressed memory cells with program data, where the duration of the program pulse associated with each fractional program command is a selected fraction of the total programming time typically required to program the memory cells.

Abstract: Embodiments of a circuit are described. This circuit includes control logic that generates multiple piecewise-erase commands to erase information stored in a storage cell of a memory device formed within another circuit. Note that execution of a single one of the multiple piecewise-erase commands within the memory device may be insufficient to erase the information stored in the storage cell. Moreover, the first circuit includes an interface that receives the multiple piecewise-erase commands from the control logic and that transmits the multiple piecewise-erase commands to the memory device.

Abstract: A NAND flash memory device having a bit line and a plurality of storage cells coupled thereto. Programming circuitry is coupled to the plurality of storage cells concurrently to program two or more of the storage cells in different NAND strings associated with the same bit line.

Abstract: A method of repairing a nonvolatile semiconductor memory device to eliminate defects includes monitoring a memory endurance indicator for a nonvolatile semiconductor memory device contained in a semiconductor package. It is determined whether that the memory endurance indicator exceeds a predefined limit. Finally, in response to determining that the memory endurance indicator exceeds the predefined limit, the device is annealed.

Abstract: A method of fabricating a vertical field effect transistor (“FET”) is provided which includes a transistor body region and source and drain regions disposed in a single-crystal semiconductor-on-insulator (“SOI”) region of a substrate adjacent a sidewall of a trench. The substrate includes a buried insulator layer underlying the SOI region and a bulk region underlying the buried insulator layer. A buried strap conductively connects the SOI region to a lower node disposed below the SOI region and a body contact extends from the transistor body region to the bulk region of the substrate, the body contact being insulated from the buried strap.

Abstract: The present invention provides a strained/SGOI structure that includes an active device region of a relaxed SiGe layer, a strained Si layer located atop the relaxed SiGe layer, a raised source/drain region located atop a portion of the strained Si layer, and a stack comprising at least a gate dielectric and a gate polySi located on another portion of the strained Si layer; and a raised trench oxide region surrounding the active device region. The present invention also provides a method of forming such a structure. In the inventive method, the gate dielectric is formed prior to trench isolation formation thereby avoiding many of the problems associated with prior art processes in which the trench oxide is formed prior to gate dielectric formation.

Abstract: A method of fabricating a plurality of FinFETs on a semiconductor substrate in which the gate width of each individual FinFET is defined utilizing only a single etching process, instead of two or more, is provided. The inventive method results in improved gate width control and less variation of the gate width of each individual gate across the entire surface of the substrate. The inventive method achieves the above by utilizing a modified sidewall image transfer (SIT) process in which an insulating spacer that is later replaced by a gate conductor is employed and a high-density bottom up oxide fill is used to isolate the gate from the substrate.

Abstract: A method of fabricating a plurality of FinFETs on a semiconductor substrate in which the gate width of each individual FinFET is defined utilizing only a single etching process, instead of two or more, is provided. The inventive method results in improved gate width control and less variation of the gate width of each individual gate across the entire surface of the substrate. The inventive method achieves the above by utilizing a modified sidewall image transfer (SIT) process in which an insulating spacer that is later replaced by a gate conductor is employed and a high-density bottom up oxide fill is used to isolate the gate from the substrate.

Abstract: A vertical field effect transistor (“FET”) is provided which includes a transistor body region and source and drain regions disposed in a single-crystal semiconductor-on-insulator (“SOI”) region of a substrate adjacent a sidewall of a trench. The substrate includes a buried insulator layer underlying the SOI region and a bulk region underlying the buried insulator layer. A buried strap conductively connects the SOI region to a lower node disposed below the SOI region and a body contact extends from the transistor body region to the bulk region of the substrate, the body contact being insulated from the buried strap.