Abstract: A method of fabricating a plurality of FinFETs on a semiconductor substrate in which the gate width of each individual FinFET is defined utilizing only a single etching process, instead of two or more, is provided. The inventive method results in improved gate width control and less variation of the gate width of each individual gate across the entire surface of the substrate. The inventive method achieves the above by utilizing a modified sidewall image transfer (SIT) process in which an insulating spacer that is later replaced by a gate conductor is employed and a high-density bottom up oxide fill is used to isolate the gate from the substrate.

Abstract: The present invention provides a vertical memory device formed in a silicon-on-insulator substrate, where a bitline contacting the upper surface of the silicon-on-insulator substrate is electrically connected to the vertical memory device through an upper strap diffusion region formed through a buried oxide layer. The upper strap diffusion region is formed by laterally etching a portion of the buried oxide region to produce a divot, in which doped polysilicon is deposited. The upper strap region diffusion region also provides the source for the vertical transistor of the vertical memory device. The vertical memory device may also be integrated with a support region having logic devices formed atop the silicon-on-insulator substrate.

Abstract: The present invention provides a strained/SGOI structure that includes an active device region of a relaxed SiGe layer, a strained Si layer located atop the relaxed SiGe layer, a raised source/drain region located atop a portion of the strained Si layer, and a stack comprising at least a gate dielectric and a gate polySi located on another portion of the strained Si layer; and a raised trench oxide region surrounding the active device region. The present invention also provides a method of forming such a structure. In the inventive method, the gate dielectric is formed prior to trench isolation formation thereby avoiding many of the problems associated with prior art processes in which the trench oxide is formed prior to gate dielectric formation.

Abstract: The present invention provides a vertical memory device formed in a silicon-on-insulator substrate, where a bitline contacting the upper surface of the silicon-on-insulator substrate is electrically connected to the vertical memory device through an upper strap diffusion region formed through a buried oxide layer. The upper strap diffusion region is formed by laterally etching a portion of the buried oxide region to produce a divot, in which doped polysilicon is deposited. The upper strap region diffusion region also provides the source for the vertical transistor of the vertical memory device. The vertical memory device may also be integrated with a support region having logic devices formed atop the silicon-on-insulator substrate.

Abstract: A memory cell containing double-gated vertical metal oxide semiconductor field effect transistors (MOSFETs) and isolation regions such as shallow trench isolation, STI, regions that are self-aligned to the wordlines and bitlines of the cell are provided. The inventive memory cell substantially eliminates the backgating problem and floating well effects that are typically present in prior art memory cells. A method of fabricating the inventive memory cell is also provided.

Abstract: The preferred embodiment of the present invention provides unique structure for connecting between a storage capacitor and a transfer device in a memory cell and a method for fabricating the same. The preferred embodiment of the present invention forms a capacitor structure having a “lip” at its top on the side the connection is to be made. To form the connection, dopant is diffused from the lower surface of the capacitor step and into the substrate, forming a surface strap to connect between the storage capacitor and the transfer device. This surface strap has the advantage of being self aligned with the storage capacitor and the transfer device, facilitating higher memory cell densities. The present invention can be used to form connections between storage capacitors and memory cells in a wide variety of devices.

Abstract: The distance between buried straps in a DRAM array of trench capacitor/vertical transistor cells is increased by offsetting adjacent cells by a vertical offset distance, so that the total distance between adjacent straps is increased without increasing the horizontal distance between cells.

Abstract: A memory cell containing double-gated vertical metal oxide semiconductor field effect transistors (MOSFETs) and isolation regions such as shallow trench isolation, STI, regions that are self-aligned to the wordlines and bitlines of the cell are provided. The inventive memory cell substantially eliminates the backgating problem and floating well effects that are typically present in prior art memory cells. A method of fabricating the inventive memory cell is also provided.

Abstract: A method for clearing an isolation collar from a first interior surface of a deep trench at a location above a storage capacitor while leaving the isolation collar at other surfaces of the deep trench. A barrier material is deposited above a node conductor of the storage capacitor. A layer of silicon is deposited over the barrier material. Dopant ions are implanted at an angle into the layer of deposited silicon within the deep trench, thereby leaving the deposited silicon unimplanted along one side of the deep trench. The unimplanted silicon is etched. The isolation collar is removed in locations previously covered by the unimplanted silicon, leaving the isolation collar in locations covered by the implanted silicon.

Abstract: A memory cell containing double-gated vertical metal oxide semiconductor field effect transistors (MOSFETs) and isolation regions such as shallow trench isolation, STI, regions that are self-aligned to the wordlines and bitlines of the cell are provided. The inventive memory cell substantially eliminates the backgating problem and floating well effects that are typically present in prior art memory cells. A method of fabricating the inventive memory cell is also provided.

Abstract: A silicon on insulator (SOI) dynamic random access memory (DRAM) cell and array and method of manufacture. The memory cell includes a trench storage capacitor connected by a self aligned buried strap to a vertical access transistor. A buried oxide layer isolates an SOI layer from a silicon substrate. The trench capacitor is formed in the substrate and the access transistor is formed on a sidewall of the SOI layer. A polysilicon strap connected to the polysilicon plate of the storage capacitor provides a self-aligned contact to the source of the access transistor. Initially, the buried oxide layer is formed in the wafer. Deep trenches are etched, initially just through the SOI layer and the BOX layer. Protective sidewalls are formed in the trenches. Then, the deep trenches are etched into the substrate. The volume in the substrate is expanded to form a bottle shaped trench.

Abstract: A method and structure for a field effect transistor structure for dynamic random access memory integrated circuit devices has a gate conductor, salicide regions positioned along sides of the gate conductor, a gate cap positioned above the gate conductor and at least one self-aligned contact adjacent the gate conductor.

Abstract: A method for protecting selected first surfaces on a semiconductor substrate during application of a second oxide layer to said substrate comprising applying an oxidation barrier layer as a mask over said selected first surfaces, prior to patterning said semiconductor substrate with a resist mask and applying said second oxide layer.

Abstract: A DRAM cell storage capacitor is formed above the bottom of a deep trench (DT) below an FET transistor. The DT has upper, central and lower portions with sidewalls. A capacitor plate electrode, surrounding the lower DT portion that is doped with a first dopant type, is separated by an interface from a well region surrounding the upper and central portions of the DT that are doped with an opposite dopant type. A source/drain region formed at the top of the cell is doped with the first dopant type. A node dielectric layer that covers the sidewalls and bottom of the lower and central portions of the DT is filled with a node electrode of the capacitor, doped with the first dopant type, fills the space inside the node dielectric layer in the lower part of the DT. Above a recessed node dielectric layer a strap region space is filled with a buried-strap conductor. An oxide (TTO) layer is formed over the node electrode and the buried-strap in the DT.

Abstract: A DRAM memory cell array includes a wiring layer formed at a storage-capacitor level of the cell for establishing a flipped connection of complementary bit lines, or for connecting support circuits in a DRAM cell array. The wiring layer includes a lower capacitor electrode and upper capacitor electrode which are formed simultaneously with respective plates of a storage capacitor. Both capacitor electrodes may be used to form distinct interconnections within a DRAM cell array.

Abstract: An easily manufactured connecting structure from a node conductor of trench capacitor device is characterized at least in part by the presence of an isolation collar located above the node conductor, at least a portion of the collar having an exterior surface which is substantially conformal with at least a portion of an adjacent wall of the trench, a buried strap region in the trench above the node conductor, the strap region being bounded laterally by the isolation collar except at an opening in the collar. The connecting structure is preferably formed by a method involving clearing an isolation collar from a first interior surface of a deep trench at a location above a storage capacitor while leaving the isolation collar at other surfaces of the deep trench.

Abstract: A silicon on insulator (SOI) dynamic random access memory (DRAM) cell, array and method of manufacture. The memory cell includes a vertical access transistor above a trench storage capacitor in a layered wafer. A buried oxide (BOX) layer formed in a silicon wafer isolates an SOI layer from a silicon substrate. Deep trenches are etched through the upper surface SOI layer, the BOX layer and into the substrate. Each trench capacitor is formed in the substrate and, the access transistor is formed on a sidewall of the SOI layer. Recesses are formed in the BOX layer at the SOI layer. A polysilicon strap recessed in the BOX layer connects each polysilicon storage capacitor plate to a self-aligned contact at the source of the access transistor. Dopant is implanted into the wafer to define device regions. Access transistor gates are formed along the SOI layer sidewalls. Shallow trenches are formed and filled with insulating material to isolate cells from adjacent cells.

Abstract: A memory cell containing double-gated vertical metal oxide semiconductor field effect transistors (MOSFETs) and isolation regions such as shallow trench isolation, STI, regions that are self-aligned to the wordlines and bitlines of the cell are provided. The inventive memory cell substantially eliminates the backgating problem and floating well effects that are typically present in prior art memory cells. A method of fabricating the inventive memory cell is also provided.

Abstract: A DRAM memory cell array includes a wiring layer formed at a storage-capacitor level of the cell for establishing a flipped connection of complementary bit lines, or for connecting support circuits in a DRAM cell array. The wiring layer includes at least one and preferably two capacitor electrodes for making both types of interconnects. A method for making the DRAM memory cell includes forming one or more capacitor electrodes at the same time the electrodes of the storage capacitor of the memory cell are formed, and from the same material as the storage capacitor electrodes.

Abstract: A method and structure for forming an integrated circuit chip having multiple-thickness gate dielectrics includes forming a gate dielectric layer over a substrate, forming a sacrificial layer over the gate dielectric layer, forming first openings through the sacrificial layer to expose the gate dielectric layer in the first openings, growing a first gate dielectric having a thickness greater than that of the gate dielectric layer in the first openings, depositing a first gate conductor above the first gate dielectric in the first openings, forming a second opening through the sacrificial layer to expose the gate dielectric layer in the second opening, and depositing a second gate conductor in the second opening.