Abstract: For one disclosed embodiment, an apparatus includes a first housing and a second housing coupled to the first housing. The first housing and the second housing are rotatable between an open configuration and a closed configuration. The apparatus further includes and a touch input device supported by the first housing. The touch input device is configured to have a first active touch surface when the first housing and the second housing are in the open configuration, and a second active touch surface when the first housing and the second housing are in the closed configuration. The first active touch surface is smaller than the second active touch surface.

Abstract: For one disclosed embodiment, an apparatus includes a first housing and a touch input device supported by the first housing. The touch input device includes a first touch surface layer, a second touch surface layer, and a touch sensor disposed between the first touch surface layer and the second touch surface layer. The touch sensor is configured to detect a first touch input associated with the first touch surface layer and a second touch input associated with the second touch surface layer.

Abstract: For one disclosed embodiment, an apparatus includes a first housing and a touch input device supported by the first housing. The touch input device includes a first touch surface layer, a second touch surface layer, and a touch sensor disposed between the first touch surface layer and the second touch surface layer. The touch sensor is configured to detect a first touch input associated with the first touch surface layer and a second touch input associated with the second touch surface layer.

Abstract: For one disclosed embodiment, an apparatus includes a first housing and a second housing coupled to the first housing. The first housing and the second housing are rotatable between an open configuration and a closed configuration. The apparatus further includes and a touch input device supported by the first housing. The touch input device is configured to have a first active touch surface when the first housing and the second housing are in the open configuration, and a second active touch surface when the first housing and the second housing are in the closed configuration. The first active touch surface is smaller than the second active touch surface.

Abstract: A method for providing an improved solder joint for a via-in-pad ball grid array package. One or more bonding pads are formed upon a substrate. One or more vias are formed through the substrate within the bonding pad. The vias are plugged with a via plug material. The via plug material is then preconditioned such that an amount of volatiles within the via plug material is reduced.

Abstract: An electronic substrate for interconnecting electronic components comprises a substrate having one or more conductive inner layers and one or more interconnect cavities extending into the substrate to expose one or more of the inner layers.

Abstract: A method for providing an improved solder joint for a via-in-pad ball grid array package. One or more bonding pads are formed upon a substrate. One or more vias are formed through the substrate within the bonding pad. The vias are plugged with a via plug material. The via plug material is then preconditioned such that an amount of volatiles within the via plug material is reduced.