Abstract: The invention relates to a method of forming a polyphenylene ether resin containing residual aliphatic unsaturation. A polyphenylene ether is reacted with a capping agent in a solvent to form the polyphenylene ether resin containing residual aliphatic unsaturation, which is precipitated from solution by combining the solution with an antisolvent. The precipitated polyphenylene ether resin containing residual aliphatic unsaturation has lower levels of residual impurities than the same compound isolated by devolatilization.

Abstract: Powder coating compositions comprising at least one thermosetting resin and at least one poly(phenylene ether) are disclosed. The compositions have excellent fracture toughness and thermal properties.

Abstract: The invention relates to a polyphenylene ether resin containing residual aliphatic unsaturation as well as composites, blends, and articles made from the polyphenylene ether resin containing residual aliphatic unsaturation. Also included are reaction products between the polyphenylene ether resin containing residual aliphatic unsaturation and other resins and unsaturated resin formulations, e.g., thermosetting polyesters, acrylics, bismaleiimides, silicones, and allylics, and thermoplastics such as polyolefins, styrenics, rubbers, etc.

Abstract: A curable composition includes a functionalized poly(arylene ether), an alkenyl aromatic monomer, an acryloyl monomer, and a polymeric additive effective selected from polystyrene, poly(styrene-maleic anhydride), poly(styrene-methyl methacrylate), polybutene, poly(ethylene-butylene), poly(vinyl ether), poly(vinyl acetate), and combinations thereof. The composition exhibits low shrinkage on curing and improved surface smoothness. It is useful, for example, in the manufacture of automotive body panels.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, and, optionally (E) at least one ancillary curing catalyst. The encapsulant may also optionally comprise at least one of thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip, and an encapsulant comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: The invention relates to a polyphenylene ether resin containing residual aliphatic unsaturation as well as composites, blends, and articles made from the polyphenylene ether resin containing residual aliphatic unsaturation. Also included are reaction products between the polyphenylene ether resin containing residual aliphatic unsaturation and other resins and unsaturated resin formulations, e.g., thermosetting polyesters, acrylics, bismaleiimides, silicones, and allylics, and thermoplastics such as polyolefins, styrenics, rubbers, etc.

Abstract: A thermosetting composition comprises a capped poly(arylene ether), an alkenyl aromatic monomer, and an acryloyl monomer. The composition provides good flow properties and fast curing rates. After curing, the composition exhibits good stiffness, toughness, heat resistance, and dielectric properties.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, and, optionally (E) at least one ancillary curing catalyst. The encapsulant may also optionally comprise at least one of thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip, and an encapsulant comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: A curable resin composition comprises a poly(arylene ether), an acryloyl monomer, an allylic monomer, and an abrasive filler. The composition tolerates high filler contents, cures rapidly, and exhibits excellent toughness after curing. Useful articles prepared from the composition include grinding wheels and cut-off wheels having good wear characteristics.

Abstract: A curable resin composition comprises a poly(arylene ether), an acryloyl monomer, an allylic monomer, and an abrasive filler. The composition tolerates high filler contents, cures rapidly, and exhibits excellent toughness after curing. Useful articles prepared from the composition include grinding wheels and cut-off wheels having good wear characteristics.

Abstract: Powder coating compositions comprising at least one thermosetting resin and at least one poly(phenylene ether) are disclosed.

Abstract: A thermosetting composition comprises a capped poly(arylene ether), an alkenyl aromatic monomer, and an alkoxylated acryloyl monomer. The composition provides good flow properties and fast curing rates. After curing, the composition exhibits good stiffness, toughness, and heat resistance.

Abstract: Carboxy-functionalized polyphenylene ethers containing structural units with a carboxyalkyl group in the 2-position are prepared by redistribution of a polyphenylene ether with a 2-carboxyalkylphenol such as 2-(3-carboxypropyl)phenol (melilotic acid), or by oxidative coupling of a suitable phenol with such a 2-carboxyalkylphenol. The products form compatibilizing copolymers with polymers containing carboxylic acid-reactive functional groups, such as polyesters, polyamides and epoxy resins.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, and, optionally (E) at least one ancillary curing catalyst. The encapsulant may also optionally comprise at least one of thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip, and an encapsulant comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: A curable resin composition comprises a poly(arylene ether), an acryloyl monomer, an allylic monomer, and an abrasive filler. The composition tolerates high filler contents, cures rapidly, and exhibits excellent toughness after curing. Useful articles prepared from the composition include grinding wheels and cut-off wheels having good wear characteristics.

Abstract: A packaged solid state device having a package, a chip, and an encapsulate having an epoxy resin, a boron containing catalyst that is essentially free of halogen. A LED device having a package, a LED chip, a encapsulate having a cycloaliphatic epoxy resin and a boroxine catalyst essentially free of halogen. A method of encapsulating a solid state device whereby a solid state device is placed into a package, and an encapsulant comprising an epoxy resin, and a boron containing catalyst that is essentially free of halogen, are provided.

Abstract: A conductive thermosetting composition comprises a functionalized poly(arylene ether), an alkenyl aromatic monomer, an acryloyl monomer, and a conductive agent. After curing, the composition exhibits good stiffness, toughness, heat resistance, and conductivity, and it is useful in the fabrication of a variety of conductive components, including the bipolar plates of fuel cells.

Abstract: A curable resin composition including a poly(arylene ether), an allylic monomer, and an acryloyl monomer may be formulated as a powder. The resin composition exhibits improved toughness, and it is useful in thermoset processing applications where use of powdered resins is preferred.

Abstract: A curable composition includes a functionalized poly(arylene ether); an alkenyl aromatic monomer; an acryloyl monomer; and a polymeric additive having a glass transition temperature less than or equal to 100° C. and a Young's modulus less than or equal to 1000 megapascals at 25° C. The polymeric additive is soluble in the combined functionalized poly(arylene ether), alkenyl aromatic monomer, and acryloyl monomer at a temperature less than or equal to 50° C. The composition exhibits low shrinkage on curing and improved surface smoothness. It is useful, for example, in the manufacture of automotive body panels.

Abstract: The invention relates to a polyphenylene ether resin containing residual aliphatic unsaturation as well as composites, blends, and articles made from the polyphenylene ether resin containing residual aliphatic unsaturation. Also included are reaction products between the polyphenylene ether resin containing residual aliphatic unsaturation and other resins and unsaturated resin formulations, e.g., thermosetting polyesters, acrylics, bismaleiimides, silicones, and allylics, and thermoplastics such as polyolefins, styrenics, rubbers, etc.