Patents by Inventor Gary William Yeager

Gary William Yeager has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020128400
    Abstract: The invention relates to a polyphenylene ether resin containing residual aliphatic unsaturation as well as composites, blends, and articles made from the polyphenylene ether resin containing residual aliphatic unsaturation. Also included are reaction products between the polyphenylene ether resin containing residual aliphatic unsaturation and other resins and unsaturated resin formulations, e.g., thermosetting polyesters, acrylics, bismaleiimides, silicones, and allylics, and thermoplastics such as polyolefins, styrenics, rubbers, etc.
    Type: Application
    Filed: March 26, 2002
    Publication date: September 12, 2002
    Inventors: Adrianus J.F.M. Braat, Herbert Shin-I Chao, Hua Guo, Juraj Liska, Gary William Yeager
  • Patent number: 6433744
    Abstract: An antenna comprising two essentially identical electrically conducting rectangular plates lying in parallel planes and separated so that a gap is formed between the plates also includes a dielectric situated within the gap and exhibiting a relative permittivity that changes with frequency. Electrical connectors connect the plates to corresponding conductors that carry the signal to be radiated by the antenna.
    Type: Grant
    Filed: December 11, 2000
    Date of Patent: August 13, 2002
    Assignee: General Electric Company
    Inventors: John Erik Hershey, Gregory Bruce Robinson, Kenneth Brakeley Welles, II, Daniel White Sexton, David Michael Davenport, Gary William Yeager
  • Publication number: 20020097185
    Abstract: An antenna comprising two essentially identical electrically conducting rectangular plates lying in parallel planes and separated so that a gap is formed between the plates also includes a dielectric situated within the gap and exhibiting a relative permittivity that changes with frequency. Electrical connectors connect the plates to corresponding conductors that carry the signal to be radiated by the antenna.
    Type: Application
    Filed: December 11, 2000
    Publication date: July 25, 2002
    Applicant: General Electric Company
    Inventors: John Erik Hershey, Gregory Bruce Robinson, Kenneth Brakeley Welles, Daniel White Sexton, David Michael Davenport, Gary William Yeager
  • Patent number: 6403229
    Abstract: Laminate structures, for example for use in circuit boards, comprise a metal foil and at least one cured composition layer disposed on at least one surface of the metal foil, wherein the cured composition layer comprises (a) at least one compound selected from the group consisting of cyanate esters and cyanate ester prepolymers, (b) a flame retardant which is substantially toluene soluble and substantially free of hydroxy residues in the cured state, and (c) a curing catalyst.
    Type: Grant
    Filed: January 16, 2001
    Date of Patent: June 11, 2002
    Assignee: General Electric Company
    Inventors: Gary William Yeager, Yiqun Pan
  • Publication number: 20020062001
    Abstract: The invention relates to a polyphenylene ether resin containing residual aliphatic unsaturation as well as composites, blends, and articles made from the polyphenylene ether resin containing residual aliphatic unsaturation. Also included are reaction products between the polyphenylene ether resin containing residual aliphatic unsaturation and other resins and unsaturated resin formulations, e.g., thermosetting polyesters, acrylics, bismaleiimides, silicones, and allylics, and thermoplastics such as polyolefins, styrenics, rubbers, etc.
    Type: Application
    Filed: December 18, 2001
    Publication date: May 23, 2002
    Inventors: Adrianus J.F.M. Braat, Herbert Shin-I Chao, Hua Guo, Juraj Liska, Gary William Yeager
  • Patent number: 6384176
    Abstract: The invention relates to a novel process for the manufacture of polyphenylene ether resin containing residual aliphatic unsaturation. The invention also relates to the polyphenylene ether resin containing residual aliphatic unsaturation as well as composites, blends, and articles made from the polyphenylene ether resin containing residual aliphatic unsaturation. Also included are reaction products between the polyphenylene ether resin containing residual aliphatic unsaturation and other resins and unsaturated resin formulations, e.g., thermosetting polyesters, acrylics, and thermoplastics such as polyolefins.
    Type: Grant
    Filed: July 10, 2000
    Date of Patent: May 7, 2002
    Assignee: General Electric Co.
    Inventors: Adrianus J. F. M. Braat, Herbert Shin-I Chao, Hua Guo, Juraj Liska, Gary William Yeager
  • Publication number: 20010053820
    Abstract: A thermosetting composition comprises a capped poly(arylene ether), an alkenyl aromatic monomer, and an acryloyl monomer. The composition provides good flow properties and fast curing rates. After curing, the composition exhibits good stiffness, toughness, heat resistance, and dielectric properties.
    Type: Application
    Filed: July 16, 2001
    Publication date: December 20, 2001
    Inventors: Gary William Yeager, Robert Edgar Colborn
  • Publication number: 20010034430
    Abstract: Carboxy-functionalized polyphenylene ethers containing structural units with a carboxyalkyl group in the 2-position are prepared by redistribution of a polyphenylene ether with a 2-carboxyalkylphenol such as 2-(3-carboxypropyl)phenol (melilotic acid), or by oxidative coupling of a suitable phenol with such a 2-carboxyalkylphenol. The products form compatibilizing copolymers with polymers containing carboxylic acid-reactive functional groups, such as polyesters, polyamides and epoxy resins.
    Type: Application
    Filed: May 31, 2001
    Publication date: October 25, 2001
    Inventors: Gary William Yeager, Yiqun Pan
  • Publication number: 20010034418
    Abstract: Carboxy-functionalized polyphenylene ethers containing structural units with a carboxyalkyl group in the 2-position are prepared by redistribution of a polyphenylene ether with a 2-carboxyalkylphenol such as 2-(3-carboxypropyl)phenol (melilotic acid), or by oxidative coupling of a suitable phenol with such a 2-carboxyalkylphenol. The products form compatibilizing copolymers with polymers containing carboxylic acid-reactive functional groups, such as polyesters, polyamides and epoxy resins.
    Type: Application
    Filed: May 31, 2001
    Publication date: October 25, 2001
    Inventors: Gary William Yeager, Yiqun Pan
  • Publication number: 20010016616
    Abstract: Curable compositions used in circuit boards, structural composite, encapsulating resins, and the like, comprise at least one of a cyanate ester and a cyanate ester prepolymer, a cyanate ester-free aryloxytriazine, and a curing catalyst.
    Type: Application
    Filed: January 16, 2001
    Publication date: August 23, 2001
    Inventors: Gary William Yeager, Yiqun Pan
  • Patent number: 6268463
    Abstract: Carboxy-functionalized polyphenylene ethers containing structural units with a carboxyalkyl group in the 2-position are prepared by redistribution of a polyphenylene ether with a 2-carboxyalkylphenol such as 2-(3-carboxypropyl)phenol (melilotic acid), or by oxidative coupling of a suitable phenol with such a 2-carboxyalkylphenol. The products form compatibilizing copolymers with polymers containing carboxylic acid-reactive functional groups, such as polyesters, polyamides and epoxy resins.
    Type: Grant
    Filed: October 26, 1999
    Date of Patent: July 31, 2001
    Assignee: General Electric Company
    Inventors: Gary William Yeager, Yiqun Pan
  • Patent number: 6245841
    Abstract: Curable compositions used in circuit boards, structural composite, encapsulating resins, and the like, comprise at least one compound selected from the group consisting of cyanate esters and cyanate ester prepolymers, a flame retardant which is substantially toluene soluble and substantially free of hydroxy residues in the cured state, and a curing catalyst.
    Type: Grant
    Filed: August 2, 1999
    Date of Patent: June 12, 2001
    Assignee: General Electric Company
    Inventors: Gary William Yeager, Yiqun Pan
  • Patent number: 6194495
    Abstract: The present invention relates to curable compositions used in circuit boards, structural composite, encapsulating resins, and the like. These compositions comprise at least one of a cyanate ester and a cyanate ester prepolymer, a cyanate ester-free aryloxytriazine, and a catalyst.
    Type: Grant
    Filed: March 23, 1998
    Date of Patent: February 27, 2001
    Assignee: General Electric Company
    Inventors: Gary William Yeager, Yiqun Pan
  • Patent number: 6162876
    Abstract: Curable compositions used in circuit boards, structural composite, encapsulating resins, and the like, comprise at least one of a cyanate ester and a cyanate ester prepolymer, a cyanate ester-free aryloxytriazine, and a curing catalyst.
    Type: Grant
    Filed: June 11, 1998
    Date of Patent: December 19, 2000
    Assignee: General Electric Company
    Inventors: Gary William Yeager, Yiqun Pan
  • Patent number: 6063875
    Abstract: Carboxy-functionalized polyphenylene ethers containing structural units with a carboxyalkyl group in the 2-position are prepared by redistribution of a polyphenylene ether with a 2-carboxyalkylphenol such as 2-(3-carboxypropyl)phenol (melilotic acid), or by oxidative coupling of a suitable phenol with such a 2-carboxyalkylphenol. The products form compatibilizing copolymers with polymers containing carboxylic acid-reactive functional groups, such as polyesters, polyamides and epoxy resins.
    Type: Grant
    Filed: June 11, 1998
    Date of Patent: May 16, 2000
    Assignee: General Electric Company
    Inventors: Gary William Yeager, Yiqun Pan
  • Patent number: 6051662
    Abstract: Polyphenylene ether-thermosetting resin compositions are provided that are useful as dielectrics, particularly printed circuit boards having improved processability, good solvent and solder resistance, as well as improved morphology as compared to other polyphenylene ether-thermosetting resin compositions. More specifically, the particular polyphenylene ether resin component of this invention has a molecular weight of less than about 3,000 number average in contrast to higher molecular weight polyphenylene ethers employed in other polyphenylene ether-thermosetting resin compositions for use in preparing printed circuit boards.
    Type: Grant
    Filed: August 20, 1998
    Date of Patent: April 18, 2000
    Assignee: General Electric Co.
    Inventors: James E. Tracy, Gary William Yeager
  • Patent number: 5834565
    Abstract: Polyphenylene ether-thermosetting resin compositions are provided that are useful as dielectrics, particularly printed circuit boards having improved processability, good solvent and solder resistance, as well as improved morphology as compared to other polyphenylene ether-thermosetting resin compositions. More specifically, the particular polyphenylene ether resin component of this invention has a molecular weight of less than about 3,000 number average in contrast to higher molecular weight polyphenylene ethers employed in other polyphenylene ether-thermosetting resin compositions for use in preparing printed circuit boards.
    Type: Grant
    Filed: November 12, 1996
    Date of Patent: November 10, 1998
    Assignee: General Electric Company
    Inventors: James E. Tracy, Gary William Yeager
  • Patent number: 5760171
    Abstract: Polyphenylene ethers are decolorized by contact in the melt or in solution with a hydroxy compound containing either another hydroxy group or a double or aromatic bond in a specific location in the molecule. Illustrative decolorizing compounds are benzopinacol, benzoin and acetoin.
    Type: Grant
    Filed: January 24, 1997
    Date of Patent: June 2, 1998
    Assignee: General Electric Company
    Inventors: Dwain Montgomery White, Gary William Yeager