Abstract: An LED lamp or bulb is disclosed that comprises a light source, a heat sink structure and an optical cavity. The optical cavity comprises a phosphor carrier having a conversions material and arranged over an opening to the cavity. The phosphor carrier comprises a thermally conductive transparent material and is thermally coupled to the heat sink structure. An LED based light source is mounted in the optical cavity remote to the phosphor carrier with light from the light source passing through the phosphor carrier. A diffuser dome is included that is mounted over the optical cavity, with light from the optical cavity passing through the diffuser dome. The properties of the diffuser, such as geometry, scattering properties of the scattering layer, surface roughness or smoothness, and spatial distribution of the scattering layer properties may be used to control various lamp properties such as color uniformity and light intensity distribution as a function of viewing angle.

Abstract: The present disclosure discloses a method for providing protective coatings onto an energizable LED component coupled to an electrical path. More particularly, the present disclosure relates to LED lamps comprising transparent dielectric coatings and LED lamps and devices made thereby.

Abstract: Solid state light sources, lighting devices and lamps arranged to provide emission with a warm temperature and high CRI. One embodiment of a solid state lighting device according to the present invention comprises a light emitting diode (LED) device capable of emitting light in an emission spectrum. A filter arranged so that at least some light from the LED light source passes through it, with the filter filtering at least some of one or more portions of the light source emission spectrum. The resulting light source light has a different temperature but substantially the same CRI after passing through the filter.

Abstract: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

Abstract: Solid state light sources, lighting devices and lamps arranged to provide emission with a warm temperature and high CRI. One embodiment of a solid state lighting device according to the present invention comprises a light emitting diode (LED) device capable of emitting light in an emission spectrum. A filter arranged so that at least some light from the LED light source passes through it, with the filter filtering at least some of one or more portions of the light source emission spectrum. The resulting light source light has a different temperature but substantially the same CRI after passing through the filter.

Abstract: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

Abstract: A light emitter package comprising a light emitter disposed on a surface and a primary optic comprising an encapsulant disposed over the light emitter is disclosed. The package further comprises at least one intermediate element on the surface and at least partially surrounding the light emitter such that the intermediate element at least partially defines the shape of the primary optic. The intermediate element is configured so at least a portion of the intermediate element can be removed.

Abstract: Solid state luminaires and light engines comprising a first group of solid state emitters comprising a first emitter emitting above the black body locus (BBL) in a CIE diagram, and a second emitter emitting below the BBL. The combination of light from the first and second emitters generates an emission color point within a standard deviation of the BBL. A second group of solid state emitters is included, the combination of light from the first and second groups of emitters causes emission within a standard deviation of the black body locus (BBL), wherein varying the intensity of the second group of emitters causes emission from the first and second groups of emitters to vary within a range of color temperatures while still emitting within the standard deviation of the BBL.

Abstract: Lighting fixtures are described utilizing a plurality of light sources, or light engines, which are mounted together in a modular fashion in the light fixture opening. In some embodiments, the plurality of light sources can comprise lighting panels that together form the overall fixture light source. The present invention is particularly applicable to troffer-style lighting fixtures that can be arranged with a plurality of lighting panels arranged in the troffer opening to illuminate the space below the troffer. Embodiments of the present invention can also utilize solid state light sources for the lighting panels, with some embodiments utilizing light emitting diodes (LEDs).

Abstract: A light emitter package with primary optic and method of fabricating the same is disclosed that comprises a light emitter disposed on a surface. The package further comprises at least one intermediate element on the surface and at least partially surrounding the light emitter. Furthermore, an encapsulant is over the light emitter forming a primary optic. The intermediate element at least partially defines the shape of the primary optic.

Abstract: LED based lamps and bulbs are disclosed that comprise an elevating element to arrange. LEDs above the lamp or bulb base. The elevating element can at least partially comprise a thermally conductive material. A heat sink structure is included, with the elevating element thermally coupled to the heat sink structure. A diffuser can be arranged in relation to the LEDs so at least some light from the LEDs passes through the diffuser and is dispersed into the desired emission pattern. Some lamps and bulbs utilize a heat pipe for the elevating elements, with heat from the LEDs conducting through the heat pipe to the heat sink structure where it can dissipate in the ambient. The LED lamps can include other features to aid in thermal management and to produce the desired emission pattern, such as internal optically transmissive and thermally conductive materials, and heat sinks with different heat fin arrangements.

Abstract: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

Abstract: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

Abstract: Solid state lamps and bulbs comprising different combinations and arrangements of a light source, one or more wavelength conversion materials, regions or layers which are positioned separately or remotely with respect to the light source, and a separate diffuser. These are arranged on a heat sink in a manner that allows for the fabrication of lamps and bulbs that are efficient, reliable and cost effective and can provide an essentially omni-directional emission pattern, even with a light source comprised of a co-planar arrangement of LEDs. Additionally, this arrangement allows aesthetic masking or concealment of the appearance of the conversion regions or layers when the lamp is not illuminated. Various embodiments of the invention may be used to address many of the difficulties associated with utilizing efficient solid state light sources such as LEDs in the fabrication of lamps or bulbs suitable for direct replacement of traditional incandescent bulbs.

Abstract: An indirect troffer. Embodiments of the present invention provide a troffer-style fixture that is particularly well-suited for use with solid state light sources, such as LEDs. The troffer comprises a light engine unit that is surrounded on its perimeter by a reflective pan. A back reflector defines a reflective interior surface of the light engine. To facilitate thermal dissipation, a heat sink is disposed proximate to the back reflector. A portion of the heat sink is exposed to the ambient room environment while another portion functions as a mount surface for the light sources that faces the back reflector. One or more light sources disposed along the heat sink mount surface emit light into an interior cavity where it can be mixed and/or shaped prior to emission. In some embodiments, one or more lens plates extend from the heat sink out to the back reflector.