Patents by Inventor Gerard McVicker

Gerard McVicker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230058638
    Abstract: A die stack that includes a first chip die, a second chip die connected to the first chip die by one or more controlled collapse chip connection (“C4”) solder bump bonds, and a spacer die interposed between the first and second chip dies. The spacer die includes through holes for the one or more C4 solder bumps, and has a thickness such that when the first and second chip dies are compressed into contact with the spacer die, the spacer die thickness is a minimum defined spacing between the first and second chip dies, and the spacer die operates as a hard stop against compression of the die stack after the first and second chip dies are compressed into contact with the spacer die.
    Type: Application
    Filed: August 17, 2021
    Publication date: February 23, 2023
    Inventors: David Abraham, Gerard McVicker, Sri M. Sri-Jayantha, Vijayeshwar Das Khanna, Kathryn Jessica Pooley, Ricardo Alves Donaton
  • Publication number: 20230058897
    Abstract: Embodiments of a present invention disclose an apparatus including a silicon wafer and a through-silicon-via (TSV) filled with a thermally conductive material located in the silicon wafer, wherein the thermally conductive material has better thermal conduction properties than the silicon wafer when at cryogenic temperatures. A shunt layer connected to the thermal material in the TSV and a heat generating device located directly on top of the thermal material in the TSV and directly on top of the shunt layer, wherein the heat generated by the heat generating device is removed directly by the shunt layer and the thermal material in the TSV.
    Type: Application
    Filed: August 17, 2021
    Publication date: February 23, 2023
    Inventors: David Abraham, Gerard McVicker, Sri M. Sri-Jayantha
  • Patent number: 11545415
    Abstract: Heat is transferred to a cold plate from one or more subassemblies in an array of subassemblies in an electronic package. The cold plate has a thermally conductive cold plate substrate, a pressure header, a pressure passage, and one or more pressure connections. Each of the pressure connections connects through a housing opening to housing volume defined by a flexible housing in an encapsulated liquid thermal interface (LTI). The flexible housing is in physical and thermal contact with one of the subassemblies through a housing bottom and a top surface of one or more components in the subassembly. A thermally conductive fluid fills the housing volume, housing opening, pressure connections, pressure passage, and pressure header which are all in fluid communication along with one or more other connections, housing openings, and LTIs on other subassemblies. The system transfers heat from the subassemblies to the cold plate while maintaining a constant pressure/stress on each of the subassemblies.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: January 3, 2023
    Assignee: International Business Machines Corporation
    Inventors: Sri M. Sri-Jayantha, Gerard McVicker
  • Patent number: 11276256
    Abstract: A system for identifying and reporting traffic events is presented. Position and motion data from two or more vehicles are uploaded to a data center. The system identifies an accident between first and second vehicles by correlating the motion and position information of the first vehicle with the motion and position information of the second vehicle.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: March 15, 2022
    Assignee: Airbnb, Inc.
    Inventors: Timothy J. Chainer, Gerard McVicker, Pritish R. Parida
  • Patent number: 11074831
    Abstract: A Personal Food Database (PFD) that resides on a consumer's mobile device is presented. The PFD maintains an inventory that keeps track of amount of available food items. The mobile device operating the PFD has sensors for measuring the activities or biometric data of the user. The PFD uses the sensor data to assess the nutrition need of the user and to recommend recipes accordingly.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: July 27, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy J. Chainer, Gerard McVicker, Pritish R. Parida
  • Publication number: 20210183742
    Abstract: Heat is transferred to a cold plate from one or more subassemblies in an array of subassemblies in an electronic package. The cold plate has a thermally conductive cold plate substrate, a pressure header, a pressure passage, and one or more pressure connections. Each of the pressure connections connects through a housing opening to housing volume defined by a flexible housing in an encapsulated liquid thermal interface (LTI). The flexible housing is in physical and thermal contact with one of the subassemblies through a housing bottom and a top surface of one or more components in the subassembly. A thermally conductive fluid fills the housing volume, housing opening, pressure connections, pressure passage, and pressure header which are all in fluid communication along with one or more other connections, housing openings, and LTIs on other subassemblies. The system transfers heat from the subassemblies to the cold plate while maintaining a constant pressure/stress on each of the subassemblies.
    Type: Application
    Filed: December 16, 2019
    Publication date: June 17, 2021
    Inventors: Sri M. Sri-Jayantha, Gerard McVicker
  • Patent number: 10796978
    Abstract: A heat spreading lid, including a lid body, a wing portion, where the wing portion flexibly moves independently from the lid body.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: October 6, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Gerard McVicker, Sri M. Sri-Jayantha
  • Patent number: 10607963
    Abstract: Devices that have integrated cooling structures for two-phase cooling and methods of assembly thereof are provided. In one example, a chip manifold can be affixed to a chip. An interface can be located at a first position between the chip manifold and the manifold cap. Furthermore, the interface can create a seal.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: March 31, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Thomas J. Brunschwiler, Timothy Joseph Chainer, Evan George Colgan, Michael Anthony Gaynes, Jeffrey Donald Gelorme, Gerard McVicker, Ozgur Ozsun, Pritish Ranjan Parida, Mark Delorman Schultz, Bucknell C. Webb
  • Publication number: 20190206762
    Abstract: A heat spreading lid, including a lid body, a wing portion, where the wing portion flexibly moves independently from the lid body.
    Type: Application
    Filed: February 26, 2019
    Publication date: July 4, 2019
    Inventors: Gerard McVicker, Sri M. Sri-Jayantha
  • Patent number: 10325829
    Abstract: A heat spreading lid, including a lid body, a wing portion, where the wing portion flexibly moves independently from the lid body.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: June 18, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Gerard McVicker, Sri M. Sri-Jayantha
  • Publication number: 20180076113
    Abstract: Devices that have integrated cooling structures for two-phase cooling and methods of assembly thereof are provided. In one example, a chip manifold can be affixed to a chip. An interface can be located at a first position between the chip manifold and the manifold cap. Furthermore, the interface can create a seal.
    Type: Application
    Filed: September 15, 2016
    Publication date: March 15, 2018
    Inventors: Thomas J. Brunschwiler, Timothy Joseph Chainer, Evan George Colgan, Michael Anthony Gaynes, Jeffrey Donald Gelorme, Gerard McVicker, Ozgur Ozsun, Pritish Ranjan Parida, Mark Delorman Schultz, Bucknell C. Webb
  • Publication number: 20180061151
    Abstract: A system for identifying and reporting traffic events is presented. Position and motion data from two or more vehicles are uploaded to a data center. The system identifies an accident between first and second vehicles by correlating the motion and position information of the first vehicle with the motion and position information of the second vehicle.
    Type: Application
    Filed: August 25, 2016
    Publication date: March 1, 2018
    Inventors: Timothy J. Chainer, Gerard McVicker, Pritish R. Parida
  • Publication number: 20180061270
    Abstract: A Personal Food Database (PFD) that resides on a consumer's mobile device is presented. The PFD maintains an inventory that keeps track of amount of available food items. The mobile device operating the PFD has sensors for measuring the activities or biometric data of the user. The PFD uses the sensor data to assess the nutrition need of the user and to recommend recipes accordingly.
    Type: Application
    Filed: August 25, 2016
    Publication date: March 1, 2018
    Inventors: Timothy J. Chainer, Gerard McVicker, Pritish R. Parida
  • Publication number: 20180047654
    Abstract: A heat spreading lid, including a lid body, a wing portion, where the wing portion flexibly moves independently from the lid body.
    Type: Application
    Filed: October 24, 2017
    Publication date: February 15, 2018
    Inventors: Gerard McVicker, Sri M. Sri-Jayantha
  • Patent number: 9837332
    Abstract: A heat spreading lid including a lid body and a wing portion having a thermal interface material disposed on the wing portion such that the wing portion flexibly moves with the thermal interface material independently from the lid body.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: December 5, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Gerard McVicker, Sri M. Sri-Jayantha
  • Patent number: 9830823
    Abstract: A system for identifying hazardous driving behaviors is presented. Position and motion data from a plurality of vehicles are uploaded to a data center. For each vehicle, the system computes a set of hazard metric for identifying hazardous driving behaviors based on the position and motion information received from the plurality of vehicles. A hazardous vehicle is identified based on the computed hazard metric for the plurality of vehicles. The system reports a set of information regarding the hazardous vehicle to an agency.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: November 28, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy J. Chainer, Gerard McVicker, Pritish R. Parida
  • Patent number: 9565759
    Abstract: A contact structure and assembly for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.
    Type: Grant
    Filed: April 30, 2015
    Date of Patent: February 7, 2017
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Gareth Hougham, Gerard McVicker, Xiaoxiong Gu, Sung K. Kang, Frank R. Libsch, Xiao H. Liu
  • Patent number: 9550258
    Abstract: A structure and method of mounting a heat sink having a body and mounting points configured so as to connect to a mounting medium, at least one of the mounting points being configured to allow movement in a thermally-induced expansion direction.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: January 24, 2017
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Sri M Sri-Jayantha, Gerard McVicker, Jr., Vijayeshwar D Khanna, Jr.
  • Publication number: 20160365297
    Abstract: A heat spreading lid including a lid body and a wing portion having a thermal interface material disposed on the wing portion such that the wing portion flexibly moves with the thermal interface material independently from the lid body.
    Type: Application
    Filed: May 23, 2016
    Publication date: December 15, 2016
    Inventors: Gerard McVicker, Sri M. Sri-Jayantha
  • Patent number: 9437519
    Abstract: A lid including a lid body, and a wing portion, the wing portion being disposed on a die side of the lid body such that an edge of the wing portion is flexible independent from a portion of the lid body adjacent to the edge of the wing portion.
    Type: Grant
    Filed: February 25, 2014
    Date of Patent: September 6, 2016
    Assignee: International Business Machines Corporation
    Inventors: Gerard McVicker, Sri M. Sri-Jayantha